JPS639929A - X-ray exposure device - Google Patents
X-ray exposure deviceInfo
- Publication number
- JPS639929A JPS639929A JP61154389A JP15438986A JPS639929A JP S639929 A JPS639929 A JP S639929A JP 61154389 A JP61154389 A JP 61154389A JP 15438986 A JP15438986 A JP 15438986A JP S639929 A JPS639929 A JP S639929A
- Authority
- JP
- Japan
- Prior art keywords
- tube
- vibrating mirror
- vacuum
- synchrotron radiation
- beam line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005469 synchrotron radiation Effects 0.000 claims abstract description 20
- 230000035939 shock Effects 0.000 claims abstract description 19
- 238000011144 upstream manufacturing Methods 0.000 claims abstract description 14
- 238000000605 extraction Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 4
- 230000002035 prolonged effect Effects 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000007774 longterm Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 230000003111 delayed effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
Landscapes
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はシンクロトロン放射線源を用いたX線露光装置
に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an X-ray exposure apparatus using a synchrotron radiation source.
近年、サブミクロン幅パターンの高速転写技術として、
高強度X線源であるシンクロトロン放射線源を用いたX
線露光技術が一段と脚光を浴びて、各所で精力的に研究
、開発が行われ始めた。シンクロトロン放射線源を用い
た露光装置の代表例として、例えば、 1984年に発
行された刊行物ニュークリア・インスツルメント・アン
ド・メソッド・イン・フイジイクス0リサーチ(Nuc
lear In5tru+*ents and Met
hods in Physics Re5earch)
第222巻、291〜301頁に示されたビームライン
、露光部構成図がある。第2図にその概略図を示す。す
なわち、シンクロトロン放射光源から放射された放射光
1がビームライン7に導入される。In recent years, high-speed transfer technology for sub-micron width patterns has been developed.
X-rays using a synchrotron radiation source, which is a high-intensity X-ray source
Line exposure technology became increasingly popular, and research and development began to be carried out vigorously in various places. As a representative example of an exposure apparatus using a synchrotron radiation source, for example, the publication Nuclear Instruments and Methods in Physics Research (Nuc) published in 1984,
lear In5tru+*ents and Met
hods in Physics Research)
There is a configuration diagram of the beam line and exposure section shown in Volume 222, pages 291-301. Fig. 2 shows its schematic diagram. That is, synchrotron radiation light 1 emitted from a synchrotron radiation light source is introduced into beam line 7 .
まず、真空バルブ2を通過した放射光1は、振動ミラー
3で垂直方向のビーム幅が拡大される。First, the beam width of the emitted light 1 that has passed through the vacuum bulb 2 in the vertical direction is expanded by the vibrating mirror 3.
さらに衝撃波遅延管4.放射線取出し用Be窓5を通っ
た放射光1が、X線マスク及び露光ウェハーを設置した
露光部6に導入される。なお1通常ビームライン7は真
空に保たれ、特にシンクロトロン放射光源に近い真空バ
ルブ2より上流側は、超高真空に保たれる。Furthermore, shock wave delay tube 4. Synchrotron radiation 1 passing through the radiation extraction Be window 5 is introduced into an exposure section 6 in which an X-ray mask and an exposure wafer are installed. Note that the beam line 7 is normally kept in a vacuum, and in particular, the upstream side of the vacuum valve 2 near the synchrotron radiation light source is kept in an ultra-high vacuum.
ところで、衝撃波遅延管4の役割は重要である。By the way, the role of the shock wave delay tube 4 is important.
すなわち、放射光取出し用Be窓5は通常数十−厚と極
めて薄いため、大気圧力等の衝撃によって破損しやすい
。そこで、Be窓5の破損事故に備えて、衝撃波遅延管
4が設置されている。 Be窓が破損したとき、流入す
る大気の流れを遅らせるために衝撃波遅延管4がある。That is, since the Be window 5 for extracting the emitted light is extremely thin, usually several tens of meters thick, it is easily damaged by impacts such as atmospheric pressure. Therefore, a shock wave delay tube 4 is installed in case the Be window 5 breaks. There is a shock wave delay tube 4 to slow down the flow of incoming atmospheric air when the Be window is broken.
流入する大気は一種の衝撃波である。衝撃波遅延管4の
構造は、スリットを有する仕切り板を一定間隔に多数枚
設けたものであり、前述の衝撃波の伝播を遅らせるもの
である。The incoming atmosphere is a kind of shock wave. The structure of the shock wave delay tube 4 is such that a large number of partition plates having slits are provided at regular intervals to delay the propagation of the above-mentioned shock waves.
