JPH0247053U - - Google Patents
Info
- Publication number
- JPH0247053U JPH0247053U JP1988126433U JP12643388U JPH0247053U JP H0247053 U JPH0247053 U JP H0247053U JP 1988126433 U JP1988126433 U JP 1988126433U JP 12643388 U JP12643388 U JP 12643388U JP H0247053 U JPH0247053 U JP H0247053U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- circuit chip
- base ribbon
- packaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の第１の実施例の断面図、第２
図は本考案の第２の実施例に放熱板を取付けた断
面図、第３図は従来の一例の断面図である。 １，１１……ベースリボンのマウント部、２，
１２……ベースリボンのリード部、３，１３……
半導体ＩＣチツプ、４，１４……ボンデイングワ
イヤ、５，１５……樹脂パツケージ、６……放熱
板。
図は本考案の第２の実施例に放熱板を取付けた断
面図、第３図は従来の一例の断面図である。 １，１１……ベースリボンのマウント部、２，
１２……ベースリボンのリード部、３，１３……
半導体ＩＣチツプ、４，１４……ボンデイングワ
イヤ、５，１５……樹脂パツケージ、６……放熱
板。
Claims (1)
- フラツトパツケージ用ベースリボンの半導体集
積回路チツプをマウントする部分を受皿形に整形
し、その内側に半導体集積回路チツプをマウント
し外側面をパツケージ表面の一部としトランスフ
アモールドパツケージングしたことを特徴とする
半導体集積回路。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988126433U JPH0247053U (ja) | 1988-09-27 | 1988-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988126433U JPH0247053U (ja) | 1988-09-27 | 1988-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0247053U true JPH0247053U (ja) | 1990-03-30 |
Family
ID=31377953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988126433U Pending JPH0247053U (ja) | 1988-09-27 | 1988-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0247053U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08500U (ja) * | 1990-12-17 | 1996-03-12 | 定男 山口 | 自動車の保護シート |
-
1988
- 1988-09-27 JP JP1988126433U patent/JPH0247053U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08500U (ja) * | 1990-12-17 | 1996-03-12 | 定男 山口 | 自動車の保護シート |