JPH02138431U - - Google Patents

Info

Publication number
JPH02138431U
JPH02138431U JP1989047552U JP4755289U JPH02138431U JP H02138431 U JPH02138431 U JP H02138431U JP 1989047552 U JP1989047552 U JP 1989047552U JP 4755289 U JP4755289 U JP 4755289U JP H02138431 U JPH02138431 U JP H02138431U
Authority
JP
Japan
Prior art keywords
convex portions
transistor chip
metallized
fused
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989047552U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989047552U priority Critical patent/JPH02138431U/ja
Publication of JPH02138431U publication Critical patent/JPH02138431U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図はこの考案の一実施例を示す半導体装置
の断面図、第２図は従来の半導体装置を示す断面
図である。 図において、１……放熱フイン、１ａ……凸部
、２，４……セラミツクス、３……メタライズ部
、５……リード端子、６……トランジスタチツプ
、７……金属細線、７ａ……接地細線である。な
お、各図中の同一符号は同一または相当部分を示
す。 FIG. 1 is a sectional view of a semiconductor device showing an embodiment of this invention, and FIG. 2 is a sectional view of a conventional semiconductor device. In the figure, 1...Radiation fin, 1a...Protrusion, 2, 4...Ceramics, 3...Metalized part, 5...Lead terminal, 6...Transistor chip, 7...Metal thin wire, 7a...Grounding It is a thin line. Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金属からなる放熱フイン上に２箇所の凸部を設
け、前記２箇所の凸部間の中央部に表裏両面にメ
タライジングが施されたセラミツクスを介してト
ランジスタチツプを融着し、少なくとも前記トラ
ンジスタチツプと２箇所の凸部とを接地細線によ
り接続したことを特徴とする半導体装置。 Two convex portions are provided on a heat dissipation fin made of metal, and a transistor chip is fused to the central portion between the two convex portions via ceramics that are metallized on both the front and back surfaces, so that at least the transistor chip and two convex portions are connected by a thin ground wire.
JP1989047552U 1989-04-20 1989-04-20 Pending JPH02138431U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989047552U JPH02138431U (en) 1989-04-20 1989-04-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989047552U JPH02138431U (en) 1989-04-20 1989-04-20

Publications (1)

Publication Number Publication Date
JPH02138431U true JPH02138431U (en) 1990-11-19

Family

ID=31563580

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989047552U Pending JPH02138431U (en) 1989-04-20 1989-04-20

Country Status (1)

Country Link
JP (1) JPH02138431U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0629356A (en) * 1991-06-13 1994-02-04 Nec Yamagata Ltd Container for semiconductor element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0629356A (en) * 1991-06-13 1994-02-04 Nec Yamagata Ltd Container for semiconductor element

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