JPS6358399B2 - - Google Patents
Info
- Publication number
- JPS6358399B2 JPS6358399B2 JP56147037A JP14703781A JPS6358399B2 JP S6358399 B2 JPS6358399 B2 JP S6358399B2 JP 56147037 A JP56147037 A JP 56147037A JP 14703781 A JP14703781 A JP 14703781A JP S6358399 B2 JPS6358399 B2 JP S6358399B2
- Authority
- JP
- Japan
- Prior art keywords
- chute
- magazine
- handler
- connection point
- compressed air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chutes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ICを例えばソケツトに自動的に着
脱して試験を行うのに用いるICハンドラの受入
部と送出部のそれぞれに、試験すべきICの供給
用マガジン及び試験済みのIC取出用マガジンの
接続部で、ハンドラ側シユートと前記マジガンと
の間のずれ等のために生ずるICの詰まりを自動
的に解除する装置に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a test device for each of the receiving section and sending section of an IC handler used for automatically attaching and detaching an IC to and from a socket for testing. This invention relates to a device that automatically releases IC jams that occur due to misalignment between the chute on the handler side and the magic gun at the connection between an IC supply magazine and a tested IC removal magazine.
ICの量産に際し、例えばIC試験機のソケツト
へのICの着脱をICハンドラに自動的に行わせる
が、その場合、ICの運搬等については、試験前
のIC、試験後のICのいずれも、それぞれ多数の
ICを例えばリードピンをガイドにした走路等に
順次滑走可能な状態に収納できるマガジンにて行
う。そして、量産を行う現場においては上記した
マガジンも多数必要となるものであることから、
マガジンは例えばアルミニウム板等をプレス成形
して製作するが、プレス成形後の断面形状には多
少のばらつき(例えば設計最大値±0.3mm)が生
ずることがあり、また、使用中にもマガジンに次
第に断面形状の狂いが生ずることもある。
When mass producing ICs, for example, the IC handler automatically attaches and detaches the ICs to the sockets of the IC testing machine. a large number of each
The IC is carried out in a magazine that can be stored in a state in which it can slide one after another on a runway using lead pins as a guide, for example. And, since a large number of the magazines mentioned above are required at mass production sites,
Magazines are manufactured by press-forming, for example, aluminum plates, but there may be some variation in the cross-sectional shape after press-forming (for example, the design maximum value ±0.3 mm), and the magazine may gradually change during use. Misalignment of the cross-sectional shape may also occur.
供給側マガジンは、ハンドラの受入部シユート
と同程度傾斜させて、前記シユートと接続配設し
て、多数個のICは前記の傾斜により重力にて滑
走してマガジンからハンドラへ供給される。ま
た、取出し側マガジンは、ハンドラの送出部シユ
ートと同程度傾斜させて接続配設して、ICが順
次重力により滑走してハンドラからマガジンへ装
填されるようにされる。 The supply side magazine is inclined to the same extent as the receiving chute of the handler and is connected to the chute, and a large number of ICs are slid by gravity due to the above-mentioned inclination and are supplied from the magazine to the handler. Further, the take-out side magazine is connected and arranged to be inclined to the same extent as the delivery chute of the handler, so that the ICs are sequentially slid by gravity and loaded from the handler into the magazine.
第1図は前記したハンドラとマガジンとの接続
配設状態と、IC滑走経路(矢印)を示す概略図
で、これを説明すると、図中1はICハンドラ、
2は前記ICハンドラのIC受入部シユート、3は
供給側マガジンであり、該供給側マガジン3は、
当初、図示しないマガジンスタツカーに一点鎖線
で示すように水平に多数個積重ねて供給され、ス
タツカ底部から順次1個ずつ自動的に取出され前
記ICハンドラのIC受入部シユート2と同角度で
傾斜した供給位置に配設される。4はハンドラの
送出部シユート、5は前記のハンドラの送出部シ
ユートと同角度で接続配設された取出し側マガジ
ン、6はICソケツトで、ICはハンドラにより自
動的に前記ICソケツト6に着脱され、該ソケツ
ト6とICハンドラ1の外部に設置されるIC試験
装置(図示しない)間は記線7で接続されてい
る。 FIG. 1 is a schematic diagram showing the connection and arrangement of the handler and magazine described above and the IC sliding path (arrow). To explain this, 1 in the figure is the IC handler,
2 is an IC receiving part chute of the IC handler, 3 is a supply side magazine, and the supply side magazine 3 is:
Initially, they were supplied to a magazine stacker (not shown) in a horizontal stack as shown by the dashed line, and were automatically taken out one by one from the bottom of the stacker and tilted at the same angle as the IC receiving chute 2 of the IC handler. placed in the supply position. Reference numeral 4 denotes a feed-out chute of the handler, 5 a take-out magazine connected and arranged at the same angle as the feed-out chute of the handler, 6 an IC socket, and the IC is automatically attached to and removed from the IC socket 6 by the handler. A marking line 7 connects the socket 6 and an IC testing device (not shown) installed outside the IC handler 1.
