JPS6383253A - Surface treatment of aluminum hot dipped steel sheet - Google Patents
Surface treatment of aluminum hot dipped steel sheetInfo
- Publication number
- JPS6383253A JPS6383253A JP22719586A JP22719586A JPS6383253A JP S6383253 A JPS6383253 A JP S6383253A JP 22719586 A JP22719586 A JP 22719586A JP 22719586 A JP22719586 A JP 22719586A JP S6383253 A JPS6383253 A JP S6383253A
- Authority
- JP
- Japan
- Prior art keywords
- steel sheet
- alloy
- alloy powder
- surface treatment
- org
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 13
- 238000004381 surface treatment Methods 0.000 title claims description 12
- 229910000831 Steel Inorganic materials 0.000 title abstract description 12
- 239000010959 steel Substances 0.000 title abstract description 12
- 239000000843 powder Substances 0.000 claims abstract description 33
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 31
- 239000000956 alloy Substances 0.000 claims abstract description 31
- 229910020816 Sn Pb Inorganic materials 0.000 claims abstract description 23
- 229910020922 Sn-Pb Inorganic materials 0.000 claims abstract description 23
- 229910008783 Sn—Pb Inorganic materials 0.000 claims abstract description 23
- 239000011230 binding agent Substances 0.000 claims abstract description 23
- 238000010438 heat treatment Methods 0.000 claims abstract description 13
- 238000007747 plating Methods 0.000 claims abstract description 10
- 239000012298 atmosphere Substances 0.000 claims abstract description 9
- 230000008018 melting Effects 0.000 claims abstract description 8
- 238000002844 melting Methods 0.000 claims abstract description 8
- 229910000680 Aluminized steel Inorganic materials 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 230000001590 oxidative effect Effects 0.000 claims description 3
- 229910009038 Sn—P Inorganic materials 0.000 claims 1
- 125000003158 alcohol group Chemical group 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 abstract description 19
- 230000004907 flux Effects 0.000 abstract description 8
- 238000005476 soldering Methods 0.000 abstract description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract description 3
- 230000009972 noncorrosive effect Effects 0.000 abstract description 2
- 229910000978 Pb alloy Inorganic materials 0.000 description 10
- 238000000576 coating method Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- 230000001680 brushing effect Effects 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- GOQYKNQRPGWPLP-UHFFFAOYSA-N heptadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 description 2
- BXWNKGSJHAJOGX-UHFFFAOYSA-N hexadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCO BXWNKGSJHAJOGX-UHFFFAOYSA-N 0.000 description 2
- XGFDHKJUZCCPKQ-UHFFFAOYSA-N nonadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCCO XGFDHKJUZCCPKQ-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- REIUXOLGHVXAEO-UHFFFAOYSA-N pentadecan-1-ol Chemical compound CCCCCCCCCCCCCCCO REIUXOLGHVXAEO-UHFFFAOYSA-N 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- HLZKNKRTKFSKGZ-UHFFFAOYSA-N tetradecan-1-ol Chemical compound CCCCCCCCCCCCCCO HLZKNKRTKFSKGZ-UHFFFAOYSA-N 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- XFRVVPUIAFSTFO-UHFFFAOYSA-N 1-Tridecanol Chemical compound CCCCCCCCCCCCCO XFRVVPUIAFSTFO-UHFFFAOYSA-N 0.000 description 1
- 229910020994 Sn-Zn Inorganic materials 0.000 description 1
- 229910009069 Sn—Zn Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229960000541 cetyl alcohol Drugs 0.000 description 1
- LQZZUXJYWNFBMV-UHFFFAOYSA-N dodecan-1-ol Chemical compound CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 229940043348 myristyl alcohol Drugs 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229940087291 tridecyl alcohol Drugs 0.000 description 1
Landscapes
- Coating With Molten Metal (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は溶融アルミメッキ鋼板にハンダ付は性を付与す
る溶融アルミメッキ鋼板の表面処理法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a surface treatment method for a hot-dip aluminized steel plate that imparts solderability to the hot-dip aluminized steel plate.
