JPS6379679U - - Google Patents
Info
- Publication number
- JPS6379679U JPS6379679U JP17398186U JP17398186U JPS6379679U JP S6379679 U JPS6379679 U JP S6379679U JP 17398186 U JP17398186 U JP 17398186U JP 17398186 U JP17398186 U JP 17398186U JP S6379679 U JPS6379679 U JP S6379679U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- component
- components
- multilayer printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案に係る印刷配線板の分解斜視図
、第２図は本考案の実施例を示す部品実装状態を
示す平面図、第３図は第２図の―線断面図、
第４図は従来の印刷配線板における部品実装状態
を示す平面図、第５図は第４図の―線断面図
である。
１１……第１の印刷配線板、１２……層間絶縁
接着層、１３……第２の印刷配線板、１４……よ
り丈の高い実装部品、１５……実装部品のリード
端子、１６……部品取付パツド、１７，１８……
部品逃げ穴。
FIG. 1 is an exploded perspective view of a printed wiring board according to the present invention, FIG. 2 is a plan view showing an embodiment of the present invention showing a state in which components are mounted, and FIG. 3 is a sectional view taken along the line -- in FIG.
FIG. 4 is a plan view showing a state in which components are mounted on a conventional printed wiring board, and FIG. 5 is a sectional view taken along the line -- in FIG. DESCRIPTION OF SYMBOLS 11...First printed wiring board, 12...Interlayer insulation adhesive layer, 13...Second printed wiring board, 14...Taller mounting component, 15...Lead terminal of mounting component, 16... Parts mounting pads, 17, 18...
Parts escape hole.
Claims (1)
刷配線板を用いて部品を実装するに際し、実装さ
れる部品の内でより丈の高い部品が実装される箇
所に対応する上側の印刷配線板の箇所に前記丈の
高い部品の逃げ穴を形成し、前記上側の印刷配線
板表面から下がつた面に前記丈の高い部品を実装
するようにしたことを特徴とする多層印刷配線板
における部品実装構造。 When components are mounted using a multilayer printed wiring board made up of two or more boards pasted together, the upper printed wiring board corresponds to the part where taller components are mounted. A component in a multilayer printed wiring board, characterized in that an escape hole for the tall component is formed at a location, and the tall component is mounted on a surface descending from the surface of the upper printed wiring board. Implementation structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17398186U JPS6379679U (en) | 1986-11-14 | 1986-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17398186U JPS6379679U (en) | 1986-11-14 | 1986-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6379679U true JPS6379679U (en) | 1988-05-26 |
Family
ID=31111951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17398186U Pending JPS6379679U (en) | 1986-11-14 | 1986-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6379679U (en) |
-
1986
- 1986-11-14 JP JP17398186U patent/JPS6379679U/ja active Pending