なお、図中のA,Bで示したのは、それぞれ、
供給側マガジン3とハンドラ受入部シユート2と
の接続箇所及びハンドラ送出部シユート4と取出
し側マガジン5との接続箇所である。 Note that A and B in the figure are, respectively,
These are the connection points between the supply side magazine 3 and the handler reception chute 2, and the connection points between the handler delivery side chute 4 and the takeout side magazine 5.
前記したハンドラの受入部シユート2及び送出
部シユート4は、十分に強度、剛性の高い素材例
えば剛性を切削加工して高精度に仕上げ、更に硬
質クロムめつきを施したのちバフ研摩して滑り易
く作つてある。したがつてハンドラ1内走路のど
こかにICがひつかかつて動かなくなるようなこ
と、すなわち、ICが詰まりを生ずることは、実
質的に皆無である。しかしながら、前記したハン
ドラの受入部シユート2と供給側マガジン3との
接続箇所A及びハンドラの送出部シユート4と取
出し側マガジン5との接続箇所Bでは、前述した
ように、マガジンの断面形状には、ばらつき、変
形があり、そのため各位置におけるマガジン保持
装置(図示せず)との間に生ずる相対位置ずれ等
のため、絶対値としては、僅小ではあるが、マガ
ジン側のIC走路とシユート側のIC走路との間に
多小のずれが生じている。また、ICがマガジン
やシユート内の走路を滑走するためには、走路壁
面と、IC側でガイドとなるリードピンやパツケ
ージ外面との間に多少のゆとりが必要で、個々の
ICは走路に対し各個にそれぞれ僅かに異なつた
相対姿勢、位置をとつて滑走する。結局、前記し
た接続箇所A,B部では前記の走路のずれ、IC
と走路間のゆとりによる姿勢のばらつきなどに起
因して、ICが接続箇所A,Bのどこかに引つ掛
かり動かなくなる。すなわちIC詰まりが生ずる
ことがある。このため、従来より前記した接続箇
所でIC詰まりが生じたことを検出するセンサを
備え、センサがIC詰まりを検出した際にはその
都度、入手によつてIC詰まりを解除していたが、
ときにはIC詰まりが高頻度に発生することもあ
つて、ハンドラの全自動運転にはほど遠いという
問題があつた。 The receiving part chute 2 and the sending part chute 4 of the handler described above are made of a material with sufficient strength and rigidity, for example, by cutting the rigid material, finishing it with high precision, plating it with hard chrome, and then buffing it to make it easy to slip. It's made. Therefore, there is virtually no chance that the IC will become stuck somewhere on the running path within the handler 1, that is, there will be no chance that the IC will become clogged. However, at the connection point A between the receiving chute 2 of the handler and the supply side magazine 3 and the connection point B between the handler sending out chute 4 and the ejection side magazine 5, as described above, the cross-sectional shape of the magazine is , variations, and deformations, and due to relative positional deviations that occur between the magazine holding device (not shown) at each position, the absolute value is small, but the difference between the IC running path on the magazine side and the chute side There are some deviations between the two IC routes. In addition, in order for the IC to slide on the runway inside the magazine or chute, there must be some space between the runway wall and the lead pins and package cage outer surface that serve as guides on the IC side.
Each IC glides in a slightly different relative attitude and position to the runway. In the end, at the connection points A and B, the above-mentioned deviation of the running path and the IC
Due to variations in posture due to clearance between the IC and the track, the IC gets stuck somewhere between connection points A and B and becomes stuck. In other words, IC clogging may occur. For this reason, conventionally, a sensor was provided to detect the occurrence of an IC blockage at the connection point described above, and each time the sensor detected an IC blockage, the IC blockage was cleared by obtaining one.
