JPS5834741U - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置

Info

Publication number
JPS5834741U
JPS5834741U JP13135281U JP13135281U JPS5834741U JP S5834741 U JPS5834741 U JP S5834741U JP 13135281 U JP13135281 U JP 13135281U JP 13135281 U JP13135281 U JP 13135281U JP S5834741 U JPS5834741 U JP S5834741U
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
lead plate
encapsulated semiconductor
moisture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13135281U
Other languages
English (en)
Inventor
亀山　泰慶
服部　昌博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP13135281U priority Critical patent/JPS5834741U/ja
Publication of JPS5834741U publication Critical patent/JPS5834741U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図Ａは従来の樹脂封止型半導体装置の平面図、第１
図Ｂは同じく側面図、第２図Ａはこの考案の第１の実施
例の樹脂封止型半導体装置の要部斜視図、第２図Ｂは同
じく要部平面図、第２図Ｃは同じく側面図、第３図Ａは
この考案の第２の実施例の樹脂封止型半導体装置の要部
斜視図、第３図Ｂは同じく要部平面図、第３図Ｃは同じ
く側面図、第４図Ａはこの考案の第３の実施例の樹脂封
止型半導体装置の要部斜視図、第４図Ｂは同じく要部平
面図、第４図Ｃは同じく側面図である。

Claims (1)

    【実用新案登録請求の範囲】
  1. リード板と、このリード板の中央に搭載した半導体チッ
    プと、前記リード板の端縁部に脚部を固定して前記半導
    体チップの上方を覆う防湿カバーと、少くとも前記リー
    ド板と前記防湿カバーとの間に充填した封止樹脂とを備
    えた樹脂封止型半導体装置。
JP13135281U 1981-08-31 1981-08-31 樹脂封止型半導体装置 Pending JPS5834741U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13135281U JPS5834741U (ja) 1981-08-31 1981-08-31 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13135281U JPS5834741U (ja) 1981-08-31 1981-08-31 樹脂封止型半導体装置

Publications (1)

Publication Number Publication Date
JPS5834741U true JPS5834741U (ja) 1983-03-07

Family

ID=29924936

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13135281U Pending JPS5834741U (ja) 1981-08-31 1981-08-31 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS5834741U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0367418U (ja) * 1989-11-02 1991-07-01

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0367418U (ja) * 1989-11-02 1991-07-01

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