JPS6359370U - - Google Patents

Info

Publication number
JPS6359370U
JPS6359370U JP15333786U JP15333786U JPS6359370U JP S6359370 U JPS6359370 U JP S6359370U JP 15333786 U JP15333786 U JP 15333786U JP 15333786 U JP15333786 U JP 15333786U JP S6359370 U JPS6359370 U JP S6359370U
Authority
JP
Japan
Prior art keywords
semiconductor device
resin layer
metal plate
circuit
conductor pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15333786U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15333786U priority Critical patent/JPS6359370U/ja
Publication of JPS6359370U publication Critical patent/JPS6359370U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の実施例による半導体装置の
構成斜視図、第２図は第１図の部分断面側視図、
第３図は従来における半導体装置の構成斜視図で
ある。各図において、 １：金属板、２：絶縁樹脂層、２ａ，２ｂ，２
ｃ：樹脂層の分割ブロツク、３：絶縁金属基板、
４，５，６：実装回路、７ａ，７ｂ，７ｃ：アー
スラインの導体パターン、８：樹脂層の切欠溝、
９：アース接続用の導電物、Ｅ：アース接続部。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 金属板と絶縁樹脂層との成層体として成る
    絶縁金属基板上に複数の回路を実装した半導体装
    置において、前記樹脂層を各回路ブロツク単位に
    分割して各回路ブロツクの相互間を切り離すとと
    もに、各回路ブロツク毎に実装回路から引き出し
    たアースラインの導体パターンを個別に金属板へ
    導電接続してアースを取るように構成したことを
    特徴とする半導体装置。 (2) 実用新案登録請求の範囲第１項記載の半導
    体装置において、各回路ブロツク毎にアース接続
    位置に対応して樹脂層に穴を開口し、該穴内に導
    電物を充填してアースラインの導体パターンと金
    属板との間を導電接続したことを特徴とする半導
    体装置。
JP15333786U 1986-10-06 1986-10-06 Pending JPS6359370U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15333786U JPS6359370U (ja) 1986-10-06 1986-10-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15333786U JPS6359370U (ja) 1986-10-06 1986-10-06

Publications (1)

Publication Number Publication Date
JPS6359370U true JPS6359370U (ja) 1988-04-20

Family

ID=31072128

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15333786U Pending JPS6359370U (ja) 1986-10-06 1986-10-06

Country Status (1)

Country Link
JP (1) JPS6359370U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0217847U (ja) * 1988-07-20 1990-02-06

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS536876A (en) * 1976-07-08 1978-01-21 Matsushita Electric Industrial Co Ltd Hybrid integrated circuit and method of producing same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS536876A (en) * 1976-07-08 1978-01-21 Matsushita Electric Industrial Co Ltd Hybrid integrated circuit and method of producing same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0217847U (ja) * 1988-07-20 1990-02-06

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