JPS635546A - Package grinding machine for semiconductor device - Google Patents

Abstract

PURPOSE:To ensure high-precision dimensional control being not subjected to shrinkage or warp present in materials by a method wherein a grinding process is accomplished with a package chip bonding surface serving as refer ence. CONSTITUTION:A unit of this design is constituted of a package fixing jig 15 for the fixation of a package 1, package fixing bed 13 for the package fixing jig 15, and a reference block 22 for the positioning of a grinding reference surface in the package 1. The package fixing bed 13 is caused to travel by adjusting a trimming screw 14, a surface B of the package 1 installed on the package fixing bed 13 is caused for positioning to abut against an end 22a of the reference block 22, and then grinding is accomplished with the package 1 fixed to the packaging fixing jig 15 with the surface B serving as the reference surface. In this way, with the surface B to serve as the reference level for the fixation of the package 1 during a grinding process being located nearest to a light-receiving surface D, a surface A may be directly controlled in terms of its dimensions, which results in a very accurately ground surface.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a grinding apparatus for packages used for semiconductor devices and the like.

<Prior Art> FIG. 2 is an explanatory diagram showing a schematic configuration of a conventional solid-state imaging semiconductor device (CCD area sensor) used in a VTR or the like. A chip 2 and a filter 3 are bonded to the package 1, and the entire light receiving section is further sealed by a lid 4. Further, a beam 5 is soldered to the side surface of the package 1. The semiconductor device constructed in this way is manufactured through the steps shown in FIG. In this process, the attachment surface grinding process means the grinding process of the A side of the package 1. - Ceramic, which is generally used as a material for packages, is
Since it is heated to 00°C to 1900°C and then cooled, dimensional shrinkage of about 10% and warping of about 005n occur. For this reason, after firing, the A side of the package 1, which is the mounting surface, is ground to obtain the desired dimensional accuracy.

FIG. 4 is an explanatory diagram showing an example of a conventional grinding device.

A clamp claw 9 is fixed to the package fixing jig 7 with a screw 11, and the package l is placed so as to be in contact with the end 9a of the clamp claw 9. Next, by tightening the screw 12, the clamp claw 10 applies pressure to the package 1 in the direction of arrow E and fixes it.

In this state, the package fixing jig 7 is electromagnetically fixed to the magnetic table 8 of the surface grinder, and the grinding process is performed using the grinding wheel 6.

<Problems to be solved by the invention> The most important thing in the above processing is to adjust the parallelism and distance between the bonding surface B and mounting surface A of the chip 2 to ±0 as shown in Figure 2. This means processing to a dimensional accuracy of .05m or less. This is because when attaching a semiconductor device to an optical device such as a VTR, a dimensional accuracy of ±0.1 fl or less is required as an alignment accuracy between the light-receiving surface of the chip 2 and the optical lens on the optical device side. Considering the errors during bonding and the errors during package attachment, the allowable error between sides A and B is ±0.05 or less as described above.

However, in the grinding device shown in Fig. 4, package 1 is fixed on a six-sided basis, so it is difficult to directly control the machining dimensions of side A with side B as a standard, and It was necessary to measure the processing dimensions.

<Means for Solving the Problems> The present invention has been made in view of the above problems, and as shown in FIG.
Package fixing stand that is guided and supported by 5a and moves up and down]
3, a fine adjustment screw 14 for slightly moving the package fixing base 13, clamp claws 18 and 20 for clamping the package, and screws 19 and 21 for fixing the clamp claws,
Reference block 22 for positioning the B side and reference block 2
2 to the package fixing jig I5
and 17, side plates 23 and 24 for guiding the package fixing base 13 and reference block 22 to the package fixing jig 15, and screws 25 and 26 for fixing the side plates 23 and 24 to the package fixing jig 15. The package fixing table 13 is moved using the fine adjustment screw 14, and the B side of the package 1 placed on the top thereof is pressed against the end 22a of the reference block 22 to position it, and the package 1 is positioned as the B side reference. Package fixing jig 15
The purpose is to carry out grinding by fixing the material to

<Function> According to the present invention, since the package fixing reference during grinding is the B side closest to the light-receiving surface, the machining dimensions of the A side can be directly controlled, and dimensions of ±005u or less can be directly controlled. A highly accurate ground surface can be obtained.

<Example> Embodiments of the present invention will be described in detail below with reference to the drawings.

