JPS6379651U - - Google Patents
Info
- Publication number
- JPS6379651U JPS6379651U JP1986173852U JP17385286U JPS6379651U JP S6379651 U JPS6379651 U JP S6379651U JP 1986173852 U JP1986173852 U JP 1986173852U JP 17385286 U JP17385286 U JP 17385286U JP S6379651 U JPS6379651 U JP S6379651U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- groove
- protrusion
- semiconductor device
- circumferential surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/013—Manufacture or treatment of die-attach connectors
- H10W72/01308—Manufacture or treatment of die-attach connectors using permanent auxiliary members, e.g. using alignment marks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07311—Treating the bonding area before connecting, e.g. by applying flux or cleaning
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986173852U JPS6379651U (pt) | 1986-11-12 | 1986-11-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986173852U JPS6379651U (pt) | 1986-11-12 | 1986-11-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6379651U true JPS6379651U (pt) | 1988-05-26 |
Family
ID=31111700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986173852U Pending JPS6379651U (pt) | 1986-11-12 | 1986-11-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6379651U (pt) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006303216A (ja) * | 2005-04-21 | 2006-11-02 | Denso Corp | 樹脂封止型半導体装置 |
| JP2008177496A (ja) * | 2007-01-22 | 2008-07-31 | Matsushita Electric Ind Co Ltd | リードフレーム、パッケージ部品、半導体装置およびそれらの製造方法 |
| JP2014060211A (ja) * | 2012-09-14 | 2014-04-03 | Omron Corp | 基板構造、半導体チップの実装方法及びソリッドステートリレー |
| CN111916420A (zh) * | 2019-05-08 | 2020-11-10 | 三菱电机株式会社 | 半导体装置及其制造方法 |
-
1986
- 1986-11-12 JP JP1986173852U patent/JPS6379651U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006303216A (ja) * | 2005-04-21 | 2006-11-02 | Denso Corp | 樹脂封止型半導体装置 |
| JP2008177496A (ja) * | 2007-01-22 | 2008-07-31 | Matsushita Electric Ind Co Ltd | リードフレーム、パッケージ部品、半導体装置およびそれらの製造方法 |
| JP2014060211A (ja) * | 2012-09-14 | 2014-04-03 | Omron Corp | 基板構造、半導体チップの実装方法及びソリッドステートリレー |
| CN111916420A (zh) * | 2019-05-08 | 2020-11-10 | 三菱电机株式会社 | 半导体装置及其制造方法 |