JPS6357758U - - Google Patents
Info
- Publication number
- JPS6357758U JPS6357758U JP1986151676U JP15167686U JPS6357758U JP S6357758 U JPS6357758 U JP S6357758U JP 1986151676 U JP1986151676 U JP 1986151676U JP 15167686 U JP15167686 U JP 15167686U JP S6357758 U JPS6357758 U JP S6357758U
- Authority
- JP
- Japan
- Prior art keywords
- light receiving
- receiving element
- photocoupler device
- step portion
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Description
第１図ａ，ｂは本考案による半導体フオトカプ
ラー装置の一実施例を示す要部斜視図、その断面
図、第２図、第３図は本考案の他の実施例を示す
要部斜視図、第４図、第５図は従来の半導体フオ
トカプラー装置を説明する図、第６図ないし第８
図は従来の半導体フオトカプラー装置の問題点を
説明する図である。 １……発光用赤外ＬＥＤチツプ（発光素子）、
２……受光用チツプ（受光素子）、３……発光素
子搭載用フレーム、４……受光素子搭載用フレー
ム、４ａ……リードパツド、４ａ′……段差部、
４ｂ……受光素子搭載パツド、５……光透過パイ
プ、６……モールド樹脂、７，８……配線。
ラー装置の一実施例を示す要部斜視図、その断面
図、第２図、第３図は本考案の他の実施例を示す
要部斜視図、第４図、第５図は従来の半導体フオ
トカプラー装置を説明する図、第６図ないし第８
図は従来の半導体フオトカプラー装置の問題点を
説明する図である。 １……発光用赤外ＬＥＤチツプ（発光素子）、
２……受光用チツプ（受光素子）、３……発光素
子搭載用フレーム、４……受光素子搭載用フレー
ム、４ａ……リードパツド、４ａ′……段差部、
４ｂ……受光素子搭載パツド、５……光透過パイ
プ、６……モールド樹脂、７，８……配線。
Claims (1)
- 受光素子搭載フレームのリードパツド部の一部
に、配線を係止する段差部を設けたことを特徴と
する半導体フオトカプラー装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986151676U JPS6357758U (ja) | 1986-10-01 | 1986-10-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986151676U JPS6357758U (ja) | 1986-10-01 | 1986-10-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6357758U true JPS6357758U (ja) | 1988-04-18 |
Family
ID=31068962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986151676U Pending JPS6357758U (ja) | 1986-10-01 | 1986-10-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6357758U (ja) |
-
1986
- 1986-10-01 JP JP1986151676U patent/JPS6357758U/ja active Pending