JPS6342111A - Elctronic parts packaging - Google Patents
Elctronic parts packagingInfo
- Publication number
- JPS6342111A JPS6342111A JP61185997A JP18599786A JPS6342111A JP S6342111 A JPS6342111 A JP S6342111A JP 61185997 A JP61185997 A JP 61185997A JP 18599786 A JP18599786 A JP 18599786A JP S6342111 A JPS6342111 A JP S6342111A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- packaging
- epoxy resin
- elctronic
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims description 10
- 238000000034 method Methods 0.000 claims description 16
- 238000000576 coating method Methods 0.000 claims description 14
- 239000000843 powder Substances 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- 238000004132 cross linking Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000000155 melt Substances 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 description 7
- 238000007796 conventional method Methods 0.000 description 3
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000005266 casting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000007591 painting process Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電子部品への外装被膜の形成方法に関し、特
に電子部品への電気的絶縁を目的としてエポキシ系塗料
の被膜形成方法に関するものであス−
〔従来の技術〕
エポキシ系樹脂は、電気的絶縁性に優れている為、電子
部品の外装に広く用いられている。被膜の形成方法はデ
ツプ法、粉体塗装法、注型法等各種実用に供されている
。このうち、粉体塗装は積層磁器コンデンサーをはじめ
、比較的小型の電子部品の塗装方法として用いられてい
る。粉体塗装プロセスとしては、まず、電子部品を電気
炉中で約３０分加熱し、次に、該電子部品を素早くエポ
キシ系粉体中に浸漬する事により、電子部品表面に付着
したエポキシ系粉体塗料が電子部品の熱により融溶し、
電子部品表面を濡らし、しかる後に電気炉中で融溶エポ
キシ系が架橋反応により硬化し、外装被膜を形成するの
が一般的である。被膜厚みは、エポキシ系粉体中への浸
漬と架橋反応による硬化との繰り回し回数により決まり
、通常数回の繰り返しで、約１間程度の厚みが得られる
。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for forming an exterior coating on an electronic component, and particularly relates to a method for forming an epoxy paint coating for the purpose of electrically insulating the electronic component. [Background Art] Epoxy resins have excellent electrical insulation properties and are therefore widely used for the exterior of electronic components. Various methods for forming the film are used in practice, such as the dip method, powder coating method, and casting method. Among these, powder coating is used as a coating method for relatively small electronic parts, including laminated ceramic capacitors. The powder coating process involves first heating the electronic component in an electric furnace for about 30 minutes, then quickly immersing the electronic component in epoxy powder to remove the epoxy powder that has adhered to the surface of the electronic component. The body paint melts due to the heat of the electronic parts,
Generally, the surface of the electronic component is wetted, and then the molten epoxy system is cured by a crosslinking reaction in an electric furnace to form an exterior coating. The thickness of the coating is determined by the number of repetitions of immersion in the epoxy powder and curing by crosslinking reaction, and usually a thickness of about 1 inch can be obtained by repeating several times.
しかしながら、前記エポキシ系粉体塗料のプロセスにお
いては、電子部品を加熱と粉体塗料中への浸漬を繰り返
すので、！１！装工程に長時間を要する欠点がある。更
に、加熱する為のエネルギーの利用効率が低いという欠
点がある。However, in the epoxy powder coating process, electronic components are repeatedly heated and dipped into the powder coating. 1! The drawback is that the mounting process takes a long time. Furthermore, there is a drawback that the energy utilization efficiency for heating is low.
本発明は、萌記欠点を解決する為になされたもので、塗
装プロセスが短縮され、かつ、熱エネルギーの利用効率
の高い電子部品の外装方法の提供を目的とする。The present invention has been made to solve the above drawbacks, and aims to provide a method for packaging electronic components that shortens the painting process and has high heat energy utilization efficiency.
交流電圧を電子部品に印加する事で、電子部品自身の損
失の為に自己発熱を生じさせ、電子部品を高温に保持す
る工程と、次に、該電子部品をエポキシ系樹脂粉体中に
浸漬し、部品表面に樹脂粉末を付着・熱融解せしめる工
程と、しかる後にエポキシ系樹脂の架橋反応により硬化
し、外装被膜を形成する工程を有する事を特徴とする電
子部品の外装方法。A process of applying an alternating current voltage to the electronic component to generate self-heating due to its own loss and maintaining the electronic component at a high temperature, and then immersing the electronic component in epoxy resin powder. A method for packaging an electronic component, comprising the steps of: adhering and thermally melting resin powder on the surface of the component; and then hardening by crosslinking reaction of an epoxy resin to form an exterior coating.
積Ｐ！磁器コンデンサーや積層圧電アクチュエーターは
、誘電体あるいは圧電体材料自身の誘電体損失の為に、
数キロヘルツ以上の交流電圧を印加すると発熱する。又
、チョークコイルやチョークトランスの磁性材料におい
ても、数ｌＯ〜数百キロヘルツの交流電圧を印加すると
、うず電流損失の為に発熱する０本発明は、この発熱現
象をエポキシ系粉体の電子部品表面への付着・融解及び
架橋反応の熱硬化の熱源として用いた外装方法である。Product P! Due to the dielectric loss of the dielectric or piezoelectric material itself, ceramic capacitors and laminated piezoelectric actuators
It generates heat when an AC voltage of several kilohertz or higher is applied. In addition, even in the magnetic materials of choke coils and choke transformers, when an AC voltage of several 10 to several hundred kilohertz is applied, heat is generated due to eddy current loss. This is an exterior packaging method that uses the material as a heat source for adhesion to the surface, melting, and thermosetting of the crosslinking reaction.
以下、本発明を実施例により詳細に説明する。 Hereinafter, the present invention will be explained in detail with reference to Examples.
