JPS633147U - - Google Patents

Info

Publication number
JPS633147U
JPS633147U JP9723486U JP9723486U JPS633147U JP S633147 U JPS633147 U JP S633147U JP 9723486 U JP9723486 U JP 9723486U JP 9723486 U JP9723486 U JP 9723486U JP S633147 U JPS633147 U JP S633147U
Authority
JP
Japan
Prior art keywords
thin metal
metal wire
hose
bonding device
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9723486U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9723486U priority Critical patent/JPS633147U/ja
Publication of JPS633147U publication Critical patent/JPS633147U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP9723486U 1986-06-25 1986-06-25 Pending JPS633147U (mo)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9723486U JPS633147U (mo) 1986-06-25 1986-06-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9723486U JPS633147U (mo) 1986-06-25 1986-06-25

Publications (1)

Publication Number Publication Date
JPS633147U true JPS633147U (mo) 1988-01-11

Family

ID=30963983

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9723486U Pending JPS633147U (mo) 1986-06-25 1986-06-25

Country Status (1)

Country Link
JP (1) JPS633147U (mo)

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