この衝撃波の伝播が遅れている間に、より上流側にある
真空バルブ2を閉めて、シンクロトロン放射光源に対す
るリークを防ぐことができる。次に、振動ミラー3の役
割も重要である。シンクロトロン放射光源から発生する
放射光1は、水平方向には一様な強度分布を有している
が、垂直方向では一様な強度分布の得られる領域は極め
て狭い、−例として、垂直方向へのビームの広がりは発
光点において0.4mrad程度であるが、この場合1
0m位の露光位置でも4waにすぎない、露光ウェハー
の照射域は、少なくとも数1角が必要である。したがっ
て、水平方向は一様な強度分布が得られるので、垂直方
向に数1幅位に渡って一様なビーム強度分布を得るため
の手段を講じる必要がある。このため、ミラーを垂直方
向に振動させて、垂直方向の露光領域を拡大する機構と
して、振動ミラーを用いられているものである。振動ミ
ラーはシステム構成上のキーデバイスの一つである。While the propagation of this shock wave is delayed, the vacuum valve 2 located further upstream can be closed to prevent leakage to the synchrotron radiation source. Next, the role of the vibrating mirror 3 is also important. Synchrotron radiation light 1 generated from a synchrotron radiation light source has a uniform intensity distribution in the horizontal direction, but the area in which a uniform intensity distribution can be obtained in the vertical direction is extremely narrow. The spread of the beam is about 0.4 mrad at the emission point, but in this case
Even at an exposure position of about 0 m, the irradiation area of the exposed wafer is only 4 wa, and the irradiation area of the exposed wafer needs to be at least several squares. Therefore, since a uniform intensity distribution can be obtained in the horizontal direction, it is necessary to take measures to obtain a uniform beam intensity distribution over several widths in the vertical direction. For this reason, a vibrating mirror is used as a mechanism to vibrate the mirror in the vertical direction and expand the exposure area in the vertical direction. The vibrating mirror is one of the key devices in the system configuration.
しかしながら、従来のビームライン構成において重大な
問題点がある。However, there are significant problems with conventional beamline configurations.
第2図の振動ミラーは、真空外部よりミラーを振動させ
る必要があるが、このため、真空外部のミラー駆動機構
と真空内部のミラーとの接続を行う機構部が必要である
が、この機構が真空保持に対して十分な性能を保有させ
ることが難しい、すなわち、この機構は常時運動を伴う
ような機構系となるために真空リークの可能性が増大す
る。仮に、第2図において、振動ミラ一部において真空
リークが生じた場合にはシンクロトロン放射光源へリー
クが伝わることになり、これは放射光源のダウンにつな
がり、ひいては全システムの長期的安定運転に対して大
きなダメージを与えることになる。The vibrating mirror shown in Figure 2 requires the mirror to be vibrated from outside the vacuum, and for this reason, a mechanism is required to connect the mirror drive mechanism outside the vacuum and the mirror inside the vacuum. It is difficult to maintain sufficient performance for vacuum maintenance; in other words, this mechanism is a mechanical system that constantly moves, increasing the possibility of vacuum leaks. In Fig. 2, if a vacuum leak were to occur in a part of the vibrating mirror, the leak would be transmitted to the synchrotron radiation source, which would lead to the synchrotron radiation source going down, and ultimately affect the long-term stable operation of the entire system. It will cause great damage to you.
本発明の目的は、このような従来の問題点を除去せしめ
て、ビームラインの真空リークに対して対処可能で、長
期的に安定運転を保証するX線露光装置を提供すること
にある。SUMMARY OF THE INVENTION An object of the present invention is to provide an X-ray exposure apparatus that eliminates such conventional problems, can deal with vacuum leaks in a beam line, and guarantees stable operation over a long period of time.
本発明は、シンクロトロン放射光源と、振動ミラー、衝
撃波遅延管及び放射光取出し窓を主構成要素とするビー
ムラインと、X線マスク及びウェハーを設置した露光部
を有するX線露光装置において、前記振動ミラーの上流
側に、高速しゃ断バルブと衝撃波遅延管とを設置したこ
とを特徴とするX線露光装置である。The present invention provides an X-ray exposure apparatus having a synchrotron radiation light source, a beam line whose main components are a vibrating mirror, a shock wave delay tube, and a synchrotron radiation extraction window, and an exposure section in which an X-ray mask and a wafer are installed. This X-ray exposure apparatus is characterized in that a high-speed cutoff valve and a shock wave delay tube are installed upstream of a vibrating mirror.
