JPS636747U - - Google Patents

Info

Publication number
JPS636747U
JPS636747U JP1986100440U JP10044086U JPS636747U JP S636747 U JPS636747 U JP S636747U JP 1986100440 U JP1986100440 U JP 1986100440U JP 10044086 U JP10044086 U JP 10044086U JP S636747 U JPS636747 U JP S636747U
Authority
JP
Japan
Prior art keywords
sides
leads
resin
semiconductor device
bent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986100440U
Other languages
English (en)
Other versions
JPH08762Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986100440U priority Critical patent/JPH08762Y2/ja
Publication of JPS636747U publication Critical patent/JPS636747U/ja
Application granted granted Critical
Publication of JPH08762Y2 publication Critical patent/JPH08762Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の一実施例を示すもので、ａ
は平面図、ｂは正面図、第２図は従来の半導体装
置用のフレームを示すもので、ａは平面図、ｂは
正面図である。 図中、１は樹脂部、２，３，４はリードである
。尚、図中同一符号は同一または相当部分を示す
。

Claims (1)

    【実用新案登録請求の範囲】
  1. 樹脂封止形半導体装置の樹脂側面の左右両側に
    各々本数が異なるリードを有するものにおいて、
    上記両側のリードの曲げ加工を施こす部分のリー
    ド断面積を左右で同じく設定したことを特徴とす
    る半導体装置用フレーム。
JP1986100440U 1986-06-30 1986-06-30 半導体装置用フレ−ム Expired - Lifetime JPH08762Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986100440U JPH08762Y2 (ja) 1986-06-30 1986-06-30 半導体装置用フレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986100440U JPH08762Y2 (ja) 1986-06-30 1986-06-30 半導体装置用フレ−ム

Publications (2)

Publication Number Publication Date
JPS636747U true JPS636747U (ja) 1988-01-18
JPH08762Y2 JPH08762Y2 (ja) 1996-01-10

Family

ID=30970265

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986100440U Expired - Lifetime JPH08762Y2 (ja) 1986-06-30 1986-06-30 半導体装置用フレ−ム

Country Status (1)

Country Link
JP (1) JPH08762Y2 (ja)

Also Published As

Publication number Publication date
JPH08762Y2 (ja) 1996-01-10

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