JPS6352770A - ナロ−ラップシ−ム溶接機の溶接部圧加装置 - Google Patents
ナロ−ラップシ−ム溶接機の溶接部圧加装置Info
- Publication number
- JPS6352770A JPS6352770A JP19394786A JP19394786A JPS6352770A JP S6352770 A JPS6352770 A JP S6352770A JP 19394786 A JP19394786 A JP 19394786A JP 19394786 A JP19394786 A JP 19394786A JP S6352770 A JPS6352770 A JP S6352770A
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- welded
- roll
- pressure roll
- weld zone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Butt Welding And Welding Of Specific Article (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19394786A JPS6352770A (ja) | 1986-08-21 | 1986-08-21 | ナロ−ラップシ−ム溶接機の溶接部圧加装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19394786A JPS6352770A (ja) | 1986-08-21 | 1986-08-21 | ナロ−ラップシ−ム溶接機の溶接部圧加装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6352770A true JPS6352770A (ja) | 1988-03-05 |
| JPH0472638B2 JPH0472638B2 (2) | 1992-11-18 |
Family
ID=16316402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19394786A Granted JPS6352770A (ja) | 1986-08-21 | 1986-08-21 | ナロ−ラップシ−ム溶接機の溶接部圧加装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6352770A (2) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9576728B2 (en) | 2012-05-30 | 2017-02-21 | Samsung Electro-Mechanics Co., Ltd. | Laminated chip electronic component, board for mounting the same, and packing unit thereof |
-
1986
- 1986-08-21 JP JP19394786A patent/JPS6352770A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9576728B2 (en) | 2012-05-30 | 2017-02-21 | Samsung Electro-Mechanics Co., Ltd. | Laminated chip electronic component, board for mounting the same, and packing unit thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0472638B2 (2) | 1992-11-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |