JPS63719B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention is an improvement in a heat dissipation device for a heat generating part of an audio equipment, for quickly cooling down a heat generating part such as an electric circuit section assembled with a large number of semiconductor elements of the audio equipment. It is related to.

Audio equipment such as audio products has a problem in that during use, the temperature inside the device increases due to heat generated from the heat generating part, causing problems such as a decline in sound quality. This is because the temperature of the base plate of an electric circuit on which a large number of semiconductor elements are assembled increases due to the heat generated by the semiconductor elements themselves and the heat generated by the resistance elements, which causes the semiconductor elements to be held at a high temperature. By degrading performance. For this reason, audio equipment that places particular emphasis on sound quality incorporates cooling means or heat radiating means to remove heat from the heat generating part, but conventional equipment does not transfer heat from the heat receiving part to the heat radiating part. Conduction was slow, and it was troublesome to assemble a heat-generating part such as an electric circuit board to a heat-receiving part, so there was no effective method.

By the way, in order to rapidly transfer heat from the heat receiving part to the heat radiating part, a volatile liquid such as freon ether is sealed in a vacuum-degassed and sealed pipe, and this liquid is used to receive heat. A so-called heat pipe is used to repeat the cycle in which the evaporated vapor moves to a heat radiation part, condenses while releasing heat of condensation, and is restored to liquid and flows to a heat receiving part. Means for constructing transmission devices are known in the art.

However, the conventional means, for example,
As described in Publication No. 116950 and Japanese Utility Model Application Publication No. 151267/1983, a heat pipe is first formed by sealing a volatile liquid, and then a separate body is attached to the outer peripheral surface of the tube wall of the heat pipe. The heating element and radiator formed in the radiator are assembled so that they are in contact with each other.
Heat conduction efficiency is poor at the contact surface between the heating element/radiator and the outer surface of the tube wall of the heat pipe, and it is troublesome to assemble the heat radiator, and furthermore, the heat receiving surface of the heat receiving part is the outer peripheral surface of the heat pipe. As a result, an assembly seat for assembling a heat generating part such as a base plate to a heat receiving part so as to remove heat from a heat generating part such as a base plate of an electric circuit of an audio equipment can be provided without impairing the efficiency of heat conduction. There is a problem in that it is difficult to install the heat generating part in a state where it can be firmly supported.

The present invention solves these problems, improves the efficiency of heat conduction between the heat radiating part of the heat pipe and the radiator provided therein, allows the radiator to be easily installed, and makes it possible to easily install the heat radiator in the heat receiving part. The mounting base for attaching the heat generating part of the audio equipment,
The purpose of the present invention is to provide a new heat dissipation device for a heat generating part of an audio equipment that can be easily installed in a state where the heat generating part can be stably mounted while improving the efficiency of heat conduction between the heat receiving part and the heat receiving part. shall be.

For this purpose, in the present invention, a conduit serving as the upper half and a conduit serving as the lower half of the annular circuit of the heat pipe are vertically parallel to each other, and the conduit serving as the upper half is The main body part, in which a thick wall part is formed in the vicinity of the lower half of the conduit and a mounting base is formed in the vicinity of the conduit, is made of a metal material that has good thermal conductivity and can be extruded. The upper half pipe and the lower half pipe are connected at each end to form an annular pipe, and an evaporative liquid is sealed inside the pipe. The present invention proposes a heat dissipation device for a heat generating part of an audio equipment, in which a heat dissipation fin is installed in the thick portion by cutting.

Next, an example of implementation will be described in detail with reference to the drawings.

First, as shown in FIG. 1, a continuous shape member 10 having a constant cross-sectional shape is extruded from a metal material such as aluminum material or light alloy material that has good heat conductivity and can be extruded. This mold material 10 is intended to be the main body part a of the heat dissipation device A, and has a conduit 11 serving as the upper half side 1a serving as the heat dissipating part of the circuit 1 constituting the heat pipe, and a lower half serving as the heat receiving part. 1b are vertically arranged in parallel, and a thick wall portion 13 for cutting and processing the heat dissipation fins 4 is formed in the vicinity of the upper half of the pipe 11, 1a. It is sufficient that a mounting base 3 for mounting a heat generating part w such as a base plate of an electric circuit of an audio device is formed in the vicinity of the conduit 12, which is the half side 1b, as shown in FIG. It is extruded into an appropriate shape such as a cross-sectional shape as shown in FIG. 3 or FIG. 4.
During extrusion molding, it is effective to form a bracket 5 integrally and continuously for attaching the heat radiating device A to a desired location.

