JPS6367403B2 - - Google Patents

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Publication number
JPS6367403B2
JPS6367403B2 JP56086352A JP8635281A JPS6367403B2 JP S6367403 B2 JPS6367403 B2 JP S6367403B2 JP 56086352 A JP56086352 A JP 56086352A JP 8635281 A JP8635281 A JP 8635281A JP S6367403 B2 JPS6367403 B2 JP S6367403B2
Authority
JP
Japan
Prior art keywords
layer
insulating layer
cable
tape
water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56086352A
Other languages
Japanese (ja)
Other versions
JPS57202810A (en
Inventor
Tadayuki Uematsu
Shinichi Irie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP56086352A priority Critical patent/JPS57202810A/en
Publication of JPS57202810A publication Critical patent/JPS57202810A/en
Publication of JPS6367403B2 publication Critical patent/JPS6367403B2/ja
Granted legal-status Critical Current

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Description

【発明の詳細な説明】 本発明は架橋ポリエチレン絶縁ケーブルの接続
工法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for connecting crosslinked polyethylene insulated cables.

架橋ポリエチレン絶縁ケーブルは、近年益々高
圧送電線に適用される傾向にある。これに伴いケ
ーブル接続部においても信頼性が要求され、その
ため導体接続部上に施したゴム、プラスチツクの
補強絶縁層を加圧加熱してケーブル絶縁層と一体
化させるモールド接続工法が広く採用されてい
る。従来この接続工法は、導体接続部上の補強絶
縁層を、架橋剤入りポリエチレン又は架橋ポリエ
チレン等をテープ状にして巻回するか或は注型に
よつて形成した後、架橋温度以上に加熱しながら
モールド成形し、その上に半導電性テープ巻き導
電層を設けてから、さらに全体を加熱して一体状
にモールド成形し、外側に防水保護管を被せ端部
を防水テープ巻きしていた。斯る接続工法による
と、モールド成形時に、架橋剤入り末架橋ポリエ
チレンや半導電性テープが架橋一体化する際の架
橋剤分解により水分や分解ガスが補強絶縁層中に
残り、長期に亘るケーブル使用中に絶縁劣化し部
分放電を生じる欠陥があつた。
Cross-linked polyethylene insulated cables are increasingly being applied to high-voltage power transmission lines in recent years. Along with this, reliability is also required for cable connections, and for this reason, a mold connection method has been widely adopted in which a reinforcing insulating layer of rubber or plastic applied to the conductor connection part is heated under pressure to integrate it with the cable insulating layer. There is. Conventionally, this connection method involves forming a reinforcing insulating layer on the conductor connection by winding or casting polyethylene containing a crosslinking agent or crosslinked polyethylene into a tape, and then heating the layer to a temperature higher than the crosslinking temperature. After that, the conductive layer was wrapped with semiconductive tape and then the whole was heated and molded into a single piece.A waterproof protective tube was placed on the outside and the ends were wrapped with waterproof tape. According to this connection method, moisture and decomposed gas remain in the reinforcing insulating layer due to the decomposition of the crosslinking agent when the semiconductive tape and semiconductive tape containing a crosslinking agent are crosslinked during molding, resulting in the cable being used for a long time. Inside, there was a defect that caused insulation to deteriorate and cause partial discharge.

本発明は上記欠点を解消し優れた遮水効果と経
年絶縁劣化を生じないケーブル接続法を提供しよ
うとするもので、以下これを図示した実施例につ
いて説明する。
The present invention aims to eliminate the above-mentioned drawbacks and provide a cable connection method that has an excellent water-shielding effect and does not cause insulation deterioration over time, and an embodiment illustrating this will be described below.