Examples will be explained according to the following. First, the clamp claws 18 are fixed to the package fixing jig 15 with screws 19. Next, the package l is placed on top of the package fixing fi 113 disposed at the center of the package fixing jig 15. The package fixing base 13 is composed of a member 13a and a member +3b, and the member 13b is guided and supported by a spherical seat with respect to the member +3a. Therefore, the member 13b can be rotated and slidably guided relative to the member 13a within a range that does not come into contact with other device constituent members. Further, the member 13a is guided by the guide groove +5a of the package fixing jig I5 and the side plates 23.degree. 24, and is finely moved by the fine adjustment screw 14. Next, the clamp claw 20 is fixed to the package fixing base 15 with screws 21. At this stage, the clamp claws 20 are only temporarily fixed so that the package can be moved by the package fixing table 13. Next, attach the reference block 22 to the screw 16.1.
7 to fix the package on the package fixing stand] 5. At this time, the package fixing base 13 is lowered so that the end 22a of the reference block 22 does not come into contact with the package 1.

When the fixation of the reference block 22 is completed, the fine adjustment screw 14
to move the package fixing table I3 upward. As the package fixing table 13 moves, the package approaches the end 22a of the reference block 22, and then the chip bonding surface B of the package I comes into contact with the end 22a. The package fixing table 13 is raised until the B side uniformly contacts the end 22a, but when the B side contacts one point on the end 22a, the member 13a is raised. 3b rotates and slides, and the B surface uniformly contacts the end portion 22a.

Here, the bottom surface G of the package fixing jig 15 and the end portion 22
The upper surface of a is pre-ground so that the parallelism is 0.01 m or less, and the distance between the G surface and the first surface is also measured in advance, and the number of times the reference block 22 is attached and detached is Dimensional control can be performed with good reproducibility regardless of the size. Therefore, through the package fixing process described above, the B side of the package 1 is fixed to the G side with a dimension of H and a parallelism of approximately O, O]ItII. Next, by further tightening the screw 21, the package I is secured to the package fixing base 13 using the clamp claw 20.
Fixed to. Through this operation, the package 1 which had been clamped and fixed by the reference block 22 and the package fixing base 13 is now fixed by the package fixing base 13 and the clamp claws 18 and 20. Finally, when the reference block 22 is removed, fixing of the package is completed. In actual grinding, the package fixing jig 15 may be electromagnetically fixed to a magnetic table of a surface grinder, and processing may be performed in a conventional manner.

FIG. 5 is an explanatory diagram showing an example in which this embodiment is further developed. As is clear from the figure, this is a device in which a large number of the devices described in FIG. Since it is pre-ground to a diameter of .010 or less, and the distance between the two surfaces is also measured in advance, it is possible to grind a large number of packages at once with high precision.

<Effects of the Invention> As explained above, according to the present invention, since grinding can be performed using the chip bonding surface of the package as a reference, highly accurate dimensional control is possible without being affected by dimensional shrinkage or warping of the material. Furthermore, it is possible to easily perform high-precision processing on a large number of products at the same time, and extremely high-precision packages can be provided with high efficiency. Further, although this embodiment relates to a package without leads, it goes without saying that the same effect can be obtained for a package with leads.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram of a package grinding device showing an embodiment of the present invention, FIG. 2 is an explanatory diagram showing the schematic configuration of a conventional solid-state imaging semiconductor device, and FIG. 3 is a conventional solid-state imaging semiconductor device. FIG. 4 is an explanatory diagram showing an example of a conventional grinding apparatus, and FIG. 5 is an explanatory diagram of a package grinding apparatus according to an embodiment of the present invention. In the figure, l is the package, 2 is the chip, 3 is the filter, 4 is the lid, 5 is the lead, 6 is the grinding wheel, 7 is the package fixing jig, 8 is the magnetic table, 9, 10, 1
8 and 20 are clamp claws, 11, 12, 19, and 21 are screws for fixing clamp claws, 13 is a package fixing base, 14 is a fine adjustment screw for the package fixing base, I5 and 28 are package fixing jigs, and 1617 is a standard. Screws for fixing the block, 2
2 and 27 are reference blocks, 23 and 24 are side plates, 25 and 2
6 indicates a screw for fixing the side plate. Agent Patent attorney Takeshi Sugiyama (and 1 other person) Figure 2 Figure 3

Claims (2)

[Claims] (1) In semiconductor device package grinding equipment,
It consists of a package fixing jig for fixing the package, a package fixing stand included in the package fixing jig, and a reference block for positioning the processing reference surface of the package, and the package is fixed to the package fixing jig. At this time, press the chip bonding surface of the package against the positioning reference surface of the reference block to position and fix it.
A semiconductor device package grinding device characterized in that grinding is performed using a chip bonding surface as a processing reference surface. (2) When fixing multiple packages to a package fixing jig, press the chip bonding surface of each package against the positioning reference surface of the reference block, position and fix it in the same plane, and then chip bond the multiple packages. The semiconductor device package grinding apparatus according to claim 1, characterized in that the grinding process is performed simultaneously using a surface as a processing reference plane.