JPS6350854Y2 - - Google Patents

Info

Publication number
JPS6350854Y2
JPS6350854Y2 JP1983091509U JP9150983U JPS6350854Y2 JP S6350854 Y2 JPS6350854 Y2 JP S6350854Y2 JP 1983091509 U JP1983091509 U JP 1983091509U JP 9150983 U JP9150983 U JP 9150983U JP S6350854 Y2 JPS6350854 Y2 JP S6350854Y2
Authority
JP
Japan
Prior art keywords
heat
heat dissipation
substrate
block
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983091509U
Other languages
English (en)
Japanese (ja)
Other versions
JPS60937U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1983091509U priority Critical patent/JPS60937U/ja
Publication of JPS60937U publication Critical patent/JPS60937U/ja
Application granted granted Critical
Publication of JPS6350854Y2 publication Critical patent/JPS6350854Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1983091509U 1983-06-15 1983-06-15 半導体チップの放熱構造 Granted JPS60937U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983091509U JPS60937U (ja) 1983-06-15 1983-06-15 半導体チップの放熱構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983091509U JPS60937U (ja) 1983-06-15 1983-06-15 半導体チップの放熱構造

Publications (2)

Publication Number Publication Date
JPS60937U JPS60937U (ja) 1985-01-07
JPS6350854Y2 true JPS6350854Y2 (da) 1988-12-27

Family

ID=30221504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983091509U Granted JPS60937U (ja) 1983-06-15 1983-06-15 半導体チップの放熱構造

Country Status (1)

Country Link
JP (1) JPS60937U (da)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5561049A (en) * 1978-10-31 1980-05-08 Furukawa Electric Co Ltd:The Radiator for semiconductor
JPS57157551A (en) * 1981-03-25 1982-09-29 Hitachi Ltd Heat sink device

Also Published As

Publication number Publication date
JPS60937U (ja) 1985-01-07

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