溶融アルミメッキ鋼板は、耐熱性を中心に高温における
耐食性、熱反射性、外観の美麗さ、無公害性などの優れ
た特性を発揮することから、自動車部品、家庭器物など
の分野ではば広く用いられている。溶融アルミメッキ鋼
板は表面に生成される緻密なＡ ＃ ２０．の酸化皮膜
によって耐食性および耐熱性が向上する点に特徴がある
が１反面、ハンダ付は性が非常に悪い。特に９通常のＳ
ｎ−Ｐｈ系ハンダを用いてはハンダ付けは殆ど不可能で
ある。Hot-dip aluminized steel sheets are widely used in fields such as automobile parts and household appliances because they exhibit excellent properties such as heat resistance, corrosion resistance at high temperatures, heat reflection, beautiful appearance, and non-pollution. It is being Hot-dip aluminized steel plate has a dense A# 20. formed on the surface. The oxidized film improves corrosion resistance and heat resistance, but on the other hand, it has very poor soldering properties. Especially 9 normal S
Soldering is almost impossible using n-Ph solder.
このため、従来において溶融アルミメッキ鋼板をハンダ
付けすることが必要な場合には、特殊なフラ・７クスを
使用し、Ｓｎ−Ｚｎ系或いはＳ ｎ−Ｚ ｎ−Ａｌ系な
どの特殊なアルミニウム用ハンダが使用されていた。そ
のさいのフラックスとしては、溶融アルミメッキ鋼板の
表面が緻密な酸化皮膜で覆われていることから、腐食性
の強い弗酸系のものが通常使用されていた。For this reason, in the past, when it was necessary to solder hot-dip aluminized steel sheets, a special flux was used to solder a special aluminum plate such as Sn-Zn or Sn-Z n-Al. solder was used. Because the surface of hot-dip aluminized steel sheets is covered with a dense oxide film, a highly corrosive hydrofluoric acid-based flux is usually used.
本発明は、緻密な酸化皮膜を有することがらノ＼ンダ付
は性が劣るという溶融アルミメッキ鋼板の問題点を改善
しようとするものである。The present invention aims to improve the problem of hot-dip aluminized steel sheets, which have poor soldering properties due to their dense oxide films.
既述のように、従来の溶融アルミメッキ鋼板のハンダ付
けには、弗酸を含有るす腐食性の強いフラックスを用い
てハンダ付けを行っている。このため、残留するフラッ
クスを十分に除去することが必要となり、またハンダ付
は作業時に作業者が有害な影響を受けることがあった。As mentioned above, conventional hot-dip aluminized steel plates are soldered using a highly corrosive flux containing hydrofluoric acid. Therefore, it is necessary to sufficiently remove the remaining flux, and workers may be adversely affected during soldering work.
本発明の目的は、前記の問題点を解決し、普通のＳｎ−
Ｐｂ系のハンダを使用し且つ普通の非腐食性のフラック
ス（例えばロジン系フラックス）を用いても、良好にハ
ンダができる溶融アルミノ・ツキ鋼板を提供しようとす
るものである。The object of the present invention is to solve the above-mentioned problems and to
The object of the present invention is to provide a molten alumino steel plate that can be soldered well even when Pb-based solder is used and ordinary non-corrosive flux (for example, rosin-based flux) is used.
ｃ問題点を解決する手段〕
本発明は、溶融アルミメッキ鋼板の表面に０．５〜１０
ｇ／ ｒｄのＳｎ−Ｐｂ合金粉末を有機バインダーを用
いて付着させたうえ、無酸化雰囲気中または還元雰囲気
中で該Ｓｎ−Ｐｂ合金の融点板」二〜溶融アルミメッキ
層の融点以下の温度に加熱してアルミメッキ層中に該Ｓ
ｎ−Ｐｂ合金を拡散させることを特徴とする。本発明に
よればハンダ付は性が著しく改善された溶融アルミメッ
キ鋼板が得られる。c Means for Solving the Problems] The present invention provides a coating of 0.5 to 10
g/rd of Sn-Pb alloy powder is attached using an organic binder, and then the melting point plate of the Sn-Pb alloy is heated to a temperature below the melting point of the molten aluminized layer in a non-oxidizing atmosphere or a reducing atmosphere. The S is heated into the aluminum plating layer.
It is characterized by diffusing n-Pb alloy. According to the present invention, a hot-dip aluminized steel plate with significantly improved soldering properties can be obtained.
本発明で使用するＳｎ−Ｐｂ合金粉末としては。As the Sn-Pb alloy powder used in the present invention.
ＪＩＳ Ｚ ３２８２で規定されているハンダ用粉末を
使用するのが好適であり２より具体的には１０〜９０重
量％のＳｎをｐｂ中に含有する合金粉末が使用できる。It is preferable to use a solder powder specified in JIS Z 3282, and more specifically, an alloy powder containing 10 to 90% by weight of Sn in PB can be used.
