JPS6397253U - - Google Patents

Info

Publication number
JPS6397253U
JPS6397253U JP19204386U JP19204386U JPS6397253U JP S6397253 U JPS6397253 U JP S6397253U JP 19204386 U JP19204386 U JP 19204386U JP 19204386 U JP19204386 U JP 19204386U JP S6397253 U JPS6397253 U JP S6397253U
Authority
JP
Japan
Prior art keywords
protective film
semiconductor substrate
lead electrode
layer
diffused resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19204386U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19204386U priority Critical patent/JPS6397253U/ja
Publication of JPS6397253U publication Critical patent/JPS6397253U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例の要部を示す断面図
、第2図A乃至Dは従来例を製造工程別に示す断
面図である。 1…Si基板、2…SiO2膜、5…拡散抵抗
、11…耐アルカリ金属層、12…Al層。
FIG. 1 is a sectional view showing a main part of an embodiment of the present invention, and FIGS. 2A to 2D are sectional views showing a conventional example according to manufacturing steps. DESCRIPTION OF SYMBOLS 1...Si substrate, 2... SiO2 film, 5...diffusion resistance, 11...alkali-resistant metal layer, 12...Al layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体基板の表面に形成された拡散抵抗と、該
拡散抵抗を覆うべく上記表面に形成された保護膜
と、該保護膜を形成した状態で上記半導体基板の
裏面にアルカリ溶液にてエツチング形成されたダ
イヤフラムと、上記拡散抵抗に連なるように上記
保護膜上に形成されたリード電極とを備え、上記
リード電極は上記保護膜に接して形成された耐ア
ルカリ金属層と該層上に積層して形成されたアル
ミニウム層とから成ることを特徴とするダイヤフ
ラム型半導体圧力センサ。
A diffused resistor formed on the surface of the semiconductor substrate, a protective film formed on the surface to cover the diffused resistor, and a protective film formed on the back surface of the semiconductor substrate with the protective film formed by etching with an alkaline solution. A diaphragm and a lead electrode formed on the protective film so as to be connected to the diffusion resistance, and the lead electrode is formed by laminating an alkali-resistant metal layer formed in contact with the protective film and on the layer. A diaphragm type semiconductor pressure sensor characterized by comprising an aluminum layer.
JP19204386U 1986-12-12 1986-12-12 Pending JPS6397253U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19204386U JPS6397253U (en) 1986-12-12 1986-12-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19204386U JPS6397253U (en) 1986-12-12 1986-12-12

Publications (1)

Publication Number Publication Date
JPS6397253U true JPS6397253U (en) 1988-06-23

Family

ID=31146751

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19204386U Pending JPS6397253U (en) 1986-12-12 1986-12-12

Country Status (1)

Country Link
JP (1) JPS6397253U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010253650A (en) * 2009-04-28 2010-11-11 Yokogawa Electric Corp Manufacturing method of silicon device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5816346A (en) * 1981-02-23 1983-01-31 ビデオ・タ−フ・インコ−ポレイテツド Radom digits generator and game apparatus
JPS5961146A (en) * 1982-09-30 1984-04-07 Toshiba Corp Manufacture of semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5816346A (en) * 1981-02-23 1983-01-31 ビデオ・タ−フ・インコ−ポレイテツド Radom digits generator and game apparatus
JPS5961146A (en) * 1982-09-30 1984-04-07 Toshiba Corp Manufacture of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010253650A (en) * 2009-04-28 2010-11-11 Yokogawa Electric Corp Manufacturing method of silicon device

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