JPS6384352U - - Google Patents

Info

Publication number
JPS6384352U
JPS6384352U JP1986179196U JP17919686U JPS6384352U JP S6384352 U JPS6384352 U JP S6384352U JP 1986179196 U JP1986179196 U JP 1986179196U JP 17919686 U JP17919686 U JP 17919686U JP S6384352 U JPS6384352 U JP S6384352U
Authority
JP
Japan
Prior art keywords
led
led array
array
transparent substrate
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986179196U
Other languages
English (en)
Other versions
JPH0721329Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986179196U priority Critical patent/JPH0721329Y2/ja
Publication of JPS6384352U publication Critical patent/JPS6384352U/ja
Application granted granted Critical
Publication of JPH0721329Y2 publication Critical patent/JPH0721329Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/879—Bump connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Exposure Or Original Feeding In Electrophotography (AREA)
  • Dot-Matrix Printers And Others (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Laser Beam Printer (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示すＬＥＤアレー
ヘツドの構造断面図、第２図は通常のＬＥＤプリ
ンタの構成を説明する概略構成図であり、第３図
は従来のＬＥＤアレーヘツドの構造断面図である
。 １１……透明基板、１３……ＬＥＤチツプ、１
５……シール材、１８……液体、１９……スペー
サ、２０……自己集束型ロツドレンズアレー。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) ＬＥＤアレーを選択的に発光させ電子写真
    方式により印字を行なうＬＥＤプリンタのＬＥＤ
    アレーヘツドにおいて、ＬＥＤアレーを透明基板
    上に発光部が該基板面と対向するようにフリツプ
    チツプ形式により実装すると共に、前記透明基板
    とＬＥＤアレーとの間に空気よりも屈折率の大き
    い物質を充填したことを特徴とするＬＥＤアレー
    ヘツド。 (2) 実用新案登録請求の範囲第(1)項記載のＬＥ
    Ｄアレーヘツドにおいて前記透明基板のＬＥＤア
    レー実装面と反対側の面に自己集束型ロツドレン
    ズアレーを取付けたことを特徴とするＬＥＤアレ
    ーヘツド。
JP1986179196U 1986-11-21 1986-11-21 Ｌｅｄアレ−ヘツド Expired - Lifetime JPH0721329Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986179196U JPH0721329Y2 (ja) 1986-11-21 1986-11-21 Ｌｅｄアレ−ヘツド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986179196U JPH0721329Y2 (ja) 1986-11-21 1986-11-21 Ｌｅｄアレ−ヘツド

Publications (2)

Publication Number Publication Date
JPS6384352U true JPS6384352U (ja) 1988-06-02
JPH0721329Y2 JPH0721329Y2 (ja) 1995-05-17

Family

ID=31122042

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986179196U Expired - Lifetime JPH0721329Y2 (ja) 1986-11-21 1986-11-21 Ｌｅｄアレ−ヘツド

Country Status (1)

Country Link
JP (1) JPH0721329Y2 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04356978A (ja) * 1991-05-31 1992-12-10 Kyocera Corp 画像装置
JP2001036148A (ja) * 1999-07-23 2001-02-09 Matsushita Electric Works Ltd 光源装置
JP2008186795A (ja) * 2007-01-31 2008-08-14 Casio Comput Co Ltd 発光装置及び印刷装置
JP2008186794A (ja) * 2007-01-31 2008-08-14 Casio Comput Co Ltd 発光装置及び印刷装置
JP2014107502A (ja) * 2012-11-29 2014-06-09 Citizen Holdings Co Ltd 発光装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5598879A (en) * 1979-01-23 1980-07-28 Oki Electric Ind Co Ltd Light emitting element arraying unit
JPS60117154U (ja) * 1984-01-17 1985-08-08 沖電気工業株式会社 光学式記録ヘツド
JPS61123555U (ja) * 1985-01-19 1986-08-04

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5598879A (en) * 1979-01-23 1980-07-28 Oki Electric Ind Co Ltd Light emitting element arraying unit
JPS60117154U (ja) * 1984-01-17 1985-08-08 沖電気工業株式会社 光学式記録ヘツド
JPS61123555U (ja) * 1985-01-19 1986-08-04

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04356978A (ja) * 1991-05-31 1992-12-10 Kyocera Corp 画像装置
JP2001036148A (ja) * 1999-07-23 2001-02-09 Matsushita Electric Works Ltd 光源装置
JP2008186795A (ja) * 2007-01-31 2008-08-14 Casio Comput Co Ltd 発光装置及び印刷装置
JP2008186794A (ja) * 2007-01-31 2008-08-14 Casio Comput Co Ltd 発光装置及び印刷装置
JP2014107502A (ja) * 2012-11-29 2014-06-09 Citizen Holdings Co Ltd 発光装置

Also Published As

Publication number Publication date
JPH0721329Y2 (ja) 1995-05-17

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