最も望ましくは、５０％Ｓｎ−５０％Ｐｂ、 ４０％Ｓ
ｎ−６０％Ｐｂ、 ６０％Ｓ ｎ−４０％ｐｂのものを
使用する。Most preferably 50%Sn-50%Pb, 40%S
Use n-60%Pb, 60%S n-40%pb.
この場合特殊な粒度や形状のものを使用する必要はなく
、Ｓｎ−Ｐｂハンダ粉末として市販されている （例え
ば噴霧粉末、搗破粉末など）ものをそのまま使用するこ
とができ、好ましくは２００μｍ以下の粒度のものを使
用する。In this case, there is no need to use a special particle size or shape, and commercially available Sn-Pb solder powder (e.g. spray powder, punched powder, etc.) can be used as is, preferably with a particle size of 200 μm or less. Use a grain size.
本発明ではまずこのＳｎ−Ｐｈ合金粉末を溶融アルミメ
ッキ鋼板の表面に均一に塗布するのであるが、この塗布
処理は粘着性を有する低融点の有機バインダーを使用し
て行う。低融点の粘着性有機バインダーとしては２例え
ば、ラウリルアルコール、トリデシルアルコール、ペン
タデシルアルコール、ヘプタデシルアルコール、ノナデ
シルアルコール、ミリスチルアルコール、セチルアルコ
ール等のアルコール類が使用できる。塗布処理にあたっ
ては、このようなアルコール類にＳｎ−Ｐｂ合金粉末を
均一に懸濁させたあとこの懸濁液を溶融アルミメッキ鋼
板の表面に塗布してもよいし、アルコール類を溶融アル
ミメッキ鋼板に塗布してからＳ ｎ−Ｐ ｂ合金粉末を
塗布してもよい。いずれにしてもＳｎ−Ｐｂ合金粉末は
溶融アルミノ・ツキ鋼板表面に０．５〜］Ｏｇ／ ｒｄ
の量で塗布されるように調節して付着さゼることか必要
である。Ｓ ｎ−Ｐ ｂ合金粉末の塗布量が０．５ｇ／
ｒｄ未満では十分なノ＼ンダ付は性が得られないし、
Ｌｏｇ／ｎ？を超える量より多く付着させてもハンダ
付は性の効果は変わらないからである。In the present invention, this Sn--Ph alloy powder is first uniformly applied to the surface of a hot-dip aluminized steel plate, and this application process is performed using an adhesive, low-melting-point organic binder. As the adhesive organic binder with a low melting point, for example, alcohols such as lauryl alcohol, tridecyl alcohol, pentadecyl alcohol, heptadecyl alcohol, nonadecyl alcohol, myristyl alcohol, and cetyl alcohol can be used. In the coating process, the Sn-Pb alloy powder may be uniformly suspended in such an alcohol and then this suspension may be applied to the surface of the hot-dip aluminized steel sheet, or the alcohol may be applied to the surface of the hot-dip aluminized steel sheet. The S n-P b alloy powder may be applied after the S n-P b alloy powder is applied. In any case, the Sn-Pb alloy powder is applied to the surface of the molten alumino steel plate at a rate of 0.5~]Og/rd.
It is necessary to adjust the amount so that it adheres. The coating amount of S n-P b alloy powder is 0.5 g/
If it is less than rd, sufficient soldering cannot be achieved,
Log/n? This is because the effect of soldering does not change even if the amount exceeds .
次に、Ｓｎ−Ｐｂ合金粉末を表面に４１着させた溶融ア
ルミメッキ鋼板を、Ｓｎ−Ｐｂ合金粉末の融点以上の温
度で且つアルミメッキ層の融点以下の温度、好ましくは
２００℃〜６５０℃の温度で、無酸化雰囲気（例えばＮ
２雰囲気）中または還元雰囲気（例えばＡＸガス雰囲気
）中で、有機バインダーが蒸発除去されると同時にＳｎ
−Ｐｂ合金が融解してアルミメッキ層中に拡散するに十
分な時間、加熱処理する。この加熱処理によってアルミ
メッキ層にＳｎ−Ｐｂ合金が拡散した溶融アルミメッキ
鋼板が得られるが、この溶融アルミメッキ鋼板は後記の
実施例に示すように良好なハンダイ」け性を示す。Next, a hot-dip aluminized steel plate with Sn-Pb alloy powder deposited on its surface is heated at a temperature above the melting point of the Sn-Pb alloy powder and below the melting point of the aluminized layer, preferably from 200°C to 650°C. temperature and a non-oxidizing atmosphere (e.g. N
2 atmosphere) or in a reducing atmosphere (e.g. AX gas atmosphere), the organic binder is evaporated and removed at the same time as Sn
- Heat treatment for a time sufficient for the Pb alloy to melt and diffuse into the aluminized layer. This heat treatment yields a hot-dip aluminized steel sheet in which the Sn--Pb alloy is diffused into the aluminized layer, and this hot-dip aluminized steel sheet exhibits good solderability as shown in Examples below.
