JPS6361132U - - Google Patents
Info
- Publication number
- JPS6361132U JPS6361132U JP15588986U JP15588986U JPS6361132U JP S6361132 U JPS6361132 U JP S6361132U JP 15588986 U JP15588986 U JP 15588986U JP 15588986 U JP15588986 U JP 15588986U JP S6361132 U JPS6361132 U JP S6361132U
- Authority
- JP
- Japan
- Prior art keywords
- templates
- sealing
- plate
- parting surfaces
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
第１図および第２図は本考案に係る半導体装置
の樹脂封止装置における型締め状態と型開き状態
を示す断面図、第３図は他の実施例を示す断面図
、第４図は従来の半導体装置の樹脂封止装置を示
す断面図である。
２１，２２……型板、２５，２６……キヤビテ
イ、２７，２８……チエイスブロツク、３０，３
１……環状溝、３２，３３……シールリング、３
４……シール板。
1 and 2 are cross-sectional views showing the mold-clamping state and the mold-opening state in the resin sealing device for semiconductor devices according to the present invention, FIG. 3 is a cross-sectional view showing another embodiment, and FIG. 4 is the conventional one. FIG. 2 is a cross-sectional view showing a resin sealing device for a semiconductor device. 21, 22... template, 25, 26... cavity, 27, 28... chase block, 30, 3
1... Annular groove, 32, 33... Seal ring, 3
4...Seal plate.
Claims (1)
ヤビテイを有する２つの型板と、これら両型板の
周囲に進退自在に設けられ両パーテイング面間を
封止可能な環状のシール板とを備え、このシール
板と前記各型板との間に両パーテイング面間の封
止状態において圧接されるシールリングを介装し
たことを特徴とする半導体装置の樹脂封止装置。 This seal comprises two templates each having a cavity that forms a package for sealing a semiconductor chip, and an annular sealing plate that is provided around these templates so as to be able to move forward and backward and is capable of sealing between both parting surfaces. A resin sealing device for a semiconductor device, characterized in that a seal ring is interposed between the plate and each of the templates to be pressed in a sealed state between both parting surfaces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15588986U JPH0648842Y2 (en) | 1986-10-09 | 1986-10-09 | Resin encapsulation equipment for semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15588986U JPH0648842Y2 (en) | 1986-10-09 | 1986-10-09 | Resin encapsulation equipment for semiconductor devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6361132U true JPS6361132U (en) | 1988-04-22 |
| JPH0648842Y2 JPH0648842Y2 (en) | 1994-12-12 |
Family
ID=31076999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15588986U Expired - Lifetime JPH0648842Y2 (en) | 1986-10-09 | 1986-10-09 | Resin encapsulation equipment for semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648842Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04350949A (en) * | 1991-05-28 | 1992-12-04 | Toowa Kk | Resin sealed molded device for electronic component |
-
1986
- 1986-10-09 JP JP15588986U patent/JPH0648842Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04350949A (en) * | 1991-05-28 | 1992-12-04 | Toowa Kk | Resin sealed molded device for electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0648842Y2 (en) | 1994-12-12 |
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