JPS635233Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a leadless package comprising a casing made of an insulating material such as ceramic and having a cavity for accommodating a semiconductor chip and conductive pads.

Traditionally, packages have been used to house semiconductor chips that make up semiconductor integrated circuits such as ICs and LSIs.
Dual in-line package cages include a cavity in the center and a conductive pattern for wire bonding inside the cavity, and a lead frame on the external side to lead the conductive pattern to the outside, or a flat plate type package. A ceramic substrate is formed with a cavity for accommodating a semiconductor chip in the center of one side, and the semiconductor chip is mounted on the bottom of the cavity, and the semiconductor chip is separately prepared and wire-bonded to a lead frame attached to glass on the ceramic substrate. A ceramic substrate having the same shape as the ceramic substrate as a cover member is glass-welded to form a semiconductor device, and a ceramic substrate is often used.

In addition, a semiconductor chip is housed in a cavity provided in the upper center, and conductive pads forming external leads connected to each electrode of the semiconductor chip are arranged on the bottom surface, and these conductive pads are directly connected to a printed circuit board or a motherboard. Chip carrier type packages that are connected by soldering to other parts are also often used.

However, with semiconductor devices using packages as described above, when a circuit device is configured using multiple such semiconductor devices, the semiconductor devices are placed one by one on a circuit board such as a circuit board. Since they have to be arranged in a flat plane, the circuit boards used inevitably have a large area, resulting in an increase in the size of the electronic device as a whole. Moreover, once a circuit board has been designed with the arrangement of semiconductor devices in mind, it is extremely difficult to easily change the design, and if an electronic device with a slightly different circuit configuration is required, there is no flexibility at all. It was occurring.

In addition, for chip carrier type devices that have conductive pads on the bottom surface for external conduction, when testing the operation after mounting on a circuit board, it is necessary to connect the probe of an inspection device (measuring device) to the lead part of the semiconductor device. Moreover, even when it is desired to modify the wiring, it is not possible to easily connect to the conductive pads of the semiconductor device, so there is a problem in that the circuit cannot be modified at all.

This proposal was devised in view of the various inconveniences of conventional semiconductor devices as described above, and includes multi-stage connections, addition and change of circuits, and measurement probes to be tested in a package that accommodates semiconductor chips and constitutes a semiconductor device. It is an object of the present invention to provide a leadless package that can be easily connected.

Hereinafter, embodiments of the present invention will be explained in detail with reference to the drawings. FIG. 1 is a perspective view of a semiconductor device M configured with the package according to the present invention, and the X
- In FIG. 2, which shows an X-ray cross section, 1 is a housing that forms the main body of a package made of ceramic, and is manufactured by laminating raw ceramic sheets and sintering them. In addition, a cavity 2 for accommodating the semiconductor chip S is located approximately in the center of the housing 1.
is formed, and each electrode of the semiconductor chip S mounted on the bottom surface of the cavity 2 is wire bonded to a conductive pattern 4 formed on a step 3 inside the cavity 2. The upper end of the through hole 5 is connected to the upper conductive pad 6 formed on the upper surface of the housing 1, that is, on the upper periphery of the cavity 2.
In addition, the lower end is connected to a lower conductive pad 7 formed on the lower surface of the casing 1, but this through hole 5 has not only the conductive pattern 4 connected to it, but also the upper conductive pad 6 and the lower conductive pad 6. 7 are connected, or the upper surface conductive pad 6 and the lower surface conductive pad 7 are not necessarily connected through the through hole 5, and only one of them is connected through the conductive pattern 4 and the through hole 5. At least one pair or more of the upper and lower conductive pads 6 and 7 are connected by the through hole 5.

In the package constructed as described above, a semiconductor chip S is mounted in the cavity 2, wire bonded to the conductive pattern 4, and a lid member 8 is applied in an airtight manner, after which the semiconductor chip S is assembled as a semiconductor device as shown in FIG. The lower conductive pads 7, 7', . . . are mounted by soldering to a predetermined conductive surface provided on a circuit board P such as a circuit board P, a printed circuit board, a motherboard, etc. When the semiconductor device is constructed with the leadless package according to the present invention, as shown in FIG.
It is possible to measure, adjust, etc. the operating status and characteristics of semiconductor devices and electronic circuits by connecting them, and as shown in Figure b, a conductive surface is provided on the circuit board P in advance from the time of design. If the circuit is not changed or expanded, the upper conductive pads 6, 6'..., the conductor surface on the circuit board P and the wire W
Alternatively, active elements such as resistors and capacitors, components T such as diodes and transistors may be additionally connected.

Furthermore, if it is impossible to mount any more semiconductor devices on the circuit board P as shown in c in the same figure, or if you want to make effective use of space, the semiconductor device M
Top conductive pads 6, 6'... and other semiconductor devices
By connecting the lower conductive pads 7, 7', . . . of M', it is possible to install semiconductor devices in multiple stages.

As described above, according to the present invention, the lead electrode is connected to the lower conductive pad and/or the upper conductive pad as a lead electrode connected to the electrode of the housed semiconductor chip, or is not connected to the electrode of the semiconductor chip. Since this is a package equipped with upper and lower conductive pads connected to each other through a through hole, if a semiconductor device is configured by housing a semiconductor chip, it is connected to the circuit board by the lower conductive pad, Using the conductive pad on the top surface to connect the probe of a measuring instrument, it is possible to easily test and adjust the operation of electronic circuit devices, as well as to change and expand circuit functions.Furthermore, by mounting semiconductor devices in multiple stages, it is possible to easily test and adjust the operation of electronic circuit devices. It can bring about many effects, such as being able to maximize functionality in a limited space.

[Brief explanation of the drawing]

Figure 1 is a perspective view of a semiconductor device constructed using the package of the present invention, Figure 2 is a sectional view taken along the line X-X in Figure 1, and Figures 3 a, b, and c show the semiconductor device using the package of the present invention on a circuit board. It is a side view which shows the example of an implemented aspect. 1: Housing, 2: Cavity, 3: Step, 4: Conductive pattern, 5: Through hole, 6, 6': Top conductive pad, 7, 7': Bottom conductive pad, M,
M': semiconductor device, S: semiconductor chip.

Claims (1)

[Scope of utility model registration request] The ceramic housing has a cavity for hermetically sealing the semiconductor chip in the center thereof, and a plurality of upper conductive pads and lower conductive pads are arranged on each of the upper and lower surfaces, with at least one pair of these pads being through-holes. A plurality of leadless packages interconnected by holes are directly connected to the top conductive pad connected by the through hole in one leadless package and the bottom conductive pad connected by the through hole in the other leadless package. A multi-stage structure of leadless packages that are connected in multiple stages.