JPH04192535A - Semiconductor device - Google Patents

Abstract

PURPOSE:To enhance the accuracy of property test by installing a property test contact pad between a semiconductor device of a lead wire and a burn-in test contact pad. CONSTITUTION:A property test contact pad 22 is installed between a semiconductor device of a lead wire 21 and a burn-in test contact pad 22. In this manner, the property test contact pad 23 is installed between the semiconductor device and the burn-in test contact pad 22, which forces the property test contact pad 23 to approach the semiconductor device, which results in the reduction in the length of the lead wire. As a result, the inductance is lowered. This construction makes it possible to measure the property test contact pad 23 with higher accuracy than the burn-in test contact pad, thereby enhancing measurement accuracy.

Description

[Detailed Description of the Invention] [Summary] With regard to semiconductor devices manufactured by the tape carrier method, the purpose of this invention is to improve the accuracy of characteristic tests. In a semiconductor device in which a contact punt is provided for burn-in testing by connecting to a lead wire from a semiconductor element mounted on a film, a contact punt is provided between the semiconductor element and a contact pad for burn-in testing of the lead wire. It is configured to include contact pads for characteristic testing.

[Industrial Application Field] The present invention relates to a semiconductor device manufactured by a tape carrier (TAB) method.

In recent years, as semiconductor devices have become faster, have more bins, and have smaller lead pitches, when testing the characteristics of semiconductor devices, it is necessary to There is a demand for shortening the distance from the test pad to the test pad. Furthermore, in the Hearn-in test, which is a high-temperature test, it is required that contact can be easily made using conventional techniques.

[Prior Art] The tape carrier method was developed for the purpose of automatically assembling semiconductor devices, and FIG. 3 is a diagram showing its manufacturing process. As shown in Fig. 3(a), holes 2 for mounting semiconductor elements and holes 3 for external leads are bored in a long polyimide film 1 with sprocket holes, and then holes 2 for mounting semiconductor elements and holes 3 for external leads are made in a long polyimide film 1 with sprocket holes. )
Copper foil 4 is pasted onto film 1 as shown in FIG. Next, as shown in FIG. 3(C), a lead wire 5 is formed by photoetching, and after Sn plating is applied to the lead wire, a third
As shown in Figure (d), a semiconductor element 7 having Au bumps 6 is bonded to lead wires 5 by Au-Sn eutectic bonding.

After that, cut from the A-A line and the B-B line, as shown in Fig. 4(a).
The semiconductor device shown in FIG. 1 is made into a semiconductor device, and is further subjected to characteristic tests, burn-in tests, etc. before being shipped.

The burn-in test is conducted using an apparatus as shown in FIG. In the figure, 10 is an operating panel part, 11 is a constant temperature part, 12 is a part of a driver, and 13 and 13' are ventilation ducts. A plurality of burn-in boards 14 are housed in the constant temperature oven section 11 and connected to the driver part 12 via a relay board section 15 and a motherboard section 16 . The burn-in board 14 is a printed board 1 as shown in FIG.
A large number of sockets 18 are mounted on 7, and the semiconductor devices shown in FIG. 4(a) are housed in the sockets. As shown in FIGS. 4(a) and 4(b), in this semiconductor device, the lead wires 5 are extended around the film so that the contact pads 19 that come into contact with the contacts of the sockets 18 of the burn-in board can have a large contact surface. It is located in the department. This pad 19 is also used for characteristic testing.

[Problem to be solved by the invention]

In the conventional semiconductor device described above, the contact pads 19 are arranged to match the pitch of the contacts of the socket 18 on the burn-in board and to ensure a large contact area, as shown in FIG. 4(a).
As shown in FIG. 2, it is provided at the periphery of the film 1 far away from the semiconductor element 7.

Therefore, the lead wire 5 becomes longer and the inductance becomes higher. Therefore, if the contact pad 19 is used to test the characteristics of a high-speed semiconductor device, accurate characteristics cannot be obtained.

