JPS6364073U - - Google Patents
Info
- Publication number
- JPS6364073U JPS6364073U JP1986157984U JP15798486U JPS6364073U JP S6364073 U JPS6364073 U JP S6364073U JP 1986157984 U JP1986157984 U JP 1986157984U JP 15798486 U JP15798486 U JP 15798486U JP S6364073 U JPS6364073 U JP S6364073U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- copper foil
- utility
- model registration
- joint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 239000011241 protective layer Substances 0.000 claims 4
- 239000004020 conductor Substances 0.000 claims 3
- 239000000463 material Substances 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000013039 cover film Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
Landscapes
- Liquid Crystal (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
第１図は本考案によるフレキシブル基板の接合
部構造の第１実施例を示す断面図、第２図は本考
案の第２実施例の断面図、第３図は従来のフレキ
シブル基板の接合部構造の断面図、第４図ないし
第６図はフレキシブル基板を外部部品である液晶
表示素子の端子部に接合する場合を順次示した説
明図である。
１１……フレキシブル基板、１２……ベースフ
イルム、１３，１４，１７，１８……接着層、１
５，１６……銅箔層、１９，２０……カバーフイ
ルム、２１……液晶表示素子、２２，２６……半
田、２７……半田ヒータ。
FIG. 1 is a cross-sectional view showing a first embodiment of a joint structure of a flexible substrate according to the present invention, FIG. 2 is a cross-sectional view of a second embodiment of the present invention, and FIG. 3 is a conventional joint structure of a flexible substrate. 4 to 6 are explanatory diagrams sequentially showing the case where a flexible substrate is bonded to a terminal portion of a liquid crystal display element, which is an external component. 11... Flexible substrate, 12... Base film, 13, 14, 17, 18... Adhesive layer, 1
5, 16...Copper foil layer, 19, 20...Cover film, 21...Liquid crystal display element, 22, 26...Solder, 27...Solder heater.
Claims (1)
、この銅箔層に接着層を介して保護層を形成して
なり、銅箔層と保護層とで導体層を構成する両面
銅箔型のフレキシブル基板において、このフレキ
シブル基板の外部部品との接合部における上記導
体層の加熱加圧部側の層厚を薄く形成したことを
特徴とするフレキシブル基板の接合部構造。 (2) 実用新案登録請求の範囲第(1)項において、
上記導体層の薄層化を、保護層を薄層に形成する
ことによるフレキシブル基板の接合部構造。 (3) 実用新案登録請求の範囲第(1)項において、
上記導体層の薄層化を、保護層を薄層に形成する
とともに、接合部における銅箔層を除去し、保護
層を基材に直接接着することによるフレキシブル
基板の接合部構造。[Claims for Utility Model Registration] (1) A copper foil layer is formed on both sides of the base material via an adhesive layer, and a protective layer is formed on this copper foil layer via an adhesive layer. A double-sided copper foil type flexible board comprising a conductive layer and a conductive layer, characterized in that the thickness of the conductor layer on the heating and pressing part side at the joint with an external component of the flexible board is thinner. Board joint structure. (2) In paragraph (1) of claims for utility model registration,
A joint structure of a flexible substrate by forming a thin protective layer to reduce the thickness of the conductor layer. (3) In paragraph (1) of claims for utility model registration,
A joint structure of a flexible circuit board is achieved by thinning the conductor layer by forming a thin protective layer, removing the copper foil layer at the joint, and directly bonding the protective layer to the base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986157984U JPS6364073U (en) | 1986-10-15 | 1986-10-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986157984U JPS6364073U (en) | 1986-10-15 | 1986-10-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6364073U true JPS6364073U (en) | 1988-04-27 |
Family
ID=31081044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986157984U Pending JPS6364073U (en) | 1986-10-15 | 1986-10-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6364073U (en) |
-
1986
- 1986-10-15 JP JP1986157984U patent/JPS6364073U/ja active Pending
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