JPS634698A - Housing for mounting electronic components - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a housing for mounting electronic components, and particularly to a housing for mounting electronic components suitable for achieving low noise and good cooling effects.

[Conventional technology]

Conventionally, as an example of a housing for mounting electronic components that improves the cooling effect with low noise, "Nikkei Byte" January 1981 issue, p.
, 156. The one shown in FIG. 3 (Nihon Keizai Shimbun) is publicly known. As shown schematically in Figure 2, this mounting housing has a fan 3 attached to the outer wall of the housing 1, and its operation is to suck out the high temperature air inside the housing to the outside (see Figure 2). (a)) or by blowing outside low-temperature air into the interior (Fig. 2 (b)). However, these did not take into consideration low noise and uniform cooling inside the housing.

[Problem that the invention seeks to solve]

As mentioned above, the above conventional technology does not take into account low noise and uniform cooling inside the device, and since the fan is attached to the outer wall of the single casing, the fan rotation noise and wind noise are directly transmitted to the outside. There was a problem in that the noise level was high. Furthermore, in the method shown in Fig. 2(a), the air inside the case flows evenly, but because the wind speed is slow, if there is a particularly large heat generating part in a part of the case, cooling will not be sufficient.
In addition, in the method shown in Figure 2 (b), the wind speed is high and the cooling efficiency is good immediately before the fan, but there are other places where the air does not flow and heat is trapped, resulting in abnormally high temperatures and causing the electronic equipment to This caused the problem of lowering reliability.

SUMMARY OF THE INVENTION An object of the present invention is to provide a novel casing for mounting electronic components, which reduces noise caused by a fan and improves the efficiency of cooling the inside of the casing.

[Means for solving problems]

The above purpose is to provide a partition wall that divides a casing for mounting electronic components into two small chambers, and a partition wall that is installed on the partition wall so that the cooling of the electronic components in the - one small chamber is by suction cooling, and the electronic components in the other small chamber are installed on the partition wall. This is achieved by providing a cooling fan that provides blow-out cooling.

[For production]

A housing for mounting electronic components is divided into two small chambers by a partition wall equipped with a cooling fan.

The cooling fan sucks out and cools the small chamber on the negative side.
The other small chamber is cooled by blowing air. For example, a non-heat-generating electronic component is mounted in the negative /11 chamber, and a heat-generating electronic component is mounted in the other small chamber.

〔Example〕

An embodiment of the present invention will be described below with reference to FIG. 1st
In the figure, reference numeral 1 denotes a mounting case, which is usually rectangular in shape. Its internal area is divided by a partition wall 2 at a position in the middle of the housing so as to constitute two small chambers A and B. A fan 3 is attached to the center of the partition wall 2, and its rotation is set so that the air flow is sucked out for cooling in the A room and blown out for cooling in the B room.

The room A includes a floppy disk 4, a hard disk 5, and printed circuit boards 5, 6 on which ICs, LSIs, etc. are mounted.
・Electronic components that do not generate heat at all, but generate a relatively small amount of heat even if they do, are mounted, and room B has a power supply device including a power transistor 7 in front of the fan 3 and a radiation fin 8 for dissipating the heat of the power transistor. Electronic components such as those that generate a large amount of heat compared to the above-mentioned electronic components are mounted.

An air inlet 9 is provided over a considerable surface of the side surface of the mounting case 1 facing the fan 3 on the side of room A, and on the side of the case 1 perpendicular to the airflow by the fan 3 on the side of room B. An air discharge port 1o is provided at.

Note that, if necessary, a sound absorbing material 11 is pasted on the inside of the B room, etc., and a sound insulating wall 12 is provided parallel to the air outlet 1o.

In the above configuration, as the fan 3 rotates, air is sucked in from the suction port 9, flows through the A chamber to the B chamber, and the air is sucked into the B chamber through the discharge port 10.
It is discharged from 10. At this time, the air in room A is
The air is widely inhaled through the inlet 9 provided over a considerable surface of the side surface of the housing. This creates an even air flow,
There will be no stagnation of air, and the electronic components in room A will be cooled on average.

In addition, the air passing through Room A is blown out to Room B without being heated in that room.
or more), the cooling effect is about twice or more than that of the slow wind blowing (generally 0.5 m/s or less). Moreover, the air flow blown into the room like this is
It hits the power transistor 7 installed in front of the fan 3, travels in two opposite directions, and is discharged to the outside. As a result, air stagnation in room B is eliminated. More fans 3
is installed on the partition wall 2 located deep inside the housing, and the sound absorbing material 11 and the soundproof wall 12 enhance the sound deadening effect and reduce noise.

〔Effect of the invention〕

According to the present invention, the suction cooling allows air to flow uniformly and there is no stagnation of air, so the entire body can be cooled evenly, and the blowout cooling blows high-velocity air to items that generate particularly large amounts of heat. A high cooling effect can be obtained for the entire body. Furthermore, since the fan is not attached to the outer wall of the casing, the rotating sound of the fan and wind noise are directly emitted to the outside, making it possible to reduce noise.

[Brief explanation of drawings]

FIG. 1 is a plan view of a mounting casing according to the present invention, and FIG.
) and (b) are explanatory diagrams of a casing according to the prior art. 1... Mounting case, 2... Partition wall, 3... Cooling fan, 4... Floppy disk. 5...Hard disk, 6...Printed circuit board. 7... Power transistor, 8... Heat dissipation fin, 11... Sound absorbing material, 12... Sound insulating wall. Figure 1

Claims (2)

[Claims] (1) In a case in which electronic components are mounted, there is a partition wall that divides the case into two small chambers, and a partition wall is installed on the partition wall, and the cooling of the electronic components in one of the two small chambers is sucked out and the other is used for cooling. A casing for mounting electronic components, characterized in that it is equipped with a fan that blows air to cool electronic components in a small chamber. (2) The electronic component mounting casing according to claim 1, wherein the other small chamber is provided with a sound-deadening facility.