SUMMARY OF THE INVENTION In view of the above-mentioned conventional problems, it is an object of the present invention to provide a tape carrier type semiconductor device that enables improved accuracy in characteristic testing.

[Means for Solving the Problems] In order to achieve the above object, the semiconductor device of the present invention is assembled using a tape carrier method, and a semiconductor device mounted on the film 20 is assembled at the periphery of the film 20. In a semiconductor device in which a contact pad 22 for a burn-in test is provided connected to a lead wire 21, a contact pad 23 for a characteristic test is provided between the semiconductor element of the lead wire 21 and the contact pad 22 for a burn-in test. It is characterized by being provided with.

[For production]

By providing a contact pad 23 for characteristic testing between the semiconductor element and the contact pad 22 for burn-in testing, the contact pad 23 for characteristic testing becomes close to the semiconductor element, and the length of the lead wire between them becomes short. Therefore, the inductance becomes low. As a result, the measurement accuracy is improved when the characteristic test uses the characteristic test contact pad 23 rather than when the burn-in test contact pad 22 is used.

〔Example] FIG. 1 is a diagram showing essential parts of an embodiment of the present invention.

In the figure, 20 is a film on which a semiconductor element (not shown) is mounted. 21 is a lead wire connected to the semiconductor element and provided on the film 20;
At the tip of the film 20, a contact pad 22 for burn-in testing connected to the lead wire is arranged around the periphery of the film 20. Reference numeral 23 denotes a contact pad for characteristic testing, which is the main point of the present invention, and is provided between the semiconductor element (not shown) and the contact pad 22 for burn-in testing. It is preferable that the contact pad 23 for this characteristic test be as close to the semiconductor element as possible within a range where it can be contacted by the contact bottle of the characteristic tester. The shape of the contact pad 23 for characteristic testing is smaller than the contact pad 22 for burn-in testing, and may be round, square, round, etc. as shown in FIGS. 2(a) to 2(d).

In this embodiment configured as described above, the accuracy of the characteristic test can be improved by bringing the contact pad for the characteristic test closer to the semiconductor element, and the contact pad for the burn-in test is provided at the same position as before. By this,
Conventional burn-in board sockets can be used as usual.

The pitch of the contact pads 23 for characteristic testing shown in FIG. 1 can be made even finer than 0.4 to 0.5 mm.

〔Effect of the invention〕

As explained above, according to the present invention, by providing a contact pad for a uni-characteristic test separate from a contact pad for a burn-in test, the contact pad for the characteristic test can be brought closer to the semiconductor element, and Wire inductance can be lowered. This makes it possible to improve the measurement accuracy of characteristic tests. In addition, burn-in tests can be performed using conventional burn-in boards, which can be used with inexpensive sockets, and increases in manufacturing costs can be suppressed.

[Brief explanation of the drawing]

Fig. 1 is a diagram showing the main part of an embodiment of the present invention, Fig. 2 is a diagram showing an example of the shape of a contact pad for characteristic testing used in an embodiment of the present invention, and Fig. 3 is a diagram showing a conventional tape carrier method. Figure 4 is a diagram showing a semiconductor device assembled using a conventional tape carrier method; Figure 5 is a diagram showing a conventional burn-in equipment; Figure 6 is a burn-in board for a conventional burn-in test equipment. FIG. In the figure, 20 is a film, 21 is a lead wire, 22 is a contact pad for a burn-in test, and 23 is a contact pad for a characteristic test.

Claims (1)

[Claims] 1. Assembled by tape carrier method and film (
20), in which a contact pad (22) for a burn-in test is provided on the periphery of the film (20), the contact pad (22) being connected to a lead wire (21) from a semiconductor element mounted on the film (20); A semiconductor device according to (21), characterized in that a contact pad (23) for a characteristic test is provided between a semiconductor element and a contact pad (22) for a burn-in test. 2. The semiconductor device according to claim 1, wherein the contact pad (23) for characteristic testing is smaller in size than the contact pad (22) for burn-in testing.