寸法２ Ｘ ３ Ｘ ９ ｍｍの積層型圧電アクチュエ
ータの外装方法にすいて本発明を適用した。外装プロセ
スを第１図に示す、第１図（ａ）において、外部交流電
［ＩＫＨｚを１分間印加する事で、アクチュエータ素子
温度を１１０℃まで上昇させる０次に第１図（ｂ）の様
に、電圧を印加した状態でエポキシ樹脂粉末中に浸漬す
る。しかる後に第１図（ｃ）に示す様に、樹脂粉末中か
ら取り出し、付着・融解したエポキシ系樹脂を架橋反応
により熱硬化せしめ、外装被膜を形成した。The present invention was applied to a method for packaging a laminated piezoelectric actuator with dimensions of 2 x 3 x 9 mm. The exterior process is shown in Figure 1. In Figure 1 (a), by applying an external alternating current (IKHz) for 1 minute, the temperature of the actuator element is raised to 110°C. , immersed in epoxy resin powder with voltage applied. Thereafter, as shown in FIG. 1(c), the epoxy resin was removed from the resin powder, and the adhered and melted epoxy resin was thermally cured by a crosslinking reaction to form an exterior coating.
？！！気炉な用いて素子を加熱する従来方法と比較して
、第１Ｄ！Ｉ （ａ） 、（ｂ） 、（ｃ） の各工程
ニオける所要時間及び合計外装時間、外装厚み等を第１
表に示す。? ! ! Compared to the conventional method of heating the element using an air furnace, the first D! The time required for each step of I (a), (b), and (c), the total packaging time, the packaging thickness, etc.
Shown in the table.
第１表
第１表より、明らかに従来方法と比較して、合計の外装
時間が約２／３に短縮され、かつ、必要な装置も交流電
源のみで電気炉より安価であり、かつ、当然熱エネルギ
ーの利用効率も高い。Table 1 From Table 1, it is clear that the total packaging time is reduced to about 2/3 compared to the conventional method, and the necessary equipment is only an AC power supply, which is cheaper than an electric furnace. Thermal energy usage efficiency is also high.
以上、詳細に説明したように、本発明によれば第１図（
ａ）に示す塗装時間が従来法の約３０分に比較駅 約１
分と著しく短縮され、かつ、熱エネルギーの利用効率の
高い電子部品の外装方法の提供が可能である。As described above in detail, according to the present invention, FIG.
The painting time shown in a) is approximately 30 minutes using the conventional method, compared to approximately 1 station.
It is possible to provide a packaging method for electronic components that is significantly shortened in time and has high heat energy utilization efficiency.
本発明について、積層圧電アクチュエータを用いて説明
したが、正常な電子部品素子として用いる時よりも高い
周波数を印加して、素子の損失による発熱を大きくさせ
ることにより、エポキシ系樹脂の融溶、付着を効率よく
させるものである。The present invention has been explained using a laminated piezoelectric actuator, but by applying a higher frequency than when used as a normal electronic component element and increasing heat generation due to element loss, the epoxy resin can be melted and adhered. This makes it more efficient.
部品素子の損失は、誘？！損、ヒステリシス損などに起
因するものである。この結果、本願は圧電アクチュエー
タに限定するものではなく、ＰＺＴなどで構成される誘
電体素子、あるいは、フェライトなどで構成されるイン
ダクタンス素子などにも適用人きるものである。Is the loss of component elements induced? ! This is due to loss, hysteresis loss, etc. As a result, the present invention is not limited to piezoelectric actuators, but can also be applied to dielectric elements made of PZT or the like, or inductance elements made of ferrite or the like.
第１図は、外装プロセスを示す、第１区（ａ）１１は積
層型圧電アクチュエータ、１２は交流電源、第１図（ｂ
）１３はエポキシ系粉末塗料、第１図（ｃ）１４は熱硬
化後のエポキシ樹脂層を示す。Fig. 1 shows the exterior process, the first section (a) 11 is a laminated piezoelectric actuator, 12 is an AC power supply, Fig. 1 (b)
) 13 shows the epoxy powder coating, and FIG. 1(c) 14 shows the epoxy resin layer after thermosetting.
Claims (1)
する事で、電子部品自身を高湿に保持しながら、該電子
部品の表面に、高温で融溶するエポキシ系樹脂粉末を付
着・融解せしめる工程と、しかる後に、エポキシ系樹脂
の架橋反応により硬化し外装被膜を形成する工程を経る
事を特徴とする電子部品の外装方法。A process in which epoxy resin powder, which melts at high temperatures, is adhered to and melted on the surface of the electronic component while maintaining the electronic component itself at high humidity by applying an alternating current voltage at a frequency that causes self-heating of the electronic component. A method for packaging an electronic component, comprising the steps of: and then curing the epoxy resin through a crosslinking reaction to form an exterior coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61185997A JPS6342111A (en) | 1986-08-07 | 1986-08-07 | Elctronic parts packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61185997A JPS6342111A (en) | 1986-08-07 | 1986-08-07 | Elctronic parts packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6342111A true JPS6342111A (en) | 1988-02-23 |
Family
ID=16180562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61185997A Pending JPS6342111A (en) | 1986-08-07 | 1986-08-07 | Elctronic parts packaging |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6342111A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024525853A (en) * | 2021-07-19 | 2024-07-12 | テーデーカー エレクトロニクス アーゲー | Method for manufacturing an NTC sensor |
-
1986
- 1986-08-07 JP JP61185997A patent/JPS6342111A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024525853A (en) * | 2021-07-19 | 2024-07-12 | テーデーカー エレクトロニクス アーゲー | Method for manufacturing an NTC sensor |
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