図において1はケーブル導体接続管、2は導体
接続管上から段剥した両ケーブル導体上に亘り施
された架橋剤配合の半導電テープを巻回して形成
の内部半導電層で、半導電テープとしてはエチレ
ン−酢ビ共重合体、エチレン−プロピレン共重合
体、エチレン−アクリル酸エチル共重合体、これ
らの共重合体の二種以上のポリマーブレンド及び
これらの共重合体の一種以上とポリエチレンとの
ポリマーブレンドからなる群から選定したベース
ポリマーに所定の導電性を付与するに必要な分量
のアセチレンブラツク等の導電性カーボンブラツ
クを添加し、さらに所望のゲル分率を達成するに
必要な分量の架橋剤、例えばジクミルパーオキシ
ド、ビス(t−ブチルパーオキシイソプロピル)
ベンゼン等のような有機過酸化物を配合したコン
パウンドを、Tダイ、カレンダーインフレーシヨ
ン等によつてフイルムにしこれを適当な巾にスリ
ツト加工したものを使用する。4は導体接続部上
に施された架橋剤配合のポリオレフイン絶縁テー
プを巻回して形成の絶縁層、5は該絶縁層上に金
属単体又は金属とプラスチツクとのラミネートテ
ープに粘着剤をつけて巻回貼着するか或は遮水性
を有する熱収縮チユーブを被せて形成の遮水層、
6はその上に施された保護層で、本発明は、接続
すべきケーブル端被覆を段剥し、露出導体を接続
管1で圧縮接続した後、その外周上から両ケーブ
ル導体上に亘り架橋剤配合の半導電性テープから
なる内部半導電層2を形成し、その上にケーブル
絶縁層と同質のポリオレフイン絶縁テープからな
る絶縁層4を形成して内部半導体電層2と絶縁層
4とを加熱融着した後、さらに50℃〜120℃の温
度で真空乾燥して半導電層2と絶縁層4の加熱時
に架橋剤の分解によつて生じた水分、分解ガスを
完全に除去後直ちに絶縁層4上に遮水層5を施し
てからその外周に保護層6を設けて接続部を構成
する。なお図中7はケーブル内の遮水層、8は保
護相6の端末に施されたテープ巻層である。
In the figure, 1 is a cable conductor connecting pipe, and 2 is an internal semiconducting layer formed by winding a semiconductive tape containing a crosslinking agent applied over both cable conductors separated from the conductor connecting pipe. Examples include ethylene-vinyl acetate copolymer, ethylene-propylene copolymer, ethylene-ethyl acrylate copolymer, polymer blends of two or more of these copolymers, and one or more of these copolymers and polyethylene. A conductive carbon black such as acetylene black is added to a base polymer selected from the group consisting of a polymer blend of Crosslinking agents such as dicumyl peroxide, bis(t-butylperoxyisopropyl)
A compound containing an organic peroxide such as benzene is made into a film by T-dying, calendar inflation, etc., and the film is slit to an appropriate width. 4 is an insulating layer formed by winding a polyolefin insulating tape containing a cross-linking agent applied on the conductor connection portion, and 5 is an insulating layer formed by winding a single metal or a laminate tape of metal and plastic with adhesive applied on the insulating layer. A water-blocking layer formed by pasting it twice or covering it with a heat-shrinkable tube that has water-blocking properties;
Reference numeral 6 denotes a protective layer applied thereon, and in the present invention, after the cable end coating to be connected is stripped in stages and the exposed conductors are compressed and connected with the connecting pipe 1, a crosslinking agent is applied from the outer periphery to both cable conductors. An internal semiconductive layer 2 made of a compounded semiconductive tape is formed, an insulating layer 4 made of a polyolefin insulating tape of the same quality as the cable insulating layer is formed thereon, and the internal semiconductive layer 2 and the insulating layer 4 are heated. After fusing, the insulating layer is further dried under vacuum at a temperature of 50°C to 120°C to completely remove moisture and decomposition gas generated by decomposition of the crosslinking agent during heating of the semiconductive layer 2 and the insulating layer 4. A water-blocking layer 5 is applied on the water-blocking layer 4, and then a protective layer 6 is provided around the outer periphery of the water-blocking layer 5 to form a connection portion. In the figure, 7 is a water-shielding layer within the cable, and 8 is a tape-wrapped layer applied to the end of the protective layer 6.

次に本発明の具体例を説明する。 Next, specific examples of the present invention will be explained.

