JPS636485U - - Google Patents
Info
- Publication number
- JPS636485U JPS636485U JP9906786U JP9906786U JPS636485U JP S636485 U JPS636485 U JP S636485U JP 9906786 U JP9906786 U JP 9906786U JP 9906786 U JP9906786 U JP 9906786U JP S636485 U JPS636485 U JP S636485U
- Authority
- JP
- Japan
- Prior art keywords
- pad
- circuit
- protective layer
- wiring board
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011241 protective layer Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
第１図は本考案に係る配線基板を利用する部品
実装状況を示す断面図、第２図はその一部を拡大
して示す正面図、第３図は配線基板に実装後の正
面図、第４図は液晶モジユール表示装置の断面構
造図、第５図は従来の配線基板を利用する実装状
況を示す断面図である。
Fig. 1 is a sectional view showing a component mounting situation using the wiring board according to the present invention, Fig. 2 is a front view showing an enlarged part of the part, and Fig. 3 is a front view after mounting on the wiring board. FIG. 4 is a cross-sectional structural diagram of a liquid crystal module display device, and FIG. 5 is a cross-sectional diagram showing a mounting situation using a conventional wiring board.
Claims (1)
回路の一部を構成する層状のパツドと、このパツ
ドの周囲を占める前記回路を被覆する絶縁性保護
層とを具備し、前記保護層表面は前記パツド表面
より８０μｍ以上高くすることを特徴とする配線
基板。 It comprises an insulating substrate, a circuit formed on the surface thereof, a layered pad constituting a part of this circuit, and an insulating protective layer covering the circuit occupying the periphery of this pad, and the surface of the protective layer is A wiring board characterized in that the pad is 80 μm or more higher than the surface of the pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9906786U JPS636485U (en) | 1986-06-30 | 1986-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9906786U JPS636485U (en) | 1986-06-30 | 1986-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS636485U true JPS636485U (en) | 1988-01-16 |
Family
ID=30967608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9906786U Pending JPS636485U (en) | 1986-06-30 | 1986-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS636485U (en) |
-
1986
- 1986-06-30 JP JP9906786U patent/JPS636485U/ja active Pending
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