JPS6325742Y2 - - Google Patents

Description

[Detailed explanation of the invention] This invention is a threaded part (bolt) for mounting the cooling fin.
The present invention relates to a structure of a cooling fin for a semiconductor device.

This will be explained below with reference to the drawings.

Figures 1a and 1b are cross-sectional views of this type of conventional fin (the figure shows the state in which a semiconductor device is attached). Part 1b,
1c is a screw cut portion for mounting a semiconductor device, hole 2 is a semiconductor device such as a diode or thyristor, 2a, 2b
3 is a screw portion (bolt) and a lead wire for fixing the cooling fin of the semiconductor device 2, and 3 is a nut (hexagonal).
In the conventional fin having such a structure, the former (Fig. a) has a structure in which the semiconductor device 2 can be easily replaced (attached and removed) because the semiconductor device 2 can be attached and detached from the front (one side) of the fixed portion 1a of the cooling fin 1. However, since the thickness s of the fixing part 1a of the cooling fin 1 is longer than the length of the screw part 2a of the semiconductor device 2, it must be made thicker than necessary (generally, the thickness of the fixing part depends on the mounting strength of the semiconductor device). )
Not only does the cooling fin 1 become heavier and more expensive, but also the fixing portion 1a requires thread cutting, which increases the material processing cost, both of which have the disadvantage of increasing the price. On the other hand, the latter (Figure b) eliminates the above-mentioned drawbacks and can be formed at low cost. However, on the other hand, the semiconductor device 2 cannot be attached or detached only from the front side of the fixing part 1a, and there is a nut 3 on the opposite side (back side). This must be done from both sides, such as by providing holding means. In particular, cooling fins must be installed in advance on electrical equipment casings that have mounting frames (angles) for various electrical components installed vertically and horizontally, and the cooling fins must be installed vertically or horizontally. In the case where a plurality of semiconductor devices are arranged with a hole, it is not possible to hold the nut 3 by one person, and it is often necessary to receive assistance from another person. Furthermore, there are drawbacks such as the difficulty of holding the nut 3 within the housing, poor workability, and the need for a large number of man-hours to replace the semiconductor device. The present invention solves the above-mentioned drawbacks at once, and provides a cooling fin that is lightweight and inexpensive, and allows easy replacement of semiconductor devices. That is, the present invention allows the screw portion of the semiconductor device to pass through the semiconductor device fixing portion of the cooling fin,
In a cooling fin for a semiconductor device configured to fix the semiconductor device with a nut, a bag-shaped groove for inserting the nut is provided on the protruding surface of the threaded part of the semiconductor device fixing part, and the nut rotates in the bag-shaped groove. The nut is set within a range in which the nut does not move, and a nut fall prevention portion is provided at one end of the bag-shaped groove. FIGS. 2a, 2b, and 2c are top, front, and side views showing the structure of an embodiment of the present invention, in which the same reference numerals as in the conventional example indicate equivalent parts. In the figure 1
d is a wing portion of the cooling fin 1, and 1e is a projecting plate connected to the wing portion 1d, which forms a plane parallel to the semiconductor device fixing portion 1a. 1f and 1f' are a gap portion and a narrow groove portion for forming a falling prevention portion of a semiconductor device, which will be described later, and 4 is a screw portion protruding surface and a wing portion 1 through a hole 1c of a fixing portion 1a.
d and the projecting plate 1d, the groove width d is within the range in which the nut 3 does not rotate, that is, the range that slightly exceeds the length between the two opposing sides of the nut 3. In addition, the groove height h is also set within a range that slightly exceeds the height of the nut 3. Next, the operation of fixing a semiconductor device to the fin of the present invention having the above structure will be explained using FIGS. 3a, b, and c. Figure A is a top view of the semiconductor device 2 in a fixed state, Figure B is a sectional view taken along line xx' in Figure A, and Figure C is a side view of the same figure. The nut 6 is loosely connected in advance and inserted through the gap 1f. (In addition,
The narrow groove 1f' has a groove width slightly larger than the two opposing sides of the nut 6, and is set within a range in which the nut 6 does not rotate within the narrow groove 1f'. ) When the fixing nut 3 of the semiconductor device 2 is inserted, the screw 5 is tightened by pinching the projecting plate 1e at a position where the nut 3 is almost opposite the fixing hole 1c, so that the tip 5' of the screw 5 is tightened to the nut 3. Fix it so that it reaches the side 3' of. Next Natsuto 3
is inserted into the bag-shaped groove 4 with its opposing two side parts 3'', 3 parallel to the wing part 1d.The bottom part of the cooling fin 1 is in the vertical direction between the wing parts 1d and 1d. In order to be installed as shown in FIG.
It is held at a position where it comes into contact with the tip 5' of the screw 5. Therefore, the nut 3 is held in the bag-shaped groove 4 at a position substantially opposite to the hole 1c of the fixing part 1a in a state where its rotation is prevented, and the semiconductor device 2 is attached to the fixing part 1a of the fin 1. This can be easily carried out by inserting the threaded part 2a from one side, bringing it into contact with the nut 3, and tightening it, and it can also be easily removed from the same side. As described above, according to the present invention, the thickness of the semiconductor device fixing portion 1a is the same as that of the semiconductor device 2.
Since it is sufficient to have a mounting strength of , it can be made extremely thinner than the conventional example (FIG. 1a), and the weight of the material can be reduced without impairing the heat dissipation effect, making it possible to achieve a significant reduction in material costs.

