JPS63286582A - ニッケルおよび燐含有三元合金の無電解めっき方法 - Google Patents

ニッケルおよび燐含有三元合金の無電解めっき方法

Info

Publication number
JPS63286582A
JPS63286582A JP10375288A JP10375288A JPS63286582A JP S63286582 A JPS63286582 A JP S63286582A JP 10375288 A JP10375288 A JP 10375288A JP 10375288 A JP10375288 A JP 10375288A JP S63286582 A JPS63286582 A JP S63286582A
Authority
JP
Japan
Prior art keywords
aqueous solution
ternary alloy
alloy plating
plating
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10375288A
Other languages
English (en)
Japanese (ja)
Inventor
ホルスト・デーゲン
クラウス・シャールヴェッヒター
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gerhard Collardin GmbH
Original Assignee
Gerhard Collardin GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gerhard Collardin GmbH filed Critical Gerhard Collardin GmbH
Publication of JPS63286582A publication Critical patent/JPS63286582A/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48Coating with alloys
    • C23C18/50Coating with alloys with alloys based on iron, cobalt or nickel

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP10375288A 1987-04-24 1988-04-25 ニッケルおよび燐含有三元合金の無電解めっき方法 Pending JPS63286582A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19873713734 DE3713734A1 (de) 1987-04-24 1987-04-24 Verfahren zur aussenstromlosen abscheidung von ternaeren, nickel und phosphor enthaltenden legierungen
DE3713734.4 1987-04-24

Publications (1)

Publication Number Publication Date
JPS63286582A true JPS63286582A (ja) 1988-11-24

Family

ID=6326216

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10375288A Pending JPS63286582A (ja) 1987-04-24 1988-04-25 ニッケルおよび燐含有三元合金の無電解めっき方法

Country Status (3)

Country Link
EP (1) EP0289838A3 (de)
JP (1) JPS63286582A (de)
DE (1) DE3713734A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010128809A3 (ko) * 2009-05-06 2011-03-03 한국생산기술연구원 니켈-인-텅스텐 삼원합금 무전해 도금액, 이를 이용한 무전해 도금 공정 및 이에 의해 제조된 니켈-인-텅스텐 삼원합금피막

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2178146C (en) * 1995-06-06 2002-01-15 Mark W. Zitko Electroless nickel cobalt phosphorous composition and plating process
CN107523816B (zh) * 2017-08-23 2019-08-27 广东光华科技股份有限公司 化学镀镍磷镀液
JP7014554B2 (ja) * 2017-09-25 2022-02-01 株式会社リケン 摺動部材

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1162159B (de) * 1954-12-29 1964-01-30 Gen Am Transport Verfahren zum chemischen Vernickeln
US3202529A (en) * 1962-08-08 1965-08-24 Sperry Rand Corp Disposition of nickel-cobalt alloy on aluminum substrates
GB1129984A (en) * 1964-10-30 1968-10-09 Usa Electroless deposition of nickel-phosphorus alloys
US3378400A (en) * 1965-07-30 1968-04-16 Ralph E. Sickles Autocatalytic deposition of nickel, cobalt and alloys thereof
JPS60258473A (ja) * 1984-06-06 1985-12-20 C Uyemura & Co Ltd 耐食性皮膜の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010128809A3 (ko) * 2009-05-06 2011-03-03 한국생산기술연구원 니켈-인-텅스텐 삼원합금 무전해 도금액, 이를 이용한 무전해 도금 공정 및 이에 의해 제조된 니켈-인-텅스텐 삼원합금피막
KR101092667B1 (ko) * 2009-05-06 2011-12-13 한국생산기술연구원 니켈-인-텅스텐 삼원합금 무전해 도금액, 이를 이용한 무전해 도금 공정 및 이에 의해 제조된 니켈-인-텅스텐 삼원합금피막

Also Published As

Publication number Publication date
DE3713734A1 (de) 1988-11-17
EP0289838A3 (de) 1989-11-08
EP0289838A2 (de) 1988-11-09

Similar Documents

Publication Publication Date Title
US5614003A (en) Method for producing electroless polyalloys
US4374876A (en) Process for the immersion deposition of gold
US8585811B2 (en) Electroless nickel alloy plating bath and process for depositing thereof
EP2494094B1 (de) Zinn-silber-tauchplattierung bei der herstellung von elektronik
US2891871A (en) Tin immersion plating composition and process for using the same
JPH0319308B2 (de)
US5130168A (en) Electroless gold plating bath and method of using same
US3423214A (en) Magnetic cobalt and cobalt alloy plating bath and process
JPS63286582A (ja) ニッケルおよび燐含有三元合金の無電解めっき方法
JPH0436498A (ja) 鉄鋼線材の表面処理方法
NL8200774A (nl) Samenstellingen voor het electrolytisch bekleden van metalen alsmede werkwijze voor het toepassen van deze samenstellingen.
JPS5845368A (ja) 引張応力が減少した無電解めつき
US4035249A (en) Electrode position of tin-containing alloys and bath therefor
US5494710A (en) Electroless nickel baths for enhancing hardness
KR20130044661A (ko) 무전해 니켈-인 도금액 및 이를 이용한 도금방법
CN111485262A (zh) 铟电镀组合物和在镍上电镀铟的方法
US3930081A (en) Composition and process for displacement plating of zinc surfaces
JP3035676B2 (ja) 亜鉛−アルミニウム合金への無電解ニッケルめっき方法、触媒化処理用組成物、活性化処理用組成物及び無電解ニッケルストライクめっき用組成物
JP6426203B2 (ja) 高リン無電解ニッケル
JP6218473B2 (ja) 無電解Ni−P−Snめっき液
JPH031383B2 (de)
KR102591174B1 (ko) 저열팽창 계수를 갖는 철-니켈 합금용 전기 도금액 및 이것을 사용한 전기 도금 방법
JPH0742588B2 (ja) 黒色無電解ニッケル―リン合金皮膜の形成方法
JPH05222568A (ja) メッキ液組成物
CN113463146A (zh) 一种用于金属工具表面的电镀液及电镀工艺