JPS63272000A - Electronic component supply method and device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention provides a method for automatically mounting electronic components stored in sticks, which is a common packaging method for electronic components.
This invention relates to an electronic component supply device that supplies electronic components one by one.

BACKGROUND OF THE INVENTION The field of surface mounting electronic components has seen remarkable growth in recent years due to its high packaging density and cost advantage. In order to reduce mounting costs, there is a need to shorten the mounting takt time, and at the same time, there is a need for mounting machines that can handle a wide variety of component packaging styles. Among them, surface mounting of components stored in sticks was supplied in a conventional manner.

A conventional electronic component supply unit will be described below with reference to the drawings. FIG. 8 is a front view of a conventional electronic component supply section. The electronic component 102 housed in the stick 1o1 flows through the inclined chute 103 and reaches the tip 104. Tip part 1
04, a stopper 105 prevents the electronic component 102 from falling. 106 is a holding part and a sliding guide 107
It can be moved left and right in the figure by the drive unit 108.

When holding the electronic component 102, the holding section 106 moves to the position B in the figure. The holding portion 108 swings about the fulcrum 110 as the roller 1o8 runs on the cam 109, and matches the inclination of the inclined chute 1o3. At this time, the stopper 106 opens and holds one electronic component at the most extreme position on the inclined chute 103. Holding part 106
is moved by the drive unit 107 to point A in the figure, and provides the electronic component 102 to the automatic mounting machine. Reference numeral 111 is a frame for the entire supply device.

Problems to be Solved by the Invention In the above configuration, since the supply device includes a dedicated drive section, there are restrictions on miniaturization and cost reduction of the device. In addition, since the supply device is attached to a dedicated pedestal, for example, when considering mixed loading with a taping-type supply section,
Since each requires its own stand, there are significant restrictions on the number of units that can be prepared for mixed mounting within the limited space of the mounting machine. Furthermore, since it has a dedicated drive source, the control for controlling the drive is also dedicated, making it impossible to mix it with other supply formats.

Means for Solving the Problems In order to solve the above-mentioned problems, the electronic component feeding device of the present invention includes a holder for holding a stick containing electronic components, and a holder for holding a stick containing electronic components, and an array of electronic components that come out from the stick. an inclined chute section through which the current flows, a separating section that separates only the most advanced electronic components in the inclined chute, a component holding section that holds the separated electronic components, and a swinging section that swings the component holding section to a horizontal position. Consisting of a first drive unit that drives the swinging unit, a shutter unit that prevents the electronic component from flying out while the component holding unit is swinging, and a second drive unit that opens and closes the shutter unit when taking out the electronic component. The structure is as follows. Furthermore, the first
The parts other than the drive part and the second drive part are integrated and can be attached and detached from the electronic component mounting machine, and the first drive part and the second drive part are connected to the taped electronic component supply device. It has a configuration in which it is shared with the feed drive and the adhesive tape peeling drive.

Function: The electronic component supply device of the present invention having the above-described configuration has the following features:
Since it does not have a dedicated drive source and can be driven with a limited stroke, it is possible to use the same drive source as the taping-type supply section, which is a common electronic component supply method. Also,
The structure of the device is simple, and the supply part is integrated and detachable.
The installation space of the taping type supply section can be used, so there is no need to prepare a special installation space. Therefore, it is possible to mix the taping type supply section with the same installation space.
As a mounting machine, supply parts can be freely combined within a limited space, and one machine can handle a wide range of supply formats. Further, since a dedicated drive source and drive timing are not required, and a dedicated control unit is also not required, it is possible to provide an inexpensive and responsive component supply device.

EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings. FIG. 3 is an overall view of the electronic component mounting machine. Reference numeral 1 denotes a head section, which attracts electronic components and mounts them onto a printed circuit board 2. 3. 4. 5 is an electronic component supply device;
4 is a supply device for electronic components stored in a stick, 4 is a supply device for taped electronic components, and 6 is a supply device for electronic components stored in a tray. This embodiment deals with a supply device for electronic components housed in a stick. FIG. 4A is an overall view of the stick 6.

FIG. 4B is a sectional view of the electronic component 7 housed in the stick 6. The electronic components 7 are arranged in a line within the stick e.

FIG. 1 is a front view of one embodiment of the present invention. A stick 6 stores electronic components 7 in an array, and is held by a stick holder 8.

Reference numeral 9 denotes an inclined chute which guides the electronic components 7 flowing out from the stick 6 and allows the electronic components 7 to flow to the chute tip 1o by its own weight. Figure 2 shows a cross-sectional view of the inclined chute. 11 is a cross section of the inclined chute, and 7 is an electronic component. The chute tip 1o has a separating section 12 that separates only the most advanced electronic component among the aligned electronic components, and a component holding section 13 that holds the separated electronic component. FIG. 5 is a detailed view of the separation section at the tip of the chute.

