JPS633147U - - Google Patents
Info
- Publication number
- JPS633147U JPS633147U JP9723486U JP9723486U JPS633147U JP S633147 U JPS633147 U JP S633147U JP 9723486 U JP9723486 U JP 9723486U JP 9723486 U JP9723486 U JP 9723486U JP S633147 U JPS633147 U JP S633147U
- Authority
- JP
- Japan
- Prior art keywords
- thin metal
- metal wire
- hose
- bonding device
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Description
第１図はこの考案の一実施例を示す主要部の斜
視図、第２図はクランプ時の作用を説明する図で
ａはクランプ前、ｂはクランプ途中、ｃはクラン
プ状態。第３図は従来装置を示す主要部の斜視図
である。
図において、２，４は１対のクランパ、９は金
属細線、１２は中空のホースである。なお、各図
中同一符号は同一部分を示す。
Fig. 1 is a perspective view of the main parts of an embodiment of this invention, and Fig. 2 is a diagram illustrating the operation during clamping, in which a is before clamping, b is during clamping, and c is in the clamped state. FIG. 3 is a perspective view of the main parts of a conventional device. In the figure, 2 and 4 are a pair of clampers, 9 is a thin metal wire, and 12 is a hollow hose. Note that the same reference numerals in each figure indicate the same parts.
Claims (1)
接続完了後前記金属細線を１対のクランパにより
クランプし、前記金属細線の先端を引きちぎる構
造を持つワイヤボンデイング装置において、前記
１対のクランパの間に前記金属細線を通す中空の
ホースを設け、かつこのホースの材質を前記金属
細線の硬度より柔らかい材質にしたことを特徴と
するワイヤボンデイング装置。 (2) ホースを、金属細線より柔らかい材質でか
つ導電性を有する材料とした実用新案登録請求の
範囲第１項記載のワイヤボンデイング装置。[Scope of claims for utility model registration] (1) Electrical connection between two points using a thin metal wire,
In a wire bonding device having a structure in which the thin metal wire is clamped by a pair of clampers after connection is completed and the tip of the thin metal wire is torn off, a hollow hose for passing the thin metal wire is provided between the pair of clampers, and A wire bonding device characterized in that the material of the hose is softer than the hardness of the thin metal wire. (2) The wire bonding device according to claim 1, wherein the hose is made of a material that is softer than a thin metal wire and has electrical conductivity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9723486U JPS633147U (en) | 1986-06-25 | 1986-06-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9723486U JPS633147U (en) | 1986-06-25 | 1986-06-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS633147U true JPS633147U (en) | 1988-01-11 |
Family
ID=30963983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9723486U Pending JPS633147U (en) | 1986-06-25 | 1986-06-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS633147U (en) |
-
1986
- 1986-06-25 JP JP9723486U patent/JPS633147U/ja active Pending
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