At times, IC clogging occurred frequently, and the handler was far from fully automatic operation.
本発明は、前記した問題点を解決し、例え、シ
ユートとマガジンの接続箇所においてIC詰まり
が生じても、IC詰まり検出センサと連動して、
人手を介せず自動的に前記の詰まりを解除できる
ICハンドラ詰まり解除装置の提供を目的とする
ものである。
The present invention solves the above-mentioned problems, and even if an IC jam occurs at the connection point between the chute and the magazine, the invention works in conjunction with an IC jam detection sensor to
The above-mentioned blockage can be automatically cleared without human intervention.
The purpose of this invention is to provide an IC handler jam release device.
本発明のICハンドラの詰まり解除装置は、前
記の目的を達成するために、ICの受入部並びに
送出部に、それぞれシユートを備え、該それぞれ
のシユートに多数個のICを順次滑走可能な状態
に収納できるマガジンを交換自在に接続配置した
ICハンドラにおいて、
前記シユートとマガジンの接続箇所に向けて下
方より圧縮空気を噴出せしめる噴出孔をシユート
に穿設し、前記接続箇所においてICの詰まりが
検出されたとき、前記噴出孔より前記接続箇所で
詰まりを生じているICの先端を浮き上がらすよ
うに下方より間欠的に空気を噴出せしめて該IC
の位置、姿勢を変化させるようにしたことをその
特徴とするものである。
In order to achieve the above-mentioned object, the IC handler clogging release device of the present invention is provided with a chute in each of the IC receiving section and the sending section, and allows a large number of ICs to slide in sequence in each chute. The magazines that can be stored are connected and arranged so that they can be exchanged freely.
In the IC handler, an ejection hole is provided in the chute for ejecting compressed air from below toward the connection point between the chute and the magazine, and when a clogging of the IC is detected at the connection point, the ejection hole releases compressed air from the connection point. Air is intermittently blown from below to lift the tip of the clogged IC.
The feature is that the position and posture of the robot can be changed.
本発明に係るICハンドラの詰まり解除装置は、
シユートとマガジンとの接続箇所に向けて下方よ
り圧縮空気を噴出せしめる噴出孔をシユートに穿
設したので、前記したシユートとマガジンの接続
箇所において、マガジンあるいはシユートを滑走
してきたICが詰まつた場合、検出センサ信号に
より、増幅器や電磁弁等を介して前記の噴出孔か
ら接続箇所において詰まりを生じているICの先
端を浮き上がらすように圧縮空気を下方より間欠
的に噴出させて、前記の詰まりを生じているIC
の姿勢、位置を変化させ、引つ掛つている状態か
ら解除し、ICを滑走せしめるものである。
The IC handler clogging release device according to the present invention includes:
Since the chute has a blowout hole that blows out compressed air from below toward the connection point between the chute and the magazine, if the magazine or an IC that has slid through the chute becomes clogged at the connection point between the chute and the magazine, , In response to the detection sensor signal, compressed air is intermittently jetted from below through an amplifier, solenoid valve, etc. from the above-mentioned blowout hole so as to lift up the tip of the IC that is clogged at the connection point, and remove the clog. IC causing
This changes the attitude and position of the IC, releases it from the stuck state, and allows the IC to slide.
本発明の実施例を図面に基づいて説明する。 Embodiments of the present invention will be described based on the drawings.
第2図は、IC供給側の第1図中のA部に実施
した例を示し、先に説明した第1図と同一又は均
等な部材は同一符号で示してある。 FIG. 2 shows an example implemented in part A in FIG. 1 on the IC supply side, and the same or equivalent members as those in FIG. 1 described above are indicated by the same symbols.
