JPS6382937U - - Google Patents

Info

Publication number
JPS6382937U
JPS6382937U JP1986178656U JP17865686U JPS6382937U JP S6382937 U JPS6382937 U JP S6382937U JP 1986178656 U JP1986178656 U JP 1986178656U JP 17865686 U JP17865686 U JP 17865686U JP S6382937 U JPS6382937 U JP S6382937U
Authority
JP
Japan
Prior art keywords
pellet
grounding electrode
semiconductor device
electrically connected
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986178656U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986178656U priority Critical patent/JPS6382937U/ja
Publication of JPS6382937U publication Critical patent/JPS6382937U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01308—Manufacture or treatment of die-attach connectors using permanent auxiliary members, e.g. using alignment marks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07311—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案に係る半導体装置の一実施例を
示す要部斜視図、第２図は第１図のＡ―Ａ線断面
図、第３図は本考案に係るドーナツ状凹溝の形成
に用いられるパンチの斜視図、第４図は従来の半
導体装置の斜視図である。 ９……半導体ペレツト、１０……ペレツトマウ
ント部、１１……固着用半田、１２……接地用電
極、１４……凹溝、４……リード遊端部。 FIG. 1 is a perspective view of a main part showing an embodiment of a semiconductor device according to the present invention, FIG. 2 is a sectional view taken along line AA in FIG. 1, and FIG. 3 is a formation of a donut-shaped groove according to the present invention. FIG. 4 is a perspective view of a conventional semiconductor device. 9... Semiconductor pellet, 10... Pellet mount portion, 11... Fixing solder, 12... Grounding electrode, 14... Concave groove, 4... Lead free end.

補正 昭６２．１．１３ 図面の簡単な説明を次のように補正する。 明細書第６頁第１行「ドーナツ状凹溝」を「環
状凹溝」と補正する。 明細書第６頁第７行「４……リード遊端部。」
を「４……リード。」と補正する。Amendment January 13, 1982 The brief description of the drawing is amended as follows. "Donut-shaped groove" in the first line of page 6 of the specification is corrected to "annular groove." Page 6, line 7 of the specification: "4...Lead free end."
is corrected to "4...lead."

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 表面に接地用電極を含む電極を有する半導体ペ
レツトをペレツトマウント部に固着し、該ペレツ
トマウント部近傍に近接したリード遊端部と上記
半導体ペレツトの接地用電極を除く他の電極とを
電気的に接続すると共に接地用電極とペレツトマ
ウント部とを電気的に接続し、上記ペレツトを含
む主要部を樹脂被覆した半導体装置において、上
記ペレツトマウント部上の接地用電極と電気的に
接続される部分に環状の凹溝を形成したことを特
徴とする半導体装置。 A semiconductor pellet having an electrode including a grounding electrode on its surface is fixed to a pellet mount, and the free end of the lead near the pellet mount is electrically connected to the other electrodes of the semiconductor pellet except for the grounding electrode. In a semiconductor device in which the main part including the pellet is coated with resin, the grounding electrode and the pellet mount part are electrically connected to each other, and the grounding electrode on the pellet mount part is electrically connected to the grounding electrode on the pellet mount part. 1. A semiconductor device characterized in that an annular groove is formed in a portion of the semiconductor device.
JP1986178656U 1986-11-19 1986-11-19 Pending JPS6382937U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986178656U JPS6382937U (en) 1986-11-19 1986-11-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986178656U JPS6382937U (en) 1986-11-19 1986-11-19

Publications (1)

Publication Number Publication Date
JPS6382937U true JPS6382937U (en) 1988-05-31

Family

ID=31120993

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986178656U Pending JPS6382937U (en) 1986-11-19 1986-11-19

Country Status (1)

Country Link
JP (1) JPS6382937U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03248541A (en) * 1990-02-27 1991-11-06 Mitsubishi Electric Corp Semiconductor package

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57120354A (en) * 1981-01-19 1982-07-27 Yamagata Nippon Denki Kk Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57120354A (en) * 1981-01-19 1982-07-27 Yamagata Nippon Denki Kk Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03248541A (en) * 1990-02-27 1991-11-06 Mitsubishi Electric Corp Semiconductor package

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