Since the hole 1c of the fixing part 1a may be a simple hole that does not require thread cutting, the number of processing steps can be reduced.

Since the mounting and dismounting of the semiconductor device can be carried out more easily and easily than on one side without using both sides of the cooling fin, the mounting and dismounting efficiency can be greatly improved. In particular, when attaching multiple semiconductor devices to one cooling fin, place the screws 5 in advance at the required positions on the fixed part of the cooling fin.
If the nuts 6 and screws 3 are set as one set and set upward in sequence, there is a great advantage that the cooling fin can be easily attached and detached by one worker while it is attached to the electrical equipment casing. .

The part that prevents the nut 3 from falling is the screw 5 in the middle part 1f.
Since it is only necessary to insert the nut 6 and fix it at a required position, when a plurality of semiconductor devices are to be fixed, the installation interval can be arbitrarily set depending on the shape of the device.

The bag-shaped groove can be formed simultaneously with the wing portion, the fixing portion, etc. by a so-called drawing process, so that manufacturing is easy.

There are advantages such as

In the above embodiment, an example was explained in which the groove width d of the bag-shaped groove 4 was set in advance within a range in which the nut 3 does not rotate. As shown in the bag-shaped groove 4, the protrusion 1
d' etc., and the distance d' between the protrusions 1d' is set to the nut 3.
The rotation prevention portion may be formed by setting the rotation prevention portion to a range where the rotation does not occur.

FIG. 4 is a perspective view showing the structure of another embodiment of the present invention, and the difference from the above embodiment is that no gap is provided on the upper surface of the bag-shaped groove 4, that is, the projecting plate 1g is connected to the wing portion 1d. are integrally formed to form a bag-shaped groove 4, and to prevent the nut 3 from falling, a hole 1h is provided in the fixing part 1a at the same time as the hole 1c is formed, and a projecting body is inserted and fixed into the hole 1h (Fig. (not shown), or the hole 1h may be provided on the projecting plate 1g side.

As is clear from the above description, according to the present invention, a semiconductor device can be easily attached and detached, and an inexpensive cooling fin can be provided, so that the present invention has great practical effects.

[Brief explanation of drawings]

FIG. 1 is a conventional structural diagram, FIGS. 2 and 3 are structural diagrams of one embodiment of the present invention and an explanatory diagram of mounting a semiconductor device, and FIG. 4 is a structural diagram of another embodiment of the present invention. In the figure, 1 is a cooling fin, 1a and s are a semiconductor device fixing part and its thickness, 1b and 1c are threaded parts and holes for mounting, 1d is a wing part, 1d' is a protrusion, 1e and 1g are veneers, 1f and 1f ' is the gap and narrow groove, 1h is the hole,
2, 2a, 2b are semiconductor devices, screw parts (bolts)
and lead wire, 3 is a nut, 3', 3'', 3 is a side part, 4 is a bag-shaped groove, d, d' is a width, h is a height, 5 is a screw, 5' is a tip part, 6 is a nut It is.

Claims (1)

[Claims for Utility Model Registration] (1) A cooling fin for a semiconductor device configured such that a threaded portion of the semiconductor device passes through a semiconductor device fixing portion of the cooling fin and the semiconductor device is fixed with a nut, in which the semiconductor device is fixed. A cooling fin for a semiconductor device, characterized in that a bag-shaped groove for inserting a nut is provided on the protruding surface of the threaded part of the fixing part, and the bag-shaped groove is set in a range in which the nut does not rotate. (2) Claim No. 1 for utility model registration, which is characterized in that a nut fall prevention part is provided at one end of the bag-shaped groove.
A cooling fin for a semiconductor device as described in 2.