JPS637162U - - Google Patents
Info
- Publication number
- JPS637162U JPS637162U JP9771786U JP9771786U JPS637162U JP S637162 U JPS637162 U JP S637162U JP 9771786 U JP9771786 U JP 9771786U JP 9771786 U JP9771786 U JP 9771786U JP S637162 U JPS637162 U JP S637162U
- Authority
- JP
- Japan
- Prior art keywords
- load lock
- lock section
- substrate
- sputtering
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 230000007246 mechanism Effects 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 claims 2
- 230000007723 transport mechanism Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Description
第１図は本考案の一実施例の装置構成図である
。
１……基板、２……ロードロツク部、３……基
板加熱機構、４……基板処理部、５……第１ゲー
トバルブ、６……第２ゲートバルブ、７……バル
ブ、８……バルブ、９……ロータリーポンプ、１
０……第１クライオポンプ、１１……第２クライ
オポンプ。
FIG. 1 is a diagram showing the configuration of an apparatus according to an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1...Substrate, 2...Load lock section, 3...Substrate heating mechanism, 4...Substrate processing section, 5...First gate valve, 6...Second gate valve, 7...Valve, 8...Valve , 9... rotary pump, 1
0...First cryopump, 11...Second cryopump.
Claims (1)
パツタ電極と基板搬送機構とロードロツク部を備
えたスパツタ装置において、ロードロツク部に基
板加熱機構を設けたことを特徴とするスパツタ装
置。 1. A sputtering apparatus comprising a vacuum container, a vacuum evacuation mechanism, at least one sputtering electrode, a substrate transport mechanism, and a load lock section, characterized in that the load lock section is provided with a substrate heating mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9771786U JPS637162U (en) | 1986-06-27 | 1986-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9771786U JPS637162U (en) | 1986-06-27 | 1986-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS637162U true JPS637162U (en) | 1988-01-18 |
Family
ID=30964961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9771786U Pending JPS637162U (en) | 1986-06-27 | 1986-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS637162U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5763678A (en) * | 1980-10-03 | 1982-04-17 | Hitachi Ltd | Sputtering device |
-
1986
- 1986-06-27 JP JP9771786U patent/JPS637162U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5763678A (en) * | 1980-10-03 | 1982-04-17 | Hitachi Ltd | Sputtering device |