以下本発明の実施例について1図面を参照しながら説明
する。Embodiments of the present invention will be described below with reference to one drawing.
第1図に本発明の実施例を示す1本発明によるX線露光
装置は以下の主構成要素からなる。すなわち、ビームラ
イン7に沿って高速しゃ断バルブ8、衝撃波遅延管4、
振動ミラー3、放射光取出し用Be窓5及びX線マスク
9と露光部6とを順に設置したものである。10は露光
ウェハーを示している。放射光1は高速しゃ断バルブ8
の上流側から導入される。高速しゃ断バルブ8は、数+
rssec以下の短い時間でしゃ断できる性能を有して
おり。FIG. 1 shows an embodiment of the present invention. An X-ray exposure apparatus according to the present invention includes the following main components. That is, along the beam line 7 there is a high speed cutoff valve 8, a shock wave delay tube 4,
A vibrating mirror 3, a Be window 5 for extracting radiation, an X-ray mask 9, and an exposure section 6 are installed in this order. 10 indicates an exposed wafer. Synchrotron radiation 1 is a high-speed cutoff valve 8
It is introduced from the upstream side. The high-speed cutoff valve 8 has a number +
It has the ability to shut down in a short time less than rssec.
真空リークの信号が伝わると数十■see以下でバルブ
を閉として、より上流の真空悪化を防止することができ
る。第1図において本発明は振動ミラー3の上流側に衝
撃波遅延管4を、さらにその上流に高速しゃ断バルブ8
を設置した構成が重要である。本発明では、振動ミラー
3において真空リークが生じた場合、リークした空気が
衝撃波遅延管4まで伝わり、この管4の中をリークした
空気がより上流に向けて流入してゆくが、その速度が遅
くなる間に、高速しゃ断バルブ8を閉とすればより上流
の超高真空系へのリークによるダメージを防ぐことがで
きる。放射光取出し用Bs窓9の破損による真空リーク
の場合にも同様な効果を得ることができる。When a vacuum leak signal is transmitted, the valve is closed within several tens of inches, thereby preventing deterioration of the vacuum further upstream. In FIG. 1, the present invention includes a shock wave delay tube 4 upstream of the vibrating mirror 3, and a high speed cutoff valve 8 further upstream thereof.
It is important to have a configuration in which In the present invention, when a vacuum leak occurs in the vibrating mirror 3, the leaked air is transmitted to the shock wave delay tube 4, and inside this tube 4, the leaked air flows further upstream, but the speed is If the high-speed cutoff valve 8 is closed during the delay, damage caused by leakage to the ultra-high vacuum system further upstream can be prevented. A similar effect can be obtained in the case of a vacuum leak due to damage to the Bs window 9 for extracting radiation.
また、高速しゃ断バルブ8 +、 J 撃波遅延管4及
び振動ミラー3は、シンクロトロン放射線源を用いたX
線露光装置にとって重要な構成要素であることは述べた
通りであるが、これらをビームライン7の上流側に設装
置することによって、振動ミラー3より下流側のビーム
ラインの構成は設計上自由度が大きくなる。すなわち、
露光部6までの距離設定、ビームライン(振動ミラーよ
り下流)の傾き角度設定、また他の重要構成要素(例え
ば差動排気系)の設置等が容易にできるようになる。傾
き角度の意味は、ミラーにて反射された放射光が傾きを
有してくるため、露光部6に至るビームラインを傾ける
必要があるということである。In addition, the high-speed cutoff valve 8 +, the J shock wave delay tube 4, and the vibrating mirror 3 are
As mentioned above, they are important components for the line exposure system, but by installing these on the upstream side of the beam line 7, the configuration of the beam line downstream of the vibrating mirror 3 can be designed with greater flexibility. becomes larger. That is,
It becomes possible to easily set the distance to the exposure section 6, set the inclination angle of the beam line (downstream of the vibrating mirror), and install other important components (for example, a differential pumping system). The meaning of the tilt angle is that since the radiation reflected by the mirror has a tilt, it is necessary to tilt the beam line leading to the exposure section 6.
