JPS6367247U - - Google Patents
Info
- Publication number
- JPS6367247U JPS6367247U JP16133686U JP16133686U JPS6367247U JP S6367247 U JPS6367247 U JP S6367247U JP 16133686 U JP16133686 U JP 16133686U JP 16133686 U JP16133686 U JP 16133686U JP S6367247 U JPS6367247 U JP S6367247U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- section
- loader
- rotating member
- unloader
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003028 elevating effect Effects 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
Landscapes
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
Description
第１図，第２図および第３図Ａ―Ｄは本考案の
一実施例を示したもので第１図はウエハプローバ
に搬送部を用いた平面図、第２図は第１図―
線断面図（ローダ側を示す）、第３図Ａ〜Ｄは第
１図―線断面図（アンローダ側を示す）、第
４図から第９図まではウエハの搬送工程の順序を
説明した平面説明図であり、第１０図は従来例を
示したウエハプローバの搬送部の平面図、第１１
図は第１０図―線断面図、第１２図は他の従
来例を示した斜視図、第１３図から第１６図は他
の従来例を示したウエハ取受装置のウエハ引き出
し動作を示した側面図、第１７図はプリアライメ
ントの説明図、第１８図は不効率な搬送の説明図
。
１１：ウエハ、１２：ウエハカセツト、１４：
エレベータ、１５：ローダ用搬送路、１７：ロー
ダ用ウエハ昇降部材、１７ａ：サブチヤツク、１
７ｂ：昇降部（回動部分）、２０：アンローダ用
搬送路、２３：回転部材、２３ａ：駆動部、２３
ｂ：アーム、２５：チヤツク、２５ａ：ピン、２
５ｂ，ｃ：基台、２６：ヘツトプレート、３７ａ
：サブチヤツク、３７ｂ：昇降部、３７ｃ：溝部
、３９ａ：ウエハカセツト台、３９ｂ：昇降部、
４０：プローブカード、６０：ウエハ取受装置、
６１：ピンセツト部、６２：昇降部、６３：保持
部、７１：スライド軸、７２：ウエハ保持板、７
３：基台、８１：サブチヤツク、８２：昇降部材
、８９：測定部、９０：アンローダ部、９５：ロ
ーダ部。
1, 2, and 3A to 3D show an embodiment of the present invention. FIG. 1 is a plan view of a wafer prober using a transfer section, and FIG.
Line sectional views (showing the loader side), Figures 3 A to D are line sectional views taken from Figure 1 (showing the unloader side), and Figures 4 to 9 are plane views explaining the order of the wafer transfer process. FIG. 10 is a plan view of a transfer section of a wafer prober showing a conventional example;
The figure is a sectional view taken along the line of Fig. 10, Fig. 12 is a perspective view showing another conventional example, and Figs. 13 to 16 show the wafer extracting operation of a wafer receiving device showing other conventional examples. A side view, FIG. 17 is an explanatory diagram of pre-alignment, and FIG. 18 is an explanatory diagram of inefficient conveyance. 11: Wafer, 12: Wafer cassette, 14:
Elevator, 15: Transport path for loader, 17: Wafer elevating member for loader, 17a: Subchuck, 1
7b: Lifting section (rotating section), 20: Unloader conveyance path, 23: Rotating member, 23a: Drive section, 23
b: arm, 25: chuck, 25a: pin, 2
5b, c: base, 26: head plate, 37a
: Subchuck, 37b: Lifting part, 37c: Groove part, 39a: Wafer cassette stand, 39b: Lifting part,
40: Probe card, 60: Wafer receiving device,
61: Tweezers section, 62: Lifting section, 63: Holding section, 71: Slide shaft, 72: Wafer holding plate, 7
3: Base, 81: Subchuck, 82: Lifting member, 89: Measuring section, 90: Unloader section, 95: Loader section.
Claims (1)
搬送路に係合し左右に回転自在な回転部材を設け
たウエハ搬送構造において、 ローダ用の搬送路内に第１のウエハ昇降部材を
設け、 アンローダ用の搬送路内に上記回転部材が回転
する際にウエハ昇降部材と接触しないように溝部
を設けた第２のウエハ昇降部材を設け、 上記回転部材により、第２のウエハ昇降部材に
ウエハが保持された状態で、上記回転部材は第２
のウエハ昇降部材の溝部を通過してウエハを搬送
することを特徴としたウエハ搬送構造。[Claims for Utility Model Registration] In a wafer transfer structure that is provided with a rotating member that engages with a transfer path for a semiconductor wafer loader and an unloader and is rotatable left and right, a first wafer is moved up and down within the transfer path for the loader. a second wafer elevating member provided with a groove so that the rotating member does not come into contact with the wafer elevating member when the rotating member rotates in the transport path for the unloader; With the wafer held by the member, the rotating member rotates to the second
A wafer transfer structure characterized in that a wafer is transferred through a groove in a wafer lifting member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16133686U JPH0517885Y2 (en) | 1986-10-20 | 1986-10-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16133686U JPH0517885Y2 (en) | 1986-10-20 | 1986-10-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6367247U true JPS6367247U (en) | 1988-05-06 |
| JPH0517885Y2 JPH0517885Y2 (en) | 1993-05-13 |
Family
ID=31087556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16133686U Expired - Lifetime JPH0517885Y2 (en) | 1986-10-20 | 1986-10-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0517885Y2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03290946A (en) * | 1990-03-30 | 1991-12-20 | Tokyo Electron Ltd | Processing apparatus |
| CN102690052A (en) * | 2012-05-25 | 2012-09-26 | 熊进 | Glass discharging device |
| JP2013149703A (en) * | 2012-01-18 | 2013-08-01 | Nippon Steel & Sumikin Fine Technology Co Ltd | Wafer transfer device |
-
1986
- 1986-10-20 JP JP16133686U patent/JPH0517885Y2/ja not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03290946A (en) * | 1990-03-30 | 1991-12-20 | Tokyo Electron Ltd | Processing apparatus |
| JP2013149703A (en) * | 2012-01-18 | 2013-08-01 | Nippon Steel & Sumikin Fine Technology Co Ltd | Wafer transfer device |
| CN102690052A (en) * | 2012-05-25 | 2012-09-26 | 熊进 | Glass discharging device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0517885Y2 (en) | 1993-05-13 |
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