JPS6355441U - - Google Patents
Info
- Publication number
- JPS6355441U JPS6355441U JP14773286U JP14773286U JPS6355441U JP S6355441 U JPS6355441 U JP S6355441U JP 14773286 U JP14773286 U JP 14773286U JP 14773286 U JP14773286 U JP 14773286U JP S6355441 U JPS6355441 U JP S6355441U
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- base
- grounding
- output terminal
- input terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Description
第１図ないし第２図は本考案による外囲器の一
実施例を示す斜視図、第３図は第２図のＡ―Ａ′
線矢視断面図、第４図は他の実施例を示す斜視図
、第５図ないし第６図は従来の外囲器を示す斜視
図、第７図は従来の技術の問題点を説明するため
の等価回路図である。
１…基体、２…入力用端子、３…出力用端子、
４…接地用端子、５…基板、６，７…マイクロス
トリツプ導体、８…接地パターン、９…接地用導
体、１０…スルーホール、１１…インダクタンス
、１２…スルーホール、１３…導体層。
1 and 2 are perspective views showing an embodiment of the envelope according to the present invention, and FIG. 3 is a line AA' in FIG. 2.
4 is a perspective view showing another embodiment, FIGS. 5 and 6 are perspective views showing a conventional envelope, and FIG. 7 is a diagram explaining problems with the conventional technology. FIG. 1... Base, 2... Input terminal, 3... Output terminal,
4... Grounding terminal, 5... Substrate, 6, 7... Microstrip conductor, 8... Grounding pattern, 9... Grounding conductor, 10... Through hole, 11... Inductance, 12... Through hole, 13... Conductor layer.
Claims (1)
力用端子及び出力端子を設け、該入力端子及び出
力用端子の近傍に該基体の該一側面に対して垂直
で、その先端が電気回路基板の接地導体に接続す
る貫通孔に挿入された接地用端子を設けたことを
特徴とする半導体素子用外囲器。 An input terminal and an output terminal are provided parallel to one side of the base on which a semiconductor element is placed, and an electric circuit board is provided near the input terminal and output terminal, the tip thereof being perpendicular to the one side of the base. An envelope for a semiconductor device, characterized in that it is provided with a grounding terminal inserted into a through hole connected to a grounding conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14773286U JPS6355441U (en) | 1986-09-29 | 1986-09-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14773286U JPS6355441U (en) | 1986-09-29 | 1986-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6355441U true JPS6355441U (en) | 1988-04-13 |
Family
ID=31061364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14773286U Pending JPS6355441U (en) | 1986-09-29 | 1986-09-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6355441U (en) |
-
1986
- 1986-09-29 JP JP14773286U patent/JPS6355441U/ja active Pending
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