154KV CVケーブル(導体800mm2)の端末被覆
層を段剥して導体を露出させて圧縮スリーブ1で
接続し、次にこの導体接続部上からケーブル導生
上に亘りHFDJ0580(日本ユニカー製)半導電性
コンパウンドテープを厚さ20mmになるように巻い
た内部半導電層2を設けてからこの半導電層2上
にHFDJ4201(日本ユニカー製)架橋可能なポリ
エチレンコンパウンドテープを厚さが28mmになる
ように巻回して絶縁層4を形成し、さらにこの絶
縁層4をモールド金型を用いてヒーター温度210
℃で5時間加熱融着した後冷却し、さらに80℃で
48時間真空乾燥を行つたあと直ちに、絶縁層4上
に粘着剤を塗つた鉛と導電性ポリエチレンラミネ
ートテープを縦沿え包被して断水層5を設け接続
部を構成した。このようにして構成した接続部
と、比較例として真空乾燥工程を省略して構成し
た接続部とを、80℃の温水中に6ケ月間浸漬して
とり出し、交流絶縁破壊試験を行い両者を比較し
たところ、本発明によるケーブル接続部の耐電圧
値に比し比較例の接続部では40〜60%まで耐電圧
値が低下した。
Strip the terminal coating layer of a 154KV CV cable (conductor 800mm 2 ) to expose the conductor, connect it with compression sleeve 1, and then apply HFDJ0580 (manufactured by Nippon Unicar) semi-conducting conductor over the conductor connection part and over the cable conductor. An internal semiconductive layer 2 is prepared by wrapping a polyethylene compound tape to a thickness of 20 mm, and then a crosslinkable polyethylene compound tape of HFDJ4201 (manufactured by Nippon Unicar) is wrapped on top of this semiconductive layer 2 to a thickness of 28 mm. The insulation layer 4 is formed by winding the insulation layer 4, and then the insulation layer 4 is heated to a heater temperature of 210°C using a mold.
After heating and fusing at ℃ for 5 hours, it was cooled and further heated to 80℃.
Immediately after vacuum drying for 48 hours, the insulating layer 4 was covered with adhesive-coated lead and conductive polyethylene laminate tape in a vertical manner to form a water-blocking layer 5 to form a connection part. The connection part thus constructed and the connection part constructed without the vacuum drying process as a comparative example were immersed in warm water at 80°C for 6 months and then taken out and subjected to an AC dielectric breakdown test. When compared, the withstand voltage value of the connection part of the comparative example was reduced by 40 to 60% compared to the withstand voltage value of the cable connection part according to the present invention.

なおモールド成形後の真空乾燥なしの比較例の
絶縁層の水分量は0.05〜0.2%であるのに比し、
モールド成形後真空乾燥した本発明による絶縁層
の水分量は0.01%以下であつた。
In addition, compared to the comparative example without vacuum drying after molding, the moisture content of the insulating layer was 0.05 to 0.2%.
The moisture content of the insulating layer according to the present invention, which was vacuum dried after molding, was 0.01% or less.

上述のように本発明によれば優れた遮水効果を
有し経年吸水絶縁劣化しないケーブル接続部が得
られる。
As described above, according to the present invention, it is possible to obtain a cable connection portion that has an excellent water-shielding effect and does not suffer from water absorption and insulation deterioration over time.

【図面の簡単な説明】[Brief explanation of drawings]

図は本発明の一実施例を説明するためのケーブ
ル接続部の要部断面図である。 1:導体接続部、2:内部半導電層、3:ケー
ブルの半導電層、4:絶縁層、5:遮水層、6:
保護層。
The figure is a sectional view of a main part of a cable connection section for explaining one embodiment of the present invention. 1: Conductor connection part, 2: Internal semiconductive layer, 3: Semiconductive layer of cable, 4: Insulating layer, 5: Water shielding layer, 6:
protective layer.

Claims (1)

【特許請求の範囲】[Claims] 1 接続すべきケーブル端被覆を段剥ぎし露出導
体を接続してその外周に内部半導電層と、ポリオ
レフイン絶縁テープからなる絶縁層とを形成して
加熱融着した後、さらに所定温度で加熱乾燥又は
加熱真空乾燥し、乾燥後絶縁層上に遮水層を形成
することを特徴とするケーブルの接続法。
1 Strip off the cable end coating to be connected, connect the exposed conductor, form an internal semiconductive layer and an insulating layer made of polyolefin insulating tape on the outer periphery, heat-fuse, and then heat-dry at a predetermined temperature. Or a cable connection method characterized by heating and vacuum drying and forming a water-blocking layer on the insulating layer after drying.
JP56086352A 1981-06-06 1981-06-06 Method of connecting cable Granted JPS57202810A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56086352A JPS57202810A (en) 1981-06-06 1981-06-06 Method of connecting cable

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56086352A JPS57202810A (en) 1981-06-06 1981-06-06 Method of connecting cable

Publications (2)

Publication Number Publication Date
JPS57202810A JPS57202810A (en) 1982-12-11
JPS6367403B2 true JPS6367403B2 (en) 1988-12-26

Family

ID=13884482

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56086352A Granted JPS57202810A (en) 1981-06-06 1981-06-06 Method of connecting cable

Country Status (1)

Country Link
JP (1) JPS57202810A (en)

Also Published As

Publication number Publication date
JPS57202810A (en) 1982-12-11

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