本発明の表面処理法は、溶融アルミメッキ鋼板の製品コ
イルを用いて連続処理によって実施することができる。The surface treatment method of the present invention can be carried out by continuous treatment using a product coil made of hot-dip aluminized steel sheet.
第１図は本発明の表面処理法を実施するのに好適な連続
処理装置の例を示したものである。FIG. 1 shows an example of a continuous treatment apparatus suitable for carrying out the surface treatment method of the present invention.
第１図において、１は溶融アルミメッキ鋼板コイルのア
ンコイラ−（巻戻し機）、２は巻取機であリ、このアン
コイラ−１から巻取機２の間のラインに、有機バインダ
ー塗布装置３．３ｎ−Ｐｂ合金粉末付着槽４．加熱炉５
．ブラッシング装置６および剪断機７が、鋼板の流れの
順に設置されている。In FIG. 1, 1 is an uncoiler (unwinding machine) for hot-dip aluminized steel sheet coils, 2 is a winder, and an organic binder coating device 3 is installed on the line between the uncoiler 1 and the winder 2. .3n-Pb alloy powder deposition tank4. Heating furnace 5
．． A brushing device 6 and a shearing machine 7 are installed in order of the flow of steel sheets.
を機バインダー塗布装置３はロール式塗布装置が使用さ
れており、これは、ラインの溶融アルミメッキ層中の両
表面に接するようにコークロール８１８゛を配置し、こ
のコークロール８．８゛の表面に有機バインダー槽９，
９”内の有機バインダーを供給するフィードロール１０
．１０’を設置してなる。The machine binder coating device 3 uses a roll-type coating device, in which a caulk roll 818゛ is arranged so as to be in contact with both surfaces of the molten aluminum plating layer on the line, and the caulk roll 8.8゛ is Organic binder tank 9 on the surface,
Feed roll 10 that supplies organic binder within 9”
．． 10' is installed.
Ｓｎ−Ｐｂ合金粉末付着槽４はＳｎ−Ｐｂ合金粉末を槽
内に浮遊させる槽であり、このＳｎ−Ｐｂ合金粉末が浮
遊した槽内を有機バインダーを塗布した溶融アルミメッ
キ鋼板を通板させることによってＳｎ−Ｐｂ合金粉末を
その表面に付着させる。Ｓｎ−ｐｂ合金粉末の浮遊手段
としては振動および／またはエアー吹き込みを用いる。The Sn-Pb alloy powder deposition tank 4 is a tank in which Sn-Pb alloy powder is suspended, and a hot-dip aluminized steel plate coated with an organic binder is passed through the tank in which the Sn-Pb alloy powder is suspended. The Sn--Pb alloy powder is attached to the surface. Vibration and/or air blowing are used as means for suspending the Sn-pb alloy powder.
Ｓ ｎ−Ｐ ｂ合金粉末の付着量は、既述のように０．
５〜１０ｇ／ ｒｄとなるように調整するが、これは前
工程の有機バインダー層を適切に選定することによって
調節することができる。すなわち、この浮遊槽でのＳｎ
−Ｐｂ合金粉末の付着量は有機バインダーの塗布量およ
び有機バインダーの粘着力に大きく依存するから、適切
な有機バインダー層を使用すればこの槽４では実質上均
等に前記範囲のＳｎ−Ｐｂ合金粉末を付着させることが
できる。The amount of S n-P b alloy powder deposited is 0.0 as described above.
It is adjusted to 5 to 10 g/rd, but this can be adjusted by appropriately selecting the organic binder layer in the previous step. In other words, Sn in this floating tank
- Since the amount of Pb alloy powder deposited largely depends on the amount of organic binder applied and the adhesive strength of the organic binder, if an appropriate organic binder layer is used, the Sn--Pb alloy powder in the above range will be distributed substantially uniformly in this tank 4. can be attached.