Reference numeral 14 denotes a lever, which swings around a fulcrum 15. The separation claw 16 is fixed to the lever 14, and when it swings, it removes the most advanced electronic component 17 present inside the chute tip 10.
and the second electronic component 18 to separate the other component. As a result, only the most advanced electronic component 17 is allowed to flow to the next process, while the second electronic component 18 and subsequent components are held in the chute. FIG. 6 is a detailed view of the component holding section. 1
Reference numeral 3 denotes a component holding section, which holds the separated state-of-the-art electronic component 17, as shown in FIG. Component holding part 13
is fixed to a swinging portion 20 that swings around a fulcrum 19. The swinging part 2o has an inclined position 21 and a horizontal position 22.
oscillate between. The drive source for this swing is the first drive unit 23
This drives the lever 24 when it strokes from A to B in the figure. A pin 26 fixed to the swinging part 20 is guided by an elongated hole 26 provided in the lever 24 and swings about the fulcrum 19, thereby driving the swinging part 20. With this configuration, the swinging stroke of the swinging section 20 can be increased compared to the limited stroke of the first drive section 23.

The component holder 13 is provided with a shutter 27 to prevent the electronic component 7 from flying out when the component holder 13 swings from the inclined position to the horizontal position. When the electronic component mounter picks up the electronic component 7, the lever 28 holding the shutter 27 is driven by the second driving section 3o via the link 29, so that the shutter 2
7 moves for a certain stroke and moves from the top surface of the electronic component 7.

Now, in the taping method, which is the most common form of supplying components to automatic mounting machines, there is a first drive unit for feeding the taped components one pitch, and an adhesive on the back side of the taped components supplied with 32-length paper tape. and a second drive unit that drives the tape peeling operation. The timing chart of these two driving sources in the automatic mounting machine is as shown in FIG. 7, including the movement of the suction head by which the mounting machine picks up the supplied components.

Here, the first
Since the drive section 23 and the second drive section 3o do not need to be provided inside the electronic component supply section, it is possible to use exactly the same drive as the two drive sections of the taping component supply section described above. Furthermore, when the movement of the suction head is included, the pitch feeding drive of the first drive unit 23 and the component is controlled by the second drive unit 30.
Since the foil drive and the back tape can be driven at exactly the same timing, the drive control section is also exactly the same.

Furthermore, since the drive unit is placed separately, the electronic component supply unit of the present invention has a simple structure, and all parts other than the drive unit can be integrated, so it is illegal to attach the supply unit to the conventional taping unit. The positioning method using the pins 31 and 32 and the fixing method using the clamper 33 shown in FIG. 1 can be used as is, and no special mounting base is required.

Effects of the Invention As described above, the electronic component feeding device of the present invention does not have a dedicated drive source and can be driven with a limited stroke, so it is possible to supply electronic components using the taping method, which is a common electronic component feeding method. The parts and drive source could be made the same. Furthermore, since the device has a simple structure and the supply section is integral and removable, the mounting base of the taping-type supply section can be used, eliminating the need to prepare a special mounting base. Therefore, it is possible to mix supply units with taping type on the same mounting base, so it is possible to freely combine supply units within a limited space as a mounting machine, and one machine can support a wide range of supply formats. It became. Further, since a dedicated drive source and drive timing are not required, and a dedicated control unit is also not required, it is possible to provide an inexpensive and responsive component supply device.

[Brief explanation of the drawing]

FIG. 1 is a front view of an electronic component supply device according to an embodiment of the present invention, FIG. 2 is a sectional view of an inclined chute, FIG. 3 is a perspective view of an electronic component mounting machine, and FIG. 4A is a perspective view of a stick. ,
FIG. 4B is a sectional view of the same, FIG. 6 is a front view of the separating section, FIG. 6 is a front view of the component holding section, FIG. 7 is a timing chart,
FIG. 8 is a front view of a conventional electronic component supply section. 6...Stick, 7...Electronic parts,
9... Inclined chute, 1o... Chute tip, 12... Separation part, 13...
Component holding part, 2o... Swinging part, 23...
・First drive unit, 27...Shutter, 3°・
...Second driving section. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure @ Figure 2 Figure 4 (c) (3) Figure 5 Figure 6

Claims (2)

[Claims] (1) Take out the electronic components one by one from the stick containing multiple electronic components through the inclined chute section, and bring the electronic components to a horizontal position using the component holding section that has a shutter to prevent the electronic components from flying out. A first component supplying method in which electronic components are moved, and a second component supplying method in which electronic components having an adhesive tape on the base and taped with this adhesive tape are supplied to predetermined positions one by one.
The driving method for opening and closing the shutter of the component holding section and the driving method for moving the component holding section to a horizontal position in the second component feeding method are the same as the driving method for removing the adhesive tape from the base in the second component feeding method, and the driving method for removing one component from the base. This is a method of supplying electronic components that is in contrast to a drive method that feeds out parts at a time. (2) Separate only the holder that holds the stick containing electronic components, the inclined chute section provided at an angle so that the electronic components from the stick can pass through, and the most advanced electronic component of this inclined chute section. a component holding section that holds the separated electronic component; a swinging section that swings the component holding section to a horizontal position; a first driving section that drives the swinging section;
An electronic component supply device comprising a shutter section that prevents electronic components from flying out during swinging of a component holding section, and a second drive section that opens and closes the shutter section when taking out electronic components.