JPS6363384B2 - - Google Patents
Info
- Publication number
- JPS6363384B2 JPS6363384B2 JP57048869A JP4886982A JPS6363384B2 JP S6363384 B2 JPS6363384 B2 JP S6363384B2 JP 57048869 A JP57048869 A JP 57048869A JP 4886982 A JP4886982 A JP 4886982A JP S6363384 B2 JPS6363384 B2 JP S6363384B2
- Authority
- JP
- Japan
- Prior art keywords
- thermal head
- conductive substrate
- substrate
- predetermined portion
- driving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【発明の詳細な説明】
〔発明の技術分野〕
この発明は、駆動用ICを基板上に搭載したサ
ーマルヘツド（以下DD型サーマルヘツドと呼
ぶ）に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a thermal head (hereinafter referred to as a DD type thermal head) in which a driving IC is mounted on a substrate.
DD型サーマルヘツドは外部引出し端子数が少
なく、走査方向１ラインを同時に印字することが
できるため、従来のサーマルヘツドに比べて高速
度の印字が可能となり、高速フアクシミリやプリ
ンタ等への応用が期待されている。
The DD type thermal head has a small number of external lead-out terminals and can print one line in the scanning direction at the same time, making it possible to print at higher speeds than conventional thermal heads, and is expected to be applied to high-speed facsimile machines, printers, etc. has been done.
しかしDD型サーマルヘツドは、A4専用のライ
ンプリンタ型で書込み密度を走査方向8pel／mmと
した場合、1700から1800個のドライバーと、それ
に対応したシフトレジスタ等の論理回路を集積し
たICチツプを搭載することとなり、それらのIC
自体の出す熱が基板に蓄積し、誤動作の原因とな
るという第１の欠点を有している。 However, if the DD thermal head is a line printer type for A4 size paper and has a writing density of 8 pel/mm in the scanning direction, it is equipped with an IC chip that integrates 1700 to 1800 drivers and corresponding logic circuits such as shift registers. Therefore, those ICs
The first drawback is that the heat generated by the device itself accumulates on the substrate, causing malfunction.
また、高速度で印字する場合、400個から800個
の発熱抵抗体に同時に通電を行なうため、グラン
ドラインには20〜60アンペアの電流が流れ、グラ
ンドラインに大きな面積が必要となり、基板の大
型化の原因となるという第２の欠点をも有してい
る。 In addition, when printing at high speeds, 400 to 800 heating resistors are energized at the same time, so a current of 20 to 60 amperes flows through the ground line, which requires a large area and requires a large board. It also has the second drawback of causing oxidation.
現在上記第１の欠点に対しては、比較的熱伝導
率の高いセラミツクスを基材とした基板を用いア
ルミニウム等の放熱板に密着させるという方法が
とられているが、基板と放熱板を別々に製造する
ため、工程が複雑化しまたコスト高の原因となつ
ている。加えて、セラミツクスの熱抵抗は金属の
約10倍であり、十分な放熱が行われているとは言
えない。 Currently, the method used to solve the first drawback is to use a substrate made of ceramics, which has relatively high thermal conductivity, and adhere it to a heat sink such as aluminum, but the substrate and heat sink are separated. This makes the process complicated and increases costs. In addition, the thermal resistance of ceramics is about 10 times that of metals, so it cannot be said that they dissipate heat sufficiently.
第２の欠点に対しては、薄膜または厚膜の配線
上に金属片を接続することによつて容量の補てん
を行なう方法がとられているが、金属片を接続す
るための空間が必要となるため、基板の小型化に
十分に効果的であるとは言えず、工程の複雑化を
招き、コスト高の原因となる。 To solve the second drawback, a method has been used to compensate for the capacitance by connecting a metal piece to the thin-film or thick-film wiring, but this requires a space to connect the metal piece. Therefore, it cannot be said that it is sufficiently effective in reducing the size of the substrate, and it complicates the process and causes high costs.
本発明は、上述のような欠点に鑑みて成された
もので、放熱性が良く、小型のDD型サーマルヘ
ツドを安価に供給することを目的とする。
The present invention was made in view of the above-mentioned drawbacks, and it is an object of the present invention to provide a small DD type thermal head with good heat dissipation performance at a low cost.
本発明は、IC搭載部分とグランド取出し端子
部分以外をガラス等の電気的絶縁体によつて被覆
した導体金属性の基材を基板として用いるもので
ある。
The present invention uses, as a substrate, a conductive metal base material whose parts other than the IC mounting part and the ground extraction terminal part are covered with an electrical insulator such as glass.
以下に図面を用いて、本発明を一実施例に基い
て簡単に説明する。第１図は本発明によるDD型
サーマルヘツドの基板であり、第２図は第１図の
AA′断面図である。基材１は、Al等の金属であ
り、被覆材２はガラス等の電気的絶縁物である。
ICチツプ３は基板上のICチツプは搭載用の非絶
縁部分４にマウントされ、ボンデイングパツド５
及び配線６は絶縁物２の上に作成される。またグ
ランドは、ICチツプ３の底面または／およびグ
ランドパツド７によつて金属性基板１に接続さ
れ、ICチツプ３とボンデイングパツド５はワイ
ヤボンデイングによつて接続される。金属性基材
１に接続されたグランドはグランド取出し用の非
絶縁部分８によつて外部回路のグランド端子と接
続される。
The present invention will be briefly described below based on one embodiment using the drawings. Fig. 1 shows the substrate of the DD type thermal head according to the present invention, and Fig. 2 shows the substrate of Fig. 1.
