JPS6362829B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for integrally bonding synthetic resin parts to a metal substrate, which facilitates the arrangement of parts and allows miniaturization of equipment.

In recent years, in electronic equipment such as tape recorders,
Parts made of synthetic resin such as polyacetal are integrally molded onto a metal board, and as a result, parts such as various bearings, which were conventionally attached to the board individually, can be joined to the board with a single synthetic resin molding. The number of points and man-hours have been significantly reduced. When molding these synthetic resin parts integrally with a board, it is common to mold multiple synthetic resin parts at the same time.In this case, for example, if you try to mold multiple bearings from one resin injection gate, A runner that serves as a resin passage is integrally formed between the multiple bearings, and although this runner is normally formed in close contact with the surface of the board, the presence of this runner allows it to adhere to the surface of the board. This causes the inconvenience that other components such as levers and rods cannot be closely arranged.

Conventionally, in order to eliminate such inconvenience, the first method was
As shown in Fig. 3, a long hole 2 is formed in a metal substrate 1, and a runner 5 between bearings 3 and 4, which is integrally molded at both ends of the long hole 2, is formed in the long hole 2. However, in such a method, the strength of the substrate 1 itself decreases due to the formation of the long holes 2, and the synthetic resin Since the bearings shrink during hardening, the distance between the bearings 3 and 4 changes, resulting in poor dimensional accuracy.
Note that 6 is a runner formed by a passage that supplies resin to the bearings 3, 4, etc.

The present invention is intended to eliminate such conventional drawbacks, and one embodiment thereof will be described below with reference to FIGS. 4 to 7.

First, the metal substrate 7 used in the present invention has a fourth
As shown in the figure, holes 8 and 9 are provided at positions where synthetic resin parts such as bearings are integrally molded, and the holes 8 and 9 communicate with the end surface of the substrate 7 through cutouts 10 and 11. ing.

The substrate 7 is inserted into a mold device consisting of an upper mold and a lower mold, and the holes 8 and 9 are filled by injecting synthetic resin from the resin injection gate of the mold.
Depending on the shape of the mold, synthetic resin parts 12, 1
3 is integrally molded onto the substrate 7 as shown in FIGS. 5 and 6. In this case, synthetic resin parts 12,
The resin passage between the holes 13 is formed by the notches 10 and 11 formed in the substrate 7 and the space formed in the mold along the end surface of the substrate 7 between the notches 10 and 11. A runner 14 between the manufactured parts 12 and 13 is formed inside the notches 10 and 11 and along the end surface of the substrate 7.

Thereafter, as shown in FIG. 7, the runner 14 along the end surface of the substrate 7 is cut at the end surfaces of the notches 10 and 11, thereby removing the runner 14 protruding from the end surface of the substrate 7. Note that 15 is a runner formed by a resin passageway supplied from a resin injection gate or other synthetic resin parts.

According to the above method, the synthetic resin part 1
A plurality of synthetic resin parts can be integrally molded without forming a runner on the substrate 7 between 2 and 13, and there is no need to provide a long hole in the substrate as in the past. Therefore, there is no risk of damaging the strength of the board, and the dimensional accuracy between the synthetic resin parts 12 and 13 is maintained at high precision by the board 7 between them, and the runners remaining in the notches 10 and 11 14 part 14a, 14
b serves as a rotation stopper for the synthetic resin parts 12 and 13, so that a highly accurate board device can be obtained as a whole.

In addition, synthetic resin parts are not limited to bearings.
The same applies to other parts such as bases and guide bodies.

As described above, the present invention forms a plurality of holes in a metal substrate in advance, provides notches for communicating each hole with the end surface of the substrate, integrally molds a synthetic resin part into the hole, and synthesizes the synthetic resin parts. A runner formed by a resin passage between resin parts is formed along the notch and the end face of the board, and the runner along the end face of the board is removed by cutting. For example, a plurality of synthetic resin parts can be integrally molded with high precision without forming runners on the board surface between the synthetic resin parts or providing long holes for inserting runners in the board, Therefore, it becomes possible to arrange other components in close contact with each other on the substrate between the synthetic resin parts, thereby making it possible to downsize the device, which is highly effective.

[Brief explanation of drawings]

1 to 3 show conventional examples, in which FIG. 1 is a top view of the metal substrate, FIG. 2 is a top view of the same synthetic resin part in a molded state, and FIG. 3 is a sectional view of the same. Fourth
7 to 7 show an embodiment of the present invention, FIG. 4 is a top view of the metal substrate, FIG. 5 is a top view of the synthetic resin part in the molded state, and FIG. 6 is the same diagram. FIG. 7 is a partial sectional view and a top view with the runner removed. 7... Metal substrate, 8, 9... Hole, 10, 11
...Notch, 12, 13...Synthetic resin part, 14
……runner.

Claims (1)

[Claims] 1 A plurality of holes are formed in advance in a metal substrate, and cutouts are provided to communicate each hole with the end surface of the substrate, and synthetic resin parts are integrally molded into the holes, and the resin between the synthetic resin parts is formed. Integration of synthetic resin parts onto a metal substrate, characterized in that a runner formed by a passage is formed along the notch and the end surface of the substrate, and the runner along the end surface of the substrate is removed by cutting. How to join.