JPS636144B2 - - Google Patents

Info

Publication number
JPS636144B2
JPS636144B2 JP56026525A JP2652581A JPS636144B2 JP S636144 B2 JPS636144 B2 JP S636144B2 JP 56026525 A JP56026525 A JP 56026525A JP 2652581 A JP2652581 A JP 2652581A JP S636144 B2 JPS636144 B2 JP S636144B2
Authority
JP
Japan
Prior art keywords
refrigerant
module
shielding plate
cooling module
heating element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56026525A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57141945A (en
Inventor
Nobuo Kamehara
Kishio Yokochi
Koichi Niwa
Kyohei Murakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56026525A priority Critical patent/JPS57141945A/ja
Publication of JPS57141945A publication Critical patent/JPS57141945A/ja
Publication of JPS636144B2 publication Critical patent/JPS636144B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP56026525A 1981-02-25 1981-02-25 Cooling module Granted JPS57141945A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56026525A JPS57141945A (en) 1981-02-25 1981-02-25 Cooling module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56026525A JPS57141945A (en) 1981-02-25 1981-02-25 Cooling module

Publications (2)

Publication Number Publication Date
JPS57141945A JPS57141945A (en) 1982-09-02
JPS636144B2 true JPS636144B2 (de) 1988-02-08

Family

ID=12195890

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56026525A Granted JPS57141945A (en) 1981-02-25 1981-02-25 Cooling module

Country Status (1)

Country Link
JP (1) JPS57141945A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240093473A1 (en) * 2020-09-04 2024-03-21 Kohler Co. Eductor assisted flush toilet

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59215797A (ja) * 1983-03-24 1984-12-05 ユ−オ−ピ−・インコ−ポレ−テツド 増強核沸騰面テ−プ及び電子部品の冷却
JPH0414248A (ja) * 1990-04-27 1992-01-20 Digital Equip Corp <Dec> マルチチップユニットの半導体チップのための独立熱抽出装置とマルチチップユニットの半導体チップを冷却する方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240093473A1 (en) * 2020-09-04 2024-03-21 Kohler Co. Eductor assisted flush toilet

Also Published As

Publication number Publication date
JPS57141945A (en) 1982-09-02

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