Then, the formed material 10 is cut to a length suitable for the main body part a to be formed, and the thick portions 13 are sequentially applied with a cutting blade from the end, as shown in FIG. The heat dissipating fins 4 are formed by cutting and bending a thin piece as shown in FIG. Note that the process of cutting and raising this thin piece is carried out by a conventionally well-known means that has already been established, and a description thereof will be omitted.

However, the main body part a formed in this way
Connecting pipes b and b formed into a U-shape from an appropriate material such as iron or copper are placed separately at each opening of the pipe lines 11 and 12, which are open on both end faces in the longitudinal direction.
By fitting and welding the connecting ports 61 of the parallel pipes 11 to
and the pipe line 12 are connected in an annular manner by U-shaped connecting pipes b and b to form a sealed circuit 1, and the circuit 1
The air inside the circuit 1 is evacuated through a suction port 6 installed in advance in one of the connecting pipes b, and the internal cavity of the circuit 1 is evacuated, and then from that state through the suction port 6,
A volatile liquid 2 such as freon ether is injected to approximately half the internal volume of the circuit 1, and then the intake port 6 is sealed to seal the liquid 2 inside the circuit 1, thereby dissipating heat. It is configured in device A.

The heat dissipation device A of the heat generating section of an audio equipment according to the present invention configured in this manner includes a heat dissipation fin 4 provided at a portion that becomes the heat dissipation section of the circuit 1 constituting a heat pipe, and a heat receiving section for attaching the heat generating section of the audio device. The mounting base 3 provided at the part where the heat pipe is formed is integrally and continuously formed of the same material as the tube wall of the circuit 1 constituting the heat pipe. can be formed, making it easy to attach the heat dissipation fins 4 provided at the heat dissipation section of the circuit 1 serving as a heat pipe, and the efficiency of heat conduction between the heat dissipation fins 4 and the heat dissipation section is extremely high. In addition, the mounting base 3 provided for setting the heat generating part w at the part that becomes the heat receiving part of the circuit 1 improves the efficiency of heat conduction between the heat receiving part and the setting of the heat generating part w. It has a shape that allows it to be installed easily.

The heat dissipation device A according to the present invention controls the flow of heat between the heat dissipation section by the heat dissipation fins 4 and the heat reception section provided with the mounting base 3 on which the heating element is set.
Since this is carried out by the vaporized gas 2a that is vaporized from the liquid 2 and moves at the speed of sound condensing in the heat dissipation section, the wall thickness for forming the heat dissipation fins 4 is The conduit 11 side on which the portion 13 is formed and the conduit 12 side on which the mounting base 3 is formed do not need to be integrally and continuously molded, and may be molded separately.

[Brief explanation of the drawing]

FIG. 1 is an exploded perspective view of an embodiment of the present invention; FIGS. 2, 3, and 4 are cross-sectional views of a mold material that constitutes the main body of the device; and FIG. 5 is a thick section of the mold material. It is an explanatory view of a process of cutting and raising a heat dissipation fin from. Explanation of drawing symbols, A... Heat dissipation device, a... Main body part,
b...Connecting pipe, w...Heating part, 1...Circuit, 1a...Upper half side, 1b...Lower half side, 10...Shape material, 11...Pipe line for the upper half of the circuit, 12...Lower half of the circuit 13...thick part, 2...liquid, 2a...vaporized gas,
3... Mounting base, 4... Heat dissipation fin, 5... Bracket, 6... Pull port, 61... Connection port.

Claims (1)

[Claims] 1 The upper half of the annular circuit of the heat pipe and the lower half of the heat pipe are vertically parallel to each other, and
The main body part is formed by extrusion molding with good thermal conductivity, and a thick wall part is formed in the upper half of the pipe near the pipe, and a mounting base is formed in the lower half of the main part near the pipe. It is made of a metal material that can be formed continuously by extrusion molding, and the ends of the upper half pipe and the lower half pipe are connected to form an annular pipe. An evaporative liquid is sealed inside,
A heat dissipation device for a heat generating part of an audio equipment, wherein a heat dissipation fin is installed in the thick part by cutting.