JPS632557A - Injection type soldering device - Google Patents

Abstract

PURPOSE:To effectively perform a degassing for improvement of a quality by performing a soldering with giving a small vibration by the exciting mechanism arranged at the upper part of a solder jet nozzle and abutting to a printed circuit board. CONSTITUTION:When a printed circuit board P is reached a nozzle 22, the tip of the vibration rod 33 of an exciting mechanism 31 is descended and abutted to the upper face of the board P. A mechanical small vibration is transmitted to the board P via the vibration rod 33 from a vibrator 32. The gas retaining on the lower face of the board P is flowed together with the solder by giving small vibration. The quality can be increased by the device of this composition.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a jet soldering device for soldering board-mounted chip components and the like to a printed wiring board.

(Prior Art) Conventionally, as shown in Japanese Unexamined Patent Application Publication No. 58-61962, a perforated plate is provided at the jet port of the nozzle of a jet solder tank, and a large number of molten solder is ejected from a large number of molten solder spout holes provided in the perforated plate. By ejecting a protruding jet wave, the wave of the jet solder is forcibly disturbed, giving an impact to the flux gas etc. that is stable in the gaps between chip parts, and pushing this gas away from the supporting position. The gas is removed by letting it out.

(Problems to be Solved by the Invention) This conventional jet-type soldering device maintains gas stability in the gaps between the chip components by disturbing the jet solder waves jetted from the jetting holes of the perforated plate. Although degassing is performed from the beginning, degassing cannot be performed effectively unless the protruding jet waves ejected from the ejection holes of the perforated plate truly enter the gas stabilizing gap.

An object of the present invention is to make it possible to effectively vent gas from the bottom surface of a printed wiring board using extremely simple means.

[Structure of the invention]

(Means for Solving the Problems) The present invention provides print distribution I! i1 In a jet soldering apparatus that performs soldering by supplying molten solder S jetted from a nozzle 16 to the lower surface of the substrate P, the nozzle 1
A vibrating mechanism 31 is disposed above the printed wiring board P so as to contact the printed wiring board P and apply minute vibrations to the printed wiring board P.

(Function) The present invention mechanically transmits minute vibrations from the vibrating mechanism 31 to the printed wiring board P to forcibly vibrate the board P, thereby bringing the bottom surface of the board P into a stable position. Eliminates soldering defects caused by gas by expelling gas that easily accumulates.

(Examples) Hereinafter, the present invention will be described in detail with reference to examples shown in the drawings.

As shown in FIG. 2, a partition plate 12 is provided inside the jet solder bath 11, and a pump blade 14 is provided below the solder suction port 13 bored in the partition plate 12. A nozzle 16 is provided upright above a solder supply port 15 formed in another portion of the partition plate 12 . A heater 17 is provided at the bottom of the solder bath 17.
7 melts the solder in the solder bath 11, and an oxide removal plate 18 is provided vertically above the solder bath 11. The pump blade 14 is connected to the solder bath 11
It is rotationally driven by a motor 19 provided externally.

Then, the molten solder S in the solder bath 11 is pumped from the suction port 13 to the supply port 15 by the action of the pump blade 14, rises inside the nozzle 16, and is jetted out from the upper end opening of the nozzle 16. Furthermore, it passes under the oxide removal plate 18 and is circulated to the suction port 13 .

As shown in FIG. 1, a chip nozzle 22 and a lead nozzle 23 are formed separately at the upper end of the nozzle 16 by a flow dividing plate 21. A perforated plate 24 is provided at the upper end opening of the chip nozzle 22, and a large number of small molten solder ejection holes 25 are bored in the perforated plate 24.

Then, the molten solder ejected from the large number of ejection holes 257]1 of the perforated plate 24 becomes a large number of protruding jet waves, and these protruding jet waves mainly form the chip components bonded to the lower surface of the printed wiring board P. Solder the electrode E of W1 and the conductive surface of the substrate. Sl is the lυ attachment part. Further, the molten solder jetted from the lead nozzle 23 is
Mainly, the leads L of the lead component W2 mounted on the upper surface of the printed wiring board P and the conductive surface of the board are soldered.

Sl is the soldered part.

Next, an excitation mechanism 31 is disposed at a fixed position above the nozzle 16 in contact with the printed wiring board P to give a minute motion to the printed wiring board P. This excitation v1 structure 31 includes a vibrator 3 as a vibration generation source.
2, and the vibration generated by this vibrator 32 is transmitted to the substrate P.
and a vibration rod 33 that transmits the vibration to the substrate P.
The sharpener is in the raised position, and when the substrate P is detected on the nozzle 22, it is lowered and comes into contact with the substrate P. then,
The bulb position that is out of the movement path of all lead parts W2 (
For example, the vibrating rod 33 is set to come into contact with a dead space of a printed wiring board, etc.).

Then, the printed wiring board P is transported in an upwardly inclined manner.
reaches above the nozzle 22, the vibration mechanism 31
The tip of the vibrating rod 33 lowers and contacts the top surface of the board P, and minute mechanical vibrations are transmitted from the vibrator 32 to the printed wiring board P via the vibrating rod 33, causing the printed wiring board P to vibrate. The solder is soldered by the molten solder jetted from the nozzles 22 and 23.

In this way, from the vibration mechanism 31 to the printed wiring board P
By applying minute vibrations to the substrate P, the flux gas that tends to accumulate in a stable gas position on the bottom surface of the substrate P (for example, the recess between the electrode E of the chip component W1 and the substrate surface) becomes unstable and becomes a jet. It flows away together with the solder, preventing soldering defects caused by this gas.

〔Effect of the invention〕

According to the present invention, since an excitation mechanism is disposed above the nozzle that contacts the printed wiring board and gives minute vibrations to the printed wiring board, this vibration mechanism causes the printed wiring board itself on the gas adhering side to By applying gluteus mechanical vibration,
Gas that tends to stay in gaps between components on the lower surface of the board can be effectively evacuated, and soldering defects caused by this gas can be eliminated. Furthermore, since the vibration compensation mechanism is in direct contact with each other, there is an advantage that the configuration of the vibration mechanism is extremely simple.

ff of 46 drawings! BRIEF DESCRIPTION FIG. 1 is a sectional view showing an embodiment of the jet soldering apparatus of the present invention, and FIG. 2 is a sectional view of a jet soldering bath.

P...Printed wiring board, S...molten solder, 16...
Nozzle, 31... Vibration hall structure.

Heat 2■

Claims (1)

[Claims] (1) In a jet soldering device that performs soldering by supplying molten solder jetted from a nozzle to the bottom surface of a printed wiring board, a portion above the nozzle contacts the printed wiring board and is attached to the printed wiring board. A jet soldering device characterized by being equipped with an excitation mechanism that gives minute vibrations.