AA' cross-sectional view. The base material 1 is a metal such as Al, and the covering material 2 is an electrical insulator such as glass.
The IC chip 3 on the substrate is mounted on a non-insulated part 4 for mounting, and is attached to a bonding pad 5.
And the wiring 6 is created on the insulator 2. Further, the ground is connected to the metal substrate 1 through the bottom surface of the IC chip 3 and/or the ground pad 7, and the IC chip 3 and the bonding pad 5 are connected by wire bonding. The ground connected to the metal base 1 is connected to a ground terminal of an external circuit through a non-insulated portion 8 for taking out the ground.
また、本発明は上記した１実施例にとどまるも
のではなく、非絶縁部分をICチツプよりも小さ
くし、導電性ペースト等でICチツプをマウント
する場合にも有効であることは言うまでもない。 It goes without saying that the present invention is not limited to the above-described one embodiment, but is also effective in cases where the non-insulated portion is made smaller than the IC chip and the IC chip is mounted using conductive paste or the like.
このように、本発明によれば、金属性基板材を
グランドラインとして使用するためグランドライ
ンの占める空間が不必要となり基板を小型化でき
るうえにICチツプが直接、金属性基材上にマウ
ントされるため、基板の放熱性も向上し、放熱板
と基板を一体化できるため工程の省力化とコスト
の低減にも大きな効果をあげることができる。
As described above, according to the present invention, since the metallic substrate material is used as the ground line, the space occupied by the ground line is unnecessary, and the substrate can be made smaller. In addition, the IC chip can be directly mounted on the metallic substrate. As a result, the heat dissipation of the substrate is improved, and the heat dissipation plate and the substrate can be integrated, which has a significant effect on labor saving and cost reduction in the process.
第１図は本発明一実施例のサーマルヘツドの平
面図、第２図は第１図のサーマルヘツドのＡ―
A′断面図である。
１……基材、２……絶縁物、３……ICチツプ、
４，８……非絶縁部分、５，７……ボンデイング
パツド、６……配線。
FIG. 1 is a plan view of a thermal head according to an embodiment of the present invention, and FIG. 2 is a plan view of the thermal head shown in FIG.
It is an A′ cross-sectional view. 1...Base material, 2...Insulator, 3...IC chip,
4, 8...Non-insulated part, 5, 7...Bonding pad, 6...Wiring.
Claims (1)
基板と電気的に接続するグランド取出し端子部
と、 前記導電性基板の一主面上の所定部分を除いて
この一主面上に形成された電気的絶縁物と、 この電気的絶縁物上に形成された配線と、 この配線と電気的に接続する様に前記導電性基
板の一主面上に配置された駆動用ICとを備え、 前記所定部分を介して前記駆動用ICが前記導
電性基板と電気的に接続する手段とを有すること
を特徴とするサーマルヘツド。 ２ 前記手段は、前記駆動用ICが前記所定部分
上に配置されてなることを特徴とする特許請求の
範囲第１項記載のサーマルヘツド。 ３ 前記手段は、前記所定部分上にグランドパツ
ドを配置し、このグランドパツドを前記駆動用
ICに電気的に接続してなることを特徴とする特
許請求の範囲第１項記載のサーマルヘツド。[Scope of Claims] 1. A conductive substrate, a ground extraction terminal portion formed on the conductive substrate and electrically connected to the conductive substrate, and a predetermined portion on one principal surface of the conductive substrate. an electrical insulator formed on this one main surface except for; a wiring formed on this electrical insulator; and a wiring formed on one main surface of the conductive substrate so as to be electrically connected to this wiring. What is claimed is: 1. A thermal head, comprising: a driving IC disposed in the thermal head; and means for electrically connecting the driving IC to the conductive substrate via the predetermined portion. 2. The thermal head according to claim 1, wherein the means comprises the driving IC disposed on the predetermined portion. 3. The means arranges a ground pad on the predetermined portion, and connects this ground pad to the driving part.
2. The thermal head according to claim 1, wherein the thermal head is electrically connected to an IC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57048869A JPS58166072A (en) | 1982-03-29 | 1982-03-29 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57048869A JPS58166072A (en) | 1982-03-29 | 1982-03-29 | Thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58166072A JPS58166072A (en) | 1983-10-01 |
| JPS6363384B2 true JPS6363384B2 (en) | 1988-12-07 |
Family
ID=12815287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57048869A Granted JPS58166072A (en) | 1982-03-29 | 1982-03-29 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58166072A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61145877A (en) * | 1984-12-19 | 1986-07-03 | Mitsubishi Electric Corp | Led array head |
| JPS61147584A (en) * | 1984-12-20 | 1986-07-05 | Mitsubishi Electric Corp | Light-emitting diode array head |
| JP6650264B2 (en) * | 2015-12-25 | 2020-02-19 | ローム株式会社 | Thermal print head |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS578177A (en) * | 1980-06-17 | 1982-01-16 | Matsushita Electric Ind Co Ltd | Thermal head |
| JPS57116665A (en) * | 1981-01-14 | 1982-07-20 | Nippon Telegr & Teleph Corp <Ntt> | Thermal head incorporated in driving circuit |
-
1982
- 1982-03-29 JP JP57048869A patent/JPS58166072A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58166072A (en) | 1983-10-01 |
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