加熱炉５は、Ｎ２ガスまたはＡＸガス雰囲気に保持され
た連続加熱炉であり、炉内温度は前述のように、２００
℃〜６５０℃の温度に維持される。この加熱炉５での滞
留時間は、Ｓｎ−Ｐｂ合金がアルミメッキ層中に拡散で
きるに十分な時間となるようにラインスピードを調整す
ることによって調節される。The heating furnace 5 is a continuous heating furnace maintained in an N2 gas or AX gas atmosphere, and the temperature inside the furnace is 200°C as described above.
The temperature is maintained between 650°C and 650°C. The residence time in the heating furnace 5 is adjusted by adjusting the line speed so as to provide sufficient time for the Sn--Pb alloy to diffuse into the aluminum plating layer.
この加熱炉５を出た鋼板は必要に応じてロールブラシを
用いたブラッシング装Ｗ６によって軽度のブラッシング
が行われ、シャー７によって切板されるか、または巻取
機２によってコイリングされ、これによって本発明法に
よる表面処理が連続的に行われる。The steel plate leaving the heating furnace 5 is lightly brushed as necessary by a brushing device W6 using a roll brush, and then cut by a shear 7 or coiled by a winding machine 2. Surface treatment according to the invention method is carried out continuously.
本装置は、有機バインダーの塗布とＳ ｎ−Ｐ ｂ合金
粉末の付着とを分離し、有機バインダーの粘着力によっ
てＳｎ−Ｐｂ合金粉末の付着量を一定に管理できるよう
にした点に特徴がある。This device is characterized by separating the application of the organic binder and the adhesion of the Sn-Pb alloy powder, and making it possible to control the amount of the Sn-Pb alloy powder adhered to a constant level using the adhesive strength of the organic binder. .
以下に本発明の実施例を挙げる。Examples of the present invention are listed below.
板厚０．６ｍｍ、 メッキ付着量片面６０ｇ／ Ｉｄ
の溶融アルミメッキ鋼板（通常のダルスキンバス仕上品
およびブライトパス処理を行った光沢仕上品）に対し、
第１表に示す条件で本発明の表面処理を行った。そして
、得られた処理品のハンダ付は性をハンダ拡がり試験に
よって評価した。その結果を第１表に併記した。Plate thickness 0.6mm, plating weight 60g/Id on one side
For hot-dip aluminized steel sheets (regular dull skin bath finish and bright pass treated gloss finish),
The surface treatment of the present invention was carried out under the conditions shown in Table 1. The solderability of the obtained processed product was evaluated by a solder spreading test. The results are also listed in Table 1.
ハンダ拡がり試験は、５ｃｍＸ５ｃｍの試片の上に５ｍ
ｍ長さのＪＩＳ規格Ｉ＋ ５ ＯＡのロジン系フラック
ス入すハンダを乗せ、２２０℃のハンダ浴上に３０秒間
浮かべ、この時のハンダ拡がり面積を以下の基準で評価
した。◎：十分にハンダが拡がる。○：ハンダ拡がりが
認められる。△：はとんどハンダ拡がりが認められない
。×：まったくハンダ拡がりが認められない。The solder spread test was carried out on a 5cm x 5cm specimen.
A length of m length of JIS standard I+ 5 OA rosin-based flux filled solder was placed and floated on a solder bath at 220° C. for 30 seconds, and the solder spreading area was evaluated using the following criteria. ◎: Solder spreads sufficiently. ○: Solder spreading is observed. △: Hardly any solder spreading was observed. ×: No solder spreading was observed at all.
第１表の結果から２本発明法に従ってＳｎ−Ｐｂ合金粉
末を０．５ｇ／ ｇ以上で付着させ、２００〜６５０℃
の温度で加熱処理したものはいずれもハンダ拡がり性が
良好であることがわかる。とくに普通のロジン系フラン
クスの使用によっても十分なハンダ付は性が得られたこ
とは従来の溶融アルミメッキ鋼板にはない特性を付与で
きたことを示している。一方３．比較例１のように、Ｓ
ｎ−Ｐｂ合金の付着量が０．５ｇ／ｎｆより少ない場合
、或いは比較例２に見られるように加熱処理温度が低い
場合、また、比較例３のように加熱温度が高すぎる場合
には、良好なハンダ拡がり性が得られなかった。比較例
３の場合にはＳｎ−Ｐｂ合金がアルミメッキ層の内部に
拡散してしまったことが良好な成績が得られなかった理
由であると考えられる。From the results in Table 1, 2 Sn-Pb alloy powder was deposited at 0.5 g/g or more according to the method of the present invention, and the temperature was 200 to 650°C.
