JPS6377372U - - Google Patents

Info

Publication number
JPS6377372U
JPS6377372U JP17122886U JP17122886U JPS6377372U JP S6377372 U JPS6377372 U JP S6377372U JP 17122886 U JP17122886 U JP 17122886U JP 17122886 U JP17122886 U JP 17122886U JP S6377372 U JPS6377372 U JP S6377372U
Authority
JP
Japan
Prior art keywords
heat sink
semiconductor laser
stem
fixed
convex portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17122886U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17122886U priority Critical patent/JPS6377372U/ja
Publication of JPS6377372U publication Critical patent/JPS6377372U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の半導体レーザ装置の一実施例
を示す分解斜視図、第2図はその断面図、第3図
は本考案の他の実施例を示す分解斜視図、第4図
は従来の半導体レーザ装置の分解斜視図である。 11…ヒートシンク、12…結合面、13…凸
部、15…半導体レーザチツプ、16…ステム、
17…結合面、18…凹部、19,20…リード
端子、21…固定手段。
FIG. 1 is an exploded perspective view showing one embodiment of the semiconductor laser device of the present invention, FIG. 2 is a sectional view thereof, FIG. 3 is an exploded perspective view showing another embodiment of the present invention, and FIG. 4 is a conventional FIG. 2 is an exploded perspective view of the semiconductor laser device of FIG. DESCRIPTION OF SYMBOLS 11... Heat sink, 12... Bonding surface, 13... Convex part, 15... Semiconductor laser chip, 16... Stem,
17... Bonding surface, 18... Recess, 19, 20... Lead terminal, 21... Fixing means.

Claims (1)

【実用新案登録請求の範囲】 半導体レーザチツプを固着したヒートシンクと
、その半導体レーザチツプに導通するリード端子
を備え上記ヒートシンクが結合固定されたステム
とからなる半導体レーザ装置であつて、 上記ヒートシンクの結合面に凸部を設けるとと
もに、このヒートシンクの凸部が摺動可能に結合
してヒートシンクの傾動を許容した凹部を上記ス
テムの結合面に設け、その凸部と凹部を結合した
ヒートシンクとステムを固定手段によつて固定し
たことを特徴とする半導体レーザ装置。
[Claims for Utility Model Registration] A semiconductor laser device comprising a heat sink to which a semiconductor laser chip is fixed, and a stem to which the heat sink is coupled and fixed, the stem having a lead terminal electrically connected to the semiconductor laser chip, A convex portion is provided, and a concave portion is provided on the joining surface of the stem, and the convex portion of the heat sink is slidably coupled to allow the heat sink to tilt, and the heat sink and the stem, in which the convex portion and the concave portion are coupled, are used as a fixing means. A semiconductor laser device characterized in that it is twisted and fixed.
JP17122886U 1986-11-07 1986-11-07 Pending JPS6377372U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17122886U JPS6377372U (en) 1986-11-07 1986-11-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17122886U JPS6377372U (en) 1986-11-07 1986-11-07

Publications (1)

Publication Number Publication Date
JPS6377372U true JPS6377372U (en) 1988-05-23

Family

ID=31106666

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17122886U Pending JPS6377372U (en) 1986-11-07 1986-11-07

Country Status (1)

Country Link
JP (1) JPS6377372U (en)

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