JPS6371548U - - Google Patents

Info

Publication number
JPS6371548U
JPS6371548U JP1987151522U JP15152287U JPS6371548U JP S6371548 U JPS6371548 U JP S6371548U JP 1987151522 U JP1987151522 U JP 1987151522U JP 15152287 U JP15152287 U JP 15152287U JP S6371548 U JPS6371548 U JP S6371548U
Authority
JP
Japan
Prior art keywords
heat sink
insulator
thick
main surface
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987151522U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0328510Y2 (2
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987151522U priority Critical patent/JPH0328510Y2/ja
Publication of JPS6371548U publication Critical patent/JPS6371548U/ja
Application granted granted Critical
Publication of JPH0328510Y2 publication Critical patent/JPH0328510Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1987151522U 1987-10-02 1987-10-02 Expired JPH0328510Y2 (2)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987151522U JPH0328510Y2 (2) 1987-10-02 1987-10-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987151522U JPH0328510Y2 (2) 1987-10-02 1987-10-02

Publications (2)

Publication Number Publication Date
JPS6371548U true JPS6371548U (2) 1988-05-13
JPH0328510Y2 JPH0328510Y2 (2) 1991-06-19

Family

ID=31068673

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987151522U Expired JPH0328510Y2 (2) 1987-10-02 1987-10-02

Country Status (1)

Country Link
JP (1) JPH0328510Y2 (2)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51131174U (2) * 1975-04-15 1976-10-22
JPS57147260A (en) * 1981-03-05 1982-09-11 Matsushita Electronics Corp Manufacture of resin-sealed semiconductor device and lead frame used therefor
JPS57175448U (2) * 1981-04-30 1982-11-05

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51131174U (2) * 1975-04-15 1976-10-22
JPS57147260A (en) * 1981-03-05 1982-09-11 Matsushita Electronics Corp Manufacture of resin-sealed semiconductor device and lead frame used therefor
JPS57175448U (2) * 1981-04-30 1982-11-05

Also Published As

Publication number Publication date
JPH0328510Y2 (2) 1991-06-19

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