JPH0415838U - - Google Patents
Info
- Publication number
- JPH0415838U JPH0415838U JP1990058395U JP5839590U JPH0415838U JP H0415838 U JPH0415838 U JP H0415838U JP 1990058395 U JP1990058395 U JP 1990058395U JP 5839590 U JP5839590 U JP 5839590U JP H0415838 U JPH0415838 U JP H0415838U
- Authority
- JP
- Japan
- Prior art keywords
- wire
- capillary
- bonding device
- wire bonding
- spool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07168—Means for storing or moving the material for the connector
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の一実施例に係るワイヤボンデ
イング装置の構成図、第２図は第１図の要部を拡
大した動作説明図、第３図は従来例のワイヤボン
デイング装置を示す構成図、第４図は従来のキヤ
ピラリの動作を説明するためも半導体装置の縦断
面図である。
１……スプール、２……ワイヤ（金線）、６…
…キヤピラリ、１０，１１……押圧部材。
Fig. 1 is a block diagram of a wire bonding device according to an embodiment of the present invention, Fig. 2 is an operational explanatory diagram with the main parts of Fig. 1 enlarged, and Fig. 3 is a block diagram showing a conventional wire bonding device. , FIG. 4 is a longitudinal sectional view of a semiconductor device for explaining the operation of a conventional capillary. 1... Spool, 2... Wire (gold wire), 6...
... Capillary, 10, 11 ... Pressing member.
Claims (1)
ワイヤをキヤピラリ先端で被ボンデイング物に押
圧してボンデイングするワイヤボンデイング装置
において、 上記キヤピラリ上方のワイヤの両側で上下方向
に位置ずれしてワイヤをそれぞれ押圧する一対の
押圧部材を対向配置したことを特徴とするワイヤ
ボンデイング装置。[Scope of Claim for Utility Model Registration] In a wire bonding device that presses and bonds a wire fed from a spool and inserted into a capillary to an object to be bonded with the tip of the capillary, the wire is vertically misaligned on both sides of the wire above the capillary. 1. A wire bonding device characterized in that a pair of pressing members are arranged facing each other to press the wire respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990058395U JPH0415838U (en) | 1990-05-31 | 1990-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990058395U JPH0415838U (en) | 1990-05-31 | 1990-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0415838U true JPH0415838U (en) | 1992-02-07 |
Family
ID=31583966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990058395U Pending JPH0415838U (en) | 1990-05-31 | 1990-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0415838U (en) |
-
1990
- 1990-05-31 JP JP1990058395U patent/JPH0415838U/ja active Pending