It can be seen that the solder spreadability was good in all the samples heat-treated at a temperature of . In particular, the fact that sufficient solderability was obtained even with the use of ordinary rosin-based franks indicates that properties not found in conventional hot-dip aluminized steel sheets could be imparted. On the other hand 3. As in Comparative Example 1, S
When the adhesion amount of n-Pb alloy is less than 0.5 g/nf, or when the heat treatment temperature is low as in Comparative Example 2, or when the heating temperature is too high as in Comparative Example 3, Good solder spreadability could not be obtained. In the case of Comparative Example 3, it is thought that the reason why good results were not obtained is that the Sn-Pb alloy diffused into the interior of the aluminum plating layer.
第１図は本発明の表面処理法を実施するのに好適な溶融
アルミメッキ鋼板の表面処理装置の例を示す略断面図で
ある。
１・・アンコイラ−１２・・巻取機。
３・・有機バインダー塗布装置５
４・・Ｓ ｎ−Ｐ ｂ合金粉末付着槽、 ５・・加熱
炉。
６・・ブラッシング装置、 ７・・剪断機。
８・・コータロール、 ９・・有機バインター槽。
１０・・フィードロール。FIG. 1 is a schematic cross-sectional view showing an example of a surface treatment apparatus for hot-dip aluminized steel sheets suitable for carrying out the surface treatment method of the present invention. 1. Uncoiler 12. Winding machine. 3. Organic binder coating device 5 4. Sn-Pb alloy powder deposition tank 5. Heating furnace. 6. Brushing device, 7. Shearing machine. 8. Coater roll, 9. Organic binder tank. 10...Feed roll.
Claims (4)
ｍ＾２のＳｎ−Ｐｂ合金粉末を有機バインダーを用いて
付着させたうえ、無酸化雰囲気中または還元雰囲気中で
該Ｓｎ−Ｐｂ合金の融点以上〜溶融アルミメッキ層の融
点以下の温度に加熱してアルミメッキ層中に該Ｓｎ−Ｐ
ｂ合金を拡散させることからなる溶融アルミメッキ鋼板
の表面処理法。(1) 0.5-10g/ on the surface of hot-dip aluminized steel plate
m^2 of Sn-Pb alloy powder is attached using an organic binder, and then heated to a temperature above the melting point of the Sn-Pb alloy to below the melting point of the molten aluminum plating layer in a non-oxidizing atmosphere or a reducing atmosphere. The Sn-P in the aluminum plating layer
A surface treatment method for hot-dip aluminized steel sheets consisting of diffusing b-alloy.
をＰｂ中に含有する合金粉末である特許請求の範囲第１
項記載の表面処理法。(2) Sn-Pb alloy powder contains 10 to 90% by weight of Sn
Claim 1 is an alloy powder containing Pb in Pb.
Surface treatment method described in section.
請求の範囲第１項または第２項記載の表面処理法。(3) The surface treatment method according to claim 1 or 2, wherein the heating temperature is in the range of 200°C to 650°C.
ある特許請求の範囲第１項、第２項または第３項記載の
表面処理法。(4) The surface treatment method according to claim 1, 2 or 3, wherein the organic binder is an alcohol having adhesive properties.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22719586A JPH0751741B2 (en) | 1986-09-27 | 1986-09-27 | Surface treatment method for molten aluminum plated steel sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22719586A JPH0751741B2 (en) | 1986-09-27 | 1986-09-27 | Surface treatment method for molten aluminum plated steel sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6383253A true JPS6383253A (en) | 1988-04-13 |
| JPH0751741B2 JPH0751741B2 (en) | 1995-06-05 |
Family
ID=16856983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22719586A Expired - Lifetime JPH0751741B2 (en) | 1986-09-27 | 1986-09-27 | Surface treatment method for molten aluminum plated steel sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0751741B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007075943A (en) * | 2005-09-14 | 2007-03-29 | Okamoto Machine Tool Works Ltd | Double sided polishing device of square shaped substrate and its polishing method |
-
1986
- 1986-09-27 JP JP22719586A patent/JPH0751741B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007075943A (en) * | 2005-09-14 | 2007-03-29 | Okamoto Machine Tool Works Ltd | Double sided polishing device of square shaped substrate and its polishing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0751741B2 (en) | 1995-06-05 |
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