JPS63307796A - thermocompression bonding equipment - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thermocompression bonding device, and particularly to the structure of a heating/pressing head portion of the device.

[Conventional technology]

In the structure of thermal recording heads and contact type licensors that aim for miniaturization and high-density packaging, it is conventional to use a flexible printed board (hereinafter referred to as FPC) on which a fine pattern is formed on a patterned ceramic or glass substrate. Regarding the method of mounting a thermal head (thermal head) by soldering using a thermocompression bonding device, please refer to Japanese Patent Application Laid-Open No. 60-1073.
This is exactly as stated in Publication No. 63.

As shown in FIG. 2, the above mounting method involves aligning each pattern of the substrate 2 on which a pattern (not shown) is formed and the FPC 5 on which a fine pattern (not shown) is formed. By lowering the head part 1, which has a planar end surface 1A, in a heated state and pressurizing the FPC 5, the solder 4 at the connection part melts and the board 2 and FPC 3 are heated.
This is a method in which the head part 1 is cooled to solidify the molten solder 4, and then the head part 1 is raised to complete the soldering between the board 2 and the F'PC 3.

[Problem that the invention seeks to solve]

In the above conventional example, since the end surface 1A of the heating/pressing head section 1 is formed in a flat shape, the FPC 5 is pressed onto the substrate 2 through the soldering section 4 by heating/pressing the head section 1. In this case, the pattern of F'PC3, that is, the solder plating of normal Cu foil, is damaged near the end 2A of the board 2, and in the worst case, a broken FPC pattern 5 occurs as shown in FIG. There was a problem.

In addition, if the solder portion 4 is not thick enough to a certain extent, the solder portion will peel off during an environmental test such as a temperature cycle test, resulting in a decrease in reliability.

The present invention prevents breakage of the FPC pattern near the edge of the substrate when soldering the FPC to the substrate by heating and pressurizing the head part, and also makes it possible to increase the thickness of the solder near the edge of the substrate. The purpose is to provide a thermocompression bonding device that can

[Means for solving problems]

The above problem can be solved by forming the pressing end of the head section of the thermocompression bonding device capable of heating and pressurizing into a curved shape.

[Effect]

After aligning the pattern on the substrate side and the pattern on the FPC side, the heated head section is lowered onto the FPC and pressurized to heat and melt the solder at the connection section to perform soldering.

In this case, since the pressing end of the head section is formed into a curved shape, it is possible to prevent the KFPC pattern from breaking near the edge of the substrate when applying pressure, and to increase the thickness of the solder near the edge of the substrate. .

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

In FIG. 1, reference numeral 6 denotes a head section of a thermocompression bonding device, which is provided so as to be able to perform heating and pressurization at any time, and whose pressurizing end surface 6A is formed in a curved shape. 7 is a substrate on which a predetermined pattern (not shown) is formed; 8 is an F'PC on which a fine pattern (not shown) is formed; 9 is interposed between the substrate 7 and the FPC 8; The solder 9 is formed to have a particularly thick thickness 9A near the end 7A of the substrate 7.

When performing soldering work using this embodiment configured as described above, first align the pattern on the board 7 side and the pattern on the FPCB side, and then place the heated head part 6 on the FPCB side pattern.
When the solder 9 is lowered onto the CB and pressurized, the solder 9 is heated and melted in the bath, so that the substrate 7 and the FPCB are connected and integrated.

After that, the head part 6 is cooled to solidify the solder 9 and the board 7 and the RPCs are integrally joined, and then the head part 6 is raised to complete the soldering work.

In this case, at the end 7A of the substrate 7, since the pressing end 6A of the head section 6 is formed into a curved surface, the pressing end 6AK
The solder 9A that connects the opposing substrate end portion 7A and the RPC intermediate portion 8A can be made thick.

〔Effect of the invention〕

As explained above, according to the present invention, the FPC during pressurization
Since disconnection of the pattern can be prevented and the connection solder at the end of the board can be made thicker, the reliability of the connection between the board and the FPC can be improved.

[Brief explanation of drawings]

FIGS. 1 and 2 are explanatory diagrams of soldering operations for a board and an FPC using an embodiment of the present invention and a conventional thermocompression bonding apparatus, respectively. 6...Head portion 6A...Curved surface portion 7 of pressurizing end...Substrate 8...Flexible printed board 9...Connection solder. Agent: Patent Attorney Katsuo Ogawa -1,

Claims (1)

[Claims] 1. In a thermocompression bonding device in which a flexible printed board on which a fine pattern is formed is soldered to a ceramic substrate or a glass plate on which a pattern is formed, using a heating/pressing head part, the pressing end of the head part is connected by soldering. A thermocompression bonding device characterized in that, by forming the flexible printed board into a curved shape, disconnection at the end of the substrate of the pattern of the flexible printed board is prevented and the thickness of the solder is increased.