JPS6373625A - 半導体ウエ−ハマウンテイング用樹脂薄膜層の形成方法 - Google Patents

半導体ウエ−ハマウンテイング用樹脂薄膜層の形成方法

Info

Publication number
JPS6373625A
JPS6373625A JP61217183A JP21718386A JPS6373625A JP S6373625 A JPS6373625 A JP S6373625A JP 61217183 A JP61217183 A JP 61217183A JP 21718386 A JP21718386 A JP 21718386A JP S6373625 A JPS6373625 A JP S6373625A
Authority
JP
Japan
Prior art keywords
plate
film layer
resin
thin film
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61217183A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0469813B2 (da
Inventor
Koichi Tanaka
好一 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin-Etsu Handotai Co Ltd
Original Assignee
Shin-Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin-Etsu Handotai Co Ltd filed Critical Shin-Etsu Handotai Co Ltd
Priority to JP61217183A priority Critical patent/JPS6373625A/ja
Publication of JPS6373625A publication Critical patent/JPS6373625A/ja
Publication of JPH0469813B2 publication Critical patent/JPH0469813B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP61217183A 1986-09-17 1986-09-17 半導体ウエ−ハマウンテイング用樹脂薄膜層の形成方法 Granted JPS6373625A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61217183A JPS6373625A (ja) 1986-09-17 1986-09-17 半導体ウエ−ハマウンテイング用樹脂薄膜層の形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61217183A JPS6373625A (ja) 1986-09-17 1986-09-17 半導体ウエ−ハマウンテイング用樹脂薄膜層の形成方法

Publications (2)

Publication Number Publication Date
JPS6373625A true JPS6373625A (ja) 1988-04-04
JPH0469813B2 JPH0469813B2 (da) 1992-11-09

Family

ID=16700162

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61217183A Granted JPS6373625A (ja) 1986-09-17 1986-09-17 半導体ウエ−ハマウンテイング用樹脂薄膜層の形成方法

Country Status (1)

Country Link
JP (1) JPS6373625A (da)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04148548A (ja) * 1990-10-12 1992-05-21 Matsushita Electric Ind Co Ltd 半導体基板支持装置
EP0868975A1 (en) * 1997-04-04 1998-10-07 Tokyo Seimitsu Co.,Ltd. Polishing apparatus
WO2000025981A1 (en) * 1998-10-30 2000-05-11 Shin-Etsu Handotai Co., Ltd. Unpolished work holding board and production method thereof and work polishing method and device
JP2003103455A (ja) * 2001-09-28 2003-04-08 Shin Etsu Handotai Co Ltd ワーク保持盤並びにワークの研磨装置及び研磨方法
WO2006103854A1 (ja) * 2005-03-28 2006-10-05 Nikon Corporation 吸着装置、研磨装置、半導体デバイス及び半導体デバイス製造方法
JP2009274169A (ja) * 2008-05-14 2009-11-26 Nikon Corp 吸着装置、吸着装置の製造方法および研磨装置

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04148548A (ja) * 1990-10-12 1992-05-21 Matsushita Electric Ind Co Ltd 半導体基板支持装置
EP0868975A1 (en) * 1997-04-04 1998-10-07 Tokyo Seimitsu Co.,Ltd. Polishing apparatus
US6203414B1 (en) 1997-04-04 2001-03-20 Tokyo Seimitsu Co., Ltd. Polishing apparatus
KR100668161B1 (ko) * 1998-10-30 2007-01-11 신에쯔 한도타이 가부시키가이샤 연마용 워크피스 홀더 및 그 제조방법, 워크피스의 연마방법 및 연마장치
WO2000025981A1 (en) * 1998-10-30 2000-05-11 Shin-Etsu Handotai Co., Ltd. Unpolished work holding board and production method thereof and work polishing method and device
US6386957B1 (en) 1998-10-30 2002-05-14 Shin-Etsu Handotai Co., Ltd. Workpiece holder for polishing, method for producing the same, method for polishing workpiece, and polishing apparatus
JP2003103455A (ja) * 2001-09-28 2003-04-08 Shin Etsu Handotai Co Ltd ワーク保持盤並びにワークの研磨装置及び研磨方法
WO2006103854A1 (ja) * 2005-03-28 2006-10-05 Nikon Corporation 吸着装置、研磨装置、半導体デバイス及び半導体デバイス製造方法
US8371564B2 (en) 2005-03-28 2013-02-12 Nikon Corporation Suction apparatus, polishing apparatus, semiconductor device, and method of manufacturing a semiconductor device
KR101290845B1 (ko) * 2005-03-28 2013-08-07 가부시키가이샤 니콘 흡착 장치, 연마 장치, 반도체 디바이스 및 반도체디바이스 제조 방법
KR101367010B1 (ko) * 2005-03-28 2014-02-24 가부시키가이샤 니콘 흡착 장치, 연마 장치, 반도체 디바이스 및 반도체 디바이스 제조 방법
US8662485B2 (en) 2005-03-28 2014-03-04 Nikon Corporation Suction apparatus, polishing apparatus, semiconductor device, and method of manufacturing a semiconductor device
JP2009274169A (ja) * 2008-05-14 2009-11-26 Nikon Corp 吸着装置、吸着装置の製造方法および研磨装置

Also Published As

Publication number Publication date
JPH0469813B2 (da) 1992-11-09

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