2はハンドラ受入部シユートで、該受入部シユ
ート2に同角度で供給側マガジン3が接続配設さ
れており、該供給側マガジン3の断面形状は右上
部に示してある。8は前記受入部シユート2と供
給側マガジン3との接続箇所に向けて下方より空
気を噴出せしめるために受入部シユート2に穿設
された圧縮空気噴出孔、9は前記噴出孔8に至る
管路に設けられた絞り弁、10は前記絞り弁9に
連結される圧縮空気配管であり、11は、前記受
入部シユート2と供給側マガジン3との接続箇所
において詰まりを生じているIC、12は供給側
マガジン自動配置機構ベースである。 2 is a handler receiving chute, and a supply magazine 3 is connected to the receiving chute 2 at the same angle, and the cross-sectional shape of the supply magazine 3 is shown in the upper right corner. Reference numeral 8 denotes a compressed air blowout hole formed in the receiving chute 2 to blow out air from below toward the connection point between the receiving chute 2 and the supply side magazine 3, and 9 a pipe leading to the blowout hole 8. 10 is a compressed air pipe connected to the throttle valve 9; 11 is an IC that is clogged at the connection point between the receiving chute 2 and the supply magazine 3; is based on the supply side magazine automatic placement mechanism.
本実施例は、上記のように構成されるので、多
数のICが順次供給側マガジン3の供給側より前
記供給側マガジン3に供給され該マガジン3内を
滑走し、受入部シユート2へと引き継ぐが、本実
施例の場合は、ICは、供給側マガジン3中のレ
ール3a、受入部シユート2中のレール2aのよ
うに、内部に突出させた部分をリードピンで抱い
て馬乗りになつた形で滑走するが、前記した接続
箇所において、ICが詰まり、詰まり検出センサ
の信号が図示しない圧縮空気噴出装置を作動せし
めて、例えば圧縮空気を3回繰返して瞬間的(パ
ルス的)に受入部シユート2に穿設した噴出孔8
より前記した詰まりを生じているICの先端を浮
き上がらすように圧縮空気を下方より噴出させて
前記のICの姿勢、位置等を変化させ、引つ掛か
り状態とより解除し、ICを受入部シユート2内
に滑走するようにする。噴出せしめる圧縮空気噴
出量は絞り弁9で調整するが、噴出によつてIC
が0.5〜1.2mm程度浮上するようにしたところ、IC
の詰まりは常に確実に解除することができた。 Since the present embodiment is configured as described above, a large number of ICs are sequentially supplied from the supply side of the supply side magazine 3 to the supply side magazine 3, slide inside the magazine 3, and are taken over to the receiving chute 2. However, in the case of this embodiment, the IC is mounted on a horse by holding the internally protruding parts with lead pins, such as the rail 3a in the supply magazine 3 and the rail 2a in the receiving chute 2. However, when the IC gets clogged at the connection point mentioned above, the signal from the clog detection sensor activates a compressed air blowing device (not shown), which instantly (pulses) blows the compressed air three times. Nozzle hole 8 drilled in
Compressed air is ejected from below to lift the tip of the clogged IC as described above, change the attitude and position of the IC, release the jammed state, and remove the IC from the receiving section. Try to ski within 2. The amount of compressed air that is ejected is adjusted by the throttle valve 9, but the amount of compressed air that is ejected is adjusted by the
When the IC was made to float by about 0.5 to 1.2 mm, the IC
The blockage could always be cleared reliably.
本発明に係るICハンドラの詰まり解除装置は、
シユートとマガジンとの接続箇所に向けて下方よ
り圧縮空気を噴出せしめる噴出孔をシユートに穿
設したので、前記した接続箇所において、マガジ
ンあるいはシユートを滑走してきたICが詰まつ
た場合、検出センサ信号により前記の噴出孔より
圧縮空気を詰まりを生じているICの先端を浮き
上がらせるように下方から間欠的に噴出させて詰
まりを生じているICの姿勢、位置を変化させて
引つ掛り状態を解除するもので、比較的簡単、安
価な装置で、ICに無理な力を加えることなく、
ハンドラのシユートとマガジンの接続箇所におけ
るICの詰まりを自動的に解除できるものである。
The IC handler clogging release device according to the present invention includes:
Since a blowout hole is drilled in the chute to blow out compressed air from below toward the connection point between the chute and the magazine, if an IC that has slid through the magazine or chute becomes clogged at the connection point, the detection sensor signal Compressed air is intermittently ejected from below from the above-mentioned nozzle so as to lift the tip of the clogged IC, thereby changing the posture and position of the clogged IC and releasing the stuck condition. It is a relatively simple and inexpensive device that does not apply excessive force to the IC.
It can automatically clear the jammed IC at the connection point between the handler's chute and the magazine.