以上説明したように本発明によれば、シンクロトロン放
射光を通過させて露光部に導くビームラインの長期安定
稼動及び信頼性を向上し、シンクロトロン放射光を用い
たX線露光装置の実用化に大きく寄与できる効果を有す
る。As explained above, according to the present invention, it is possible to improve the long-term stable operation and reliability of a beam line that passes synchrotron radiation light and guide it to the exposure section, and to put an X-ray exposure apparatus using synchrotron radiation light into practical use. It has an effect that can greatly contribute to
第1図は本発明の一実施例を示すビームライン構成図、
第2図は従来の代表的ビームライン構成図である。FIG. 1 is a beamline configuration diagram showing an embodiment of the present invention;
FIG. 2 is a typical conventional beam line configuration diagram.
Claims (1)
遅延管及び放射光取出し窓を主構成要素とするビームラ
インと、X線マスク及びウェハーを設置した露光部とを
有するX線露光装置において、前記振動ミラーの上流側
に、高速しゃ断バルブと衝撃波遅延管とを設置したこと
を特徴とするX線露光装置。(1) An X-ray exposure apparatus having a synchrotron radiation light source, a beam line whose main components include a vibrating mirror, a shock wave delay tube, and a synchrotron radiation extraction window, and an exposure section in which an X-ray mask and a wafer are installed; An X-ray exposure device characterized in that a high-speed cutoff valve and a shock wave delay tube are installed upstream of a vibrating mirror.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61154389A JPS639929A (en) | 1986-06-30 | 1986-06-30 | X-ray exposure device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61154389A JPS639929A (en) | 1986-06-30 | 1986-06-30 | X-ray exposure device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS639929A true JPS639929A (en) | 1988-01-16 |
| JPH058853B2 JPH058853B2 (en) | 1993-02-03 |
Family
ID=15583067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61154389A Granted JPS639929A (en) | 1986-06-30 | 1986-06-30 | X-ray exposure device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS639929A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0268919A (en) * | 1988-09-05 | 1990-03-08 | Canon Inc | Sor exposure system |
-
1986
- 1986-06-30 JP JP61154389A patent/JPS639929A/en active Granted
Non-Patent Citations (2)
| Title |
|---|
| PROCEEDING OF SPIE-THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING=S58 * |
| REVIEW OF SCIENTIFIC INSTRUMENTS=1976 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0268919A (en) * | 1988-09-05 | 1990-03-08 | Canon Inc | Sor exposure system |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH058853B2 (en) | 1993-02-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2984907B1 (en) | Debris protection system for reflective optic utilizing gas flow | |
| TW533336B (en) | Lithographic device | |
| EP0174877A2 (en) | X-ray application system | |
| EP1127294B1 (en) | Apparatus for extreme UV lithography comprising a wafer chamber and gas curtain | |
| US4119855A (en) | Non vacuum soft x-ray lithographic source | |
| TW200402086A (en) | Lithographic apparatus and device manufacturing method | |
| US8988652B2 (en) | Method and apparatus for ultraviolet (UV) patterning with reduced outgassing | |
| JPS639929A (en) | X-ray exposure device | |
| US6844561B1 (en) | Rotating aperture system | |
| US5581590A (en) | SOR exposure system and method of manufacturing semiconductor devices using same | |
| Silverman et al. | Performance of a wide‐field flux delivery system for synchrotron x‐ray lithography | |
| JP3118933B2 (en) | X-ray exposure equipment | |
| JP3070085B2 (en) | Light extraction line of SOR optical device | |
| JPS60226122A (en) | Light reflector and exposure device | |
| JP3090708B2 (en) | Synchrotron radiation light irradiation device and X-ray exposure device | |
| JPH04264399A (en) | Shielding wall structure of sor light supply part | |
| JP2584490Y2 (en) | Window device for SOR light emission in synchrotron | |
| JPH0630336B2 (en) | Charged particle device | |
| Von Holtey et al. | A mini beam pipe at the DELPHI interaction region | |
| Silverman et al. | X-ray lithography beamlines in the IBM Advanced Lithography Facility | |
| JP3962505B2 (en) | Synchrotron beam line acoustic delay device | |
| JPH04133400U (en) | Radiation shielding structure for beam channel penetration part | |
| JPH04282500A (en) | Window device for SOR light emission in SOR optical device | |
| Oertel et al. | Exposure instrumentation for the application of x‐ray lithography using synchrotron radiation | |
| JPH034200A (en) | Radiant light exposure device |