JPS63252437A - Inspection device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to an inspection apparatus, and particularly to an inspection apparatus suitable for inspecting a semiconductor element having multiple electrodes at a fine pitch.

(Prior Art) In general, a testing device for testing the electrical characteristics of a semiconductor device such as an IC9LSI is equipped with a large number of probe needles 3 that come into contact with electrodes 2 provided on a semiconductor device 1, as shown in FIG. are used.

However, as the number of electrodes on semiconductor devices increases and becomes smaller due to the high integration of ICs, LSIs, etc., the probe needles that come into contact with these electrodes must also be miniaturized and densely packed. Problems such as needle manufacturing and adjustment are difficult and reliability is low.

In particular, when attempting to inspect a substrate having multiple electrodes at a fine pitch, such as a substrate such as a liquid crystal television screen, it is extremely difficult to do so with a conventional inspection apparatus using a probe needle.

As a technique that takes the above circumstances into consideration, for example, JP-A-61-
There are techniques disclosed in Japanese Patent Publication No. 2338, Japanese Patent Publication No. 61-14659, etc.

The former has a configuration in which the probe needle is made by patterning and wiring multiple conductive metal films such as aluminum or copper in parallel on the surface of an elastic insulating film made of soft plastic, etc. A microstrip line is provided protruding from the end and is used as a probe needle.

(Problems to be Solved by the Invention) However, the above disclosed technology has the following problems.

In both cases, when attempting to adjust the relative position between the electrode and the probe needle, it is extremely difficult to visually observe the contact status between the electrode and the probe needle, and furthermore, marks for positioning are not taken into consideration. Difficult to adjust position.

The present invention has been made in response to the above-mentioned circumstances, and aims to provide an inspection device in which alignment of an electrode and a probe needle is reliable and easy.

[Structure of the invention]

(Means for Solving the Problems) That is, the present invention provides an inspection apparatus for testing by bringing a probe needle made of a plurality of conductive wirings formed on an insulating film into contact with the tti electrode of an object to be inspected. Jsra that instructs the relative positioning of the probe needle and the above probe needle,
It is characterized in that it is provided on the above-mentioned insulating film.

(Function) In the inspection device of the present invention, alignment marks are provided on the insulating film on which the probe needles are formed, so the contact status between the electrodes of the object to be inspected and the probe needles can be adjusted while visually observing. There is no need to do so, and the relative positions of the electrode and probe needle can be set simply by aligning the mark to a predetermined position.

(Example) An example of the inspection apparatus of the present invention will be described below with reference to the drawings.

In FIG. 1, on the lower surface of a mounting plate 11 made of, for example, a glass epoxy board, there is a see-through insulating material made of patterned copper foil or the like and configured to sandwich a plurality of conductive wirings 12 used as probe needles. Films 13 such as F, P, and C are fixed by adhesive or other means.

This insulating film 13 is bent downward at an approximately right angle at the end 14 of the mounting plate 11, and the lower part is made of elastic material such as insulating rubber, which is formed into a circular shape. It is attached along the outer periphery of a spring material 15, such as one provided with a ring.

Then, the end portion 16 of the insulating film 13 is bent, and the end portion 16 is attached to the mounting plate 11 by the fixing plate 17 so as to be pressed.

In addition, the circular lowest part of the insulating film 13 attached to the spring material 15, that is, the semiconductor element 1 which is the object to be inspected.
For example, a key-shaped shape force indicator 21 is provided at a contact portion 20 with the electrode 19 formed on the surface of the electrode 8 . Then, by accurately overlapping this marker 21 with, for example, a key-shaped Bra 22 provided on the semiconductor substrate 18, the positions of the conductive wiring 12 used as a probe needle and the electrode 19 are adjusted.

Next, a method of manufacturing this inspection device will be explained.

As shown in FIG. 2, one end of the insulating film 13 is fixed to the lower surface of the mounting plate 11, and the other end is fixed to the fixing plate 17. Here, the insulating film 13 is not formed in the notch part 23 near the part that will become the contact part 20, so that the conductive wiring 12 is exposed, and the r1 dimension of the insulating film 13 is as follows. For example, the fixing plate 17 side of the mounting plate 11 is configured to be wider than the end 14 side, and a marker 21 in the shape of, for example, a key is provided near the outside of the insulating film 13 located at the contact portion 20.

Then, as shown in FIG. 3(b), the insulating film 13 is bent downward at approximately right angles near the end 14 and attached so as to follow the outer periphery of the spring material 15. Next, the fixing plate 17 The insulating film 13 is bent at a portion, the mounting plate 11 and the fixing plate 17 are suppressed, and the mounting plate 11 and the fixing plate 17 are fixed, for example, to the mounting holes 24 with bolts (not shown) or the like.

Here, when looking at one inspection device from above, Figure 3 (a)
As shown, contact portions 20 on both sides of the insulating film 13
A key-shaped mark 21 can be visually confirmed at the position.

Therefore, if the positions are adjusted so that this mark fi21 and the mark fi22 provided on the semiconductor element 18 overlap,
Contact portion 2o of conductive wiring 12 and electrode 1 serving as a probe needle
9 can be positioned.

Incidentally, in the above embodiment, a key-shaped sign was used as the sign 21, but this sign? g12
1 is not limited to the shape of a key, but may be any other mark such as a cross, a 7-character, an arc, etc., as long as it can be positioned, and a large number of marks may be provided. Furthermore, it goes without saying that the insulating film 13 is not limited to one that can be seen through, but may be opaque as long as it can be positioned using the mark 21 described above.

〔Effect of the invention〕

As described above, according to the present invention, even when inspecting a semiconductor device having multiple electrodes at a fine pitch, the electrodes and the probe needle can be easily and reliably aligned.

[Brief explanation of the drawing]

FIG. 1 is an explanatory perspective view of one embodiment of the present invention, and FIG.
)(b) and FIGS. 3(a) and 3(b) are explanatory diagrams of the manufacturing and assembly example of FIG. 1, and FIG. 4 is an explanatory diagram of the conventional example. 1191. Mounting plate, 1z... Conductive wiring, 1
3... Insulating film, 15... Spring material, 20...
・Contact part, 21... mark. Patent applicant Tokyo Electron Ltd. Figure 3

Claims (1)

[Scope of Claims] In an inspection device that performs an inspection by bringing a probe needle made of a plurality of conductive wirings formed on an insulating film into contact with an electrode of an object to be inspected, the relative positioning of the electrode and the probe needle is provided. An inspection device characterized in that a mark indicating the above is provided on the insulating film.