第1図はハンドラとマガジンとの接続配設状態
とIC滑走経路を示す概略図、第2図は本発明の
実施例を示す説明図である。
1:ハンドラ、2:ハンドラ受入部シユート、
3:供給側マガジン、4:ハンドラ送出部シユー
ト、5:取出し側マガジン、6:ICソケツト、
8:圧縮空気噴出孔、11:詰まつたIC。
FIG. 1 is a schematic diagram showing the state of connection and arrangement of a handler and a magazine and an IC sliding path, and FIG. 2 is an explanatory diagram showing an embodiment of the present invention. 1: Handler, 2: Handler reception department shoot,
3: Supply side magazine, 4: Handler delivery section chute, 5: Ejection side magazine, 6: IC socket,
8: Compressed air outlet, 11: Clogged IC.
Claims (1)
ートを備え、該それぞれのシユートに多数個の
ICを順次滑走可能な状態に収納できるマガジン
を交換自在に接続配置したICハンドラにおいて、 前記シユートとマガジンの接続箇所に向けて下
方より圧縮空気を噴出せしめる噴出孔をシユート
に穿設し、前記接続箇所においてICの詰まりが
検出されたとき、前記噴出孔より前記接続箇所で
詰まりを生じているICの先端を浮き上がらすよ
うに下方より間欠的に空気を噴出せしめて該IC
の位置、姿勢を変化させるようにしたことを特徴
とするICハンドラの詰まり解除装置。[Claims] 1. The receiving section and sending section of the IC are each provided with a chute, and each chute has a plurality of chute.
In an IC handler in which a magazine capable of storing ICs in a sequentially slidable manner is connected and arranged in a replaceable manner, an ejection hole is bored in the chute to blow out compressed air from below toward the connection point between the chute and the magazine, and When a blockage of the IC is detected at the connection point, air is intermittently jetted from below so as to lift the tip of the IC that is clogged at the connection point from the jet hole.
An IC handler jam release device characterized by changing the position and posture of the IC handler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14703781A JPS5850757A (en) | 1981-09-19 | 1981-09-19 | Plugged ic releasing handler mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14703781A JPS5850757A (en) | 1981-09-19 | 1981-09-19 | Plugged ic releasing handler mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5850757A JPS5850757A (en) | 1983-03-25 |
| JPS6358399B2 true JPS6358399B2 (en) | 1988-11-15 |
Family
ID=15421091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14703781A Granted JPS5850757A (en) | 1981-09-19 | 1981-09-19 | Plugged ic releasing handler mechanism |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5850757A (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59182998U (en) * | 1983-05-23 | 1984-12-06 | 九州日本電気株式会社 | Semiconductor element moving device |
| JPS619898U (en) * | 1984-06-25 | 1986-01-21 | 富士通株式会社 | Inclined automatic feeder for semiconductor equipment |
| JPS6153799A (en) * | 1984-08-23 | 1986-03-17 | 松下電器産業株式会社 | Part supplying device |
| JPS61206507U (en) * | 1985-06-17 | 1986-12-26 | ||
| JPS62235104A (en) * | 1986-03-18 | 1987-10-15 | Fujitsu Ltd | Ic housing device |
| IT1223264B (en) * | 1987-12-11 | 1990-09-19 | Solari Udine Spa | ARRIVAL AND POSITIONING STATION FOR ELECTRIC AXIAL COMPONENTS |
| KR20040013241A (en) * | 2002-08-05 | 2004-02-14 | 권석창 | Feeding apparatus for integrated circuit materials |
| JP4636539B2 (en) * | 2005-04-25 | 2011-02-23 | 株式会社山武 | Sensor amplifier |
| JP4972517B2 (en) * | 2007-10-23 | 2012-07-11 | 株式会社テセック | Self falling handler |
| JP2014080291A (en) * | 2012-09-28 | 2014-05-08 | Toray Precision Kk | Floating conveyance system and floating conveyance method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5117382Y2 (en) * | 1971-06-09 | 1976-05-11 | ||
| JPS5311813B2 (en) * | 1974-11-22 | 1978-04-25 | ||
| JPS5232274A (en) * | 1975-09-05 | 1977-03-11 | Kokusai Electric Co Ltd | Equipment to mount ic on measurement socket |
| JPS54127384U (en) * | 1978-02-27 | 1979-09-05 |
-
1981
- 1981-09-19 JP JP14703781A patent/JPS5850757A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5850757A (en) | 1983-03-25 |
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