JPS6350695Y2 - - Google Patents
Info
- Publication number
- JPS6350695Y2 JPS6350695Y2 JP1982106888U JP10688882U JPS6350695Y2 JP S6350695 Y2 JPS6350695 Y2 JP S6350695Y2 JP 1982106888 U JP1982106888 U JP 1982106888U JP 10688882 U JP10688882 U JP 10688882U JP S6350695 Y2 JPS6350695 Y2 JP S6350695Y2
- Authority
- JP
- Japan
- Prior art keywords
- light
- circuit board
- printed circuit
- emitting diode
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982106888U JPS5912182U (ja) | 1982-07-13 | 1982-07-13 | 発光ダイオ−ド表示器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982106888U JPS5912182U (ja) | 1982-07-13 | 1982-07-13 | 発光ダイオ−ド表示器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5912182U JPS5912182U (ja) | 1984-01-25 |
| JPS6350695Y2 true JPS6350695Y2 (2) | 1988-12-27 |
Family
ID=30249953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982106888U Granted JPS5912182U (ja) | 1982-07-13 | 1982-07-13 | 発光ダイオ−ド表示器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5912182U (2) |
-
1982
- 1982-07-13 JP JP1982106888U patent/JPS5912182U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5912182U (ja) | 1984-01-25 |
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