JPS6332807B2 - - Google Patents

Description

[Detailed description of the invention]

[Industrial Application Field] The present invention relates to a mold-releasing resin composition that has excellent mold-releasing properties and imprinting properties and does not cause mold stains. It is in the process of reacting with ingredients and fixing them. [Prior Art] Recently, the field of electrical and electronic equipment has made remarkable progress, and in particular, the use of plastic parts has become commonplace. If these plastic parts are molded products,
Molded products are obtained by hardening (thermosetting) or cooling (thermoplastic) phenolic resin, epoxy resin, etc. in a mold by compression molding, transfer molding, or injection molding. What is required in this molding process, particularly in the molding process of thermosetting resins, is good mold releasability and no staining of the mold. Generally, during mold release, the mold release agent oozes out from the molded product and forms a mold release agent film between the molded product and the mold, which eliminates the adhesive force between the mold and the molded product and makes it easier for both to release. can leave. Therefore, the amount of mold release agent that migrates and orients to the mold increases in proportion to the number of molding shots, and this causes mold fogging and mold staining by being baked into the mold due to thermal history, that is, releasing. A good mold and less mold staining are contradictory to each other. or,
For IC parts, molded products are marked (stamped) to distinguish between good and bad products. At this time, if the release agent forms a film on the surface of the molded product, problems such as poor ink adhesion and easy peeling of the mark may occur. For this reason, molding and assembling manufacturers are dealing with this by incorporating a degreasing process using a solvent or the like into the post-molding process. However, if the mold release agent deteriorates due to oxidation or the like, degreasing will be incomplete, so a molding material with good marking properties is desired, and this marking property is also a property that contradicts the mold release property. Therefore, a molding material with good mold releasability and imprinting properties and less mold staining has not become a reality. [Object of the Invention] The present invention provides a resin composition that has good mold releasability and stamping properties and has little mold staining. [Structure of the Invention] The gist of the present invention is (1) It is composed of phenol novolacs, epoxy resins and silicone compounds, and the ratio of the phenolic novolacs to the epoxy resins is the equivalent ratio of phenolic hydroxyl group/epoxy group. is 2 or more, and the ratio of phenolic novolacs to silicone compound is 1/10 to 10/10 of the silicone/phenolic hydroxyl group in the silicone compound. 0.1 to 8 parts by weight of a thermosetting composition, (2) consisting of a phenol novolac, an epoxy resin, and a silicone compound, and the ratio of the phenolic novolac to the epoxy resin is phenolic hydroxyl group/epoxy. A tertiary amine or a derivative thereof in which the equivalent ratio of groups is 2 or more and the ratio of phenol novolacs to silicone compound is 1/10 to 10/10 of silicone/phenolic hydroxyl group in the silicone compound. , an organic phosphine compound, an organic aluminum compound, a titanium compound, or a mixture heated and melted in the presence of one or more selected from acids is blended with an epoxy resin to form part or all of a curing agent and a mold release agent. Can be used as Furthermore, fillers, curing agents, mold release agents, etc. can be added. The phenol novolacs mentioned here are
Refers to all substances containing a phenolic hydroxyl group or a derivative thereof in the novolak skeleton. It includes not only single-component novolacs of phenols (phenol/alkylphenol resorcinol, etc.) but also co-condensed novolacs of arbitrary combinations of phenols and co-condensed novolacs of phenols and other resins. Moreover, epoxy resins refer to all resins having an epoxy group. For example, bisphenol type epoxy resin, novolak type epoxy resin,
Refers to epoxy resins containing triazine nuclei, etc. In addition, silicone compounds refer to organosilanes and organopolysiloxanes in general, such as (i) General formula (R ¹ ) _n Si (OR ² ) _o R ¹ : alkyl group, vinylated alkyl group, or epoxidized alkyl group ( For example, -CH ₃ , -C ₂ H ₅ ,

【formula】

〔Effect of the invention〕

By using the mold release resin according to the present invention, features such as lower internal stress of molded products and improved moisture resistance can also be obtained. Furthermore, it has become possible to obtain low-pressure phenolic resin encapsulated molding materials with good moisture resistance. [Examples] Examples will be described below. Moreover, the raw materials of the mold release resin used in the examples are as follows. Phenol novolac A: Number average molecular weight 400 B: 200 C: 700 Epoxy resin: Bisphenol epoxy (Ciel 828): Cresol novolac epoxy (Dainippon Ink N-660) Epoxy resin: Triglycidyl isocyanine _Note (TGIC) Silicone ,3,4,6,7,8,9,10-octahydropyramide (1,2-a)
Azepine basic manufacturing method 1 Orthocresol novolac type epoxy resin 20
Parts by weight, phenol novolak (number average molecular weight
550) Add parts by weight of a, part by weight of mold release resin b, 70 parts by weight of crystalline silica, 0.2 parts by weight of silica modifier, 0.2 parts by weight of curing accelerator, and parts by weight of carnauba wax, and heat roll at 90°C. Knead for 5 minutes. Application examples: Phenol novolac A, B, C and epoxy resin. Several mold releasable resins were prototyped by combining and heating and melting and mixing silicones X, Y, Z, and catalysts α, β, and γ. This resin was processed into materials using Basic Production Method I to obtain various epoxy resin molding materials. These materials were molded using a small molding machine or a transfer molding machine, and their mold releasability and mold staining property were evaluated. In addition, the stampability was evaluated using the molded product. The results are shown in Table 1, and the products using the heat-melted mixture of phenol novolaks/epoxy resins/silicone compounds according to the present invention not only have excellent mold releasability and mold staining, but also have excellent stamping properties.

【table】

[Table] Values are relative values when the comparative example is taken as 100. Larger numbers are better: Mold stain, crack resistance, moisture resistance. Smaller numbers are better: Mold releasability, stamping properties. Symbols indicate characteristics. Show trends. Good ←◎・〇・△・×→ Bad mold release property: Molded with a mold release evaluation mold (mold without knock pins) and judged by the number of mold removals of the molded product. Mold contamination: Determined by the number of molding shots until mold fogging or mold release failure occurs. Stampability: After stamping, sellotape is applied to the molded product. Judgment is made by the number of molded products that have the stamp removed when the sellotape is removed. Crack resistance: A molded product with a large insert inserted is subjected to a temperature cycle test (high and low temperatures), and judged by the number of cycles until a crack occurs in the molded product. Humidity resistance: Judging from the time it takes for a molded product with a humidity sensing element inserted into a pressurized humidifier to sense temperature.

Claims (1)

[Scope of Claims] 1. Consisting of phenol novolacs, epoxy resins, and silicone compounds, the ratio of the phenolic novolacs to the epoxy resins is such that the equivalent ratio of phenolic aqueous group/epoxy group is 2 or more, and A mixture of novolacs and silicone compounds heated and melted at a ratio of 1/10 to 10/10 of silicon/phenolic hydroxyl groups in the silicone compound is 0.1 to 8 to 20 parts by weight of epoxy resin.
A thermosetting composition prepared by adding parts by weight. 2 Consisting of phenol novolacs, epoxy resins and silicone compounds, the ratio of the phenolic novolacs to the epoxy resins is such that the equivalent ratio of phenolic hydroxyl group/epoxy group is 2 or more, and the ratio of the phenolic novolacs to the silicone compound is 2 or more. A silicone compound with a silicone/phenolic hydroxyl group ratio of 1/10 to 10/10 selected from tertiary amines or derivatives thereof, organic phosphine compounds, organic aluminum compounds, titanium compounds, or acids. A thermosetting resin composition obtained by adding a mixture heated and melted in the presence of one or more kinds to an epoxy resin.