JPS6363202A - microwave integrated circuit - Google Patents

Abstract

PURPOSE:To reduce parasitic components until entering into a chip element, to obtain an excellent high frequency characteristic and to approximate an actual value to an estimated one by setting the direction of an electric field component between the electrodes of the chip element the same as that of an electric field component between a strip line on an alumina substrate and a GND. CONSTITUTION:For terminating a microstrip line with a chip capacitor, a chip resistance and the like in terms of a microwave integrated circuit, a high frequency component 7a is impressed on the negative electrode 4a of the chip element 5 through the strip line 1, for instance. The GND side communicates with the negative electrode 4b of the chip element 5 through a pattern on the back side of a substrate 2. At that time, since the direction 7a of the electric field component between the strip line and the alumina substrate is the same as that of the electric field component between the electrodes 4a and 4b of the chip element 5, there are few parasitic components. Consequently an excellent high frequency component can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the case where a microstrip line is terminated with a chip capacitor or a chip resistor in a microwave integrated circuit.

[Conventional technology]

FIG. 4 is a top view (A) showing a conventional microwave integrated circuit disclosed in, for example, Japanese Utility Model Application Publication No. 55-61301.

It is a cross-sectional view (b) showing the termination of the microstrip line. In Figure 4, (l) is a microstrip line, (2) is an alumina substrate, (4a), (4b)
) is an electrode, (b) is a chip element, (6) is a carrier, (
7) refers to the electric field component, and (8) refers to the solder.

Next, the operation will be explained. The microwave entering from the strip line (1), like the electric field component (7a), is directed in a direction perpendicular to the upper and lower surfaces of the alumina substrate. This is,
When entering the chip element (6), there is an electrode (4a).

(4b) is bent in the vertical direction (7b), and the parasitic component (7c
) occurs, the calculated value will deviate by that amount.

[Problem that the invention seeks to solve]

Since conventional microwave integrated circuits are configured as described above, calculations must be made including parasitic components, but there are some unknown and difficult points, and the high frequency characteristics are poor.

The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to obtain a microwave integrated circuit that has few parasitic components and can achieve good high frequency characteristics.

[Means for solving problems]

In the microwave integrated circuit device according to the present invention, the direction of the electric field component between the electrodes of the chip element is the same as that of the alumina substrate.
It is installed so that the direction of the electric field component between the J-tube line and GND is the same.

[Effect]

The microwave integrated circuit according to the present invention requires less extra parasitic generation until it enters the chip element, provides good high frequency characteristics, and makes actual values close to calculated values.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings. $1
The figures are a cross-sectional view (a) and a top view (b) showing a microwave integrated circuit according to an embodiment of the present invention. In Fig. 1, (1) is a strip line, (2) is a substrate, (3) ) is the gold ribbon for connection, (4) is the electrode, (6) is the chip element,
(61 is a carrier. Figure 2 represents the electric field component,
(7) is the electric field component. FIG. 3 is an equivalent circuit.

With the above configuration, the high frequency component (7a) from the strip line (1) is applied to the - electrode (4a) of the chip element (6) through the gold ribbon (3). The GND side connects the - of the chip element (5) through the pattern on the back side of the substrate (2).
It leads to the electrode (4b). At this time, the direction of the electric field component between the strip line and the alumina substrate (7a) is the same as the direction of the electric field component between the electrodes (4aL (4b)) of the chip element (6), so there are few parasitic components.

〔Effect of the invention〕

As described above, according to the present invention, in the microwave integrated circuit, the direction of the electric field component in the alumina substrate in the strip line on the input side is made to be the same as the direction of the electric field component between the electrodes of the chip element. This has the effect of reducing parasitic components and providing good high frequency components.

[Brief explanation of drawings]

Fig. 1 is a block diagram showing a microwave integrated circuit according to an embodiment of the present invention, Fig. 2 is a diagram showing its electric field components, Fig. 3 is its equivalent circuit diagram, and Fig. 4 is a diagram showing a conventional microwave circuit. FIG. In the figure, (1)... strip line, (2)...
・Substrate, (3)...gold ribbon, (4)...electrode, (
5)...Chip element, (6)...Carrier, (7)
. . . Electric field component, (8) . . . Solder In the drawings, the same reference numerals indicate the same or equivalent parts.

Claims (1)

[Claims] At the end of the microwave strip line, the line connecting the electrodes at both ends of the chip element should be parallel to the line connecting the top and bottom surfaces of the alumina substrate, so that the direction of the electric field within the alumina substrate and the direction of the electric field of the chip element are aligned. A microwave integrated circuit characterized in that the two are mounted in the same direction.