JPS639942B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a polishing machine for polishing spherical or flat surfaces used for processing lenses and the like.

Conventionally, a polishing machine having the structure shown in FIG. 1 has been widely used. In this surface polishing machine 10, a rotary plate 12 is driven to rotate around a vertical axis 14. The rotating plate 16 is provided above the rotating plate 14, and its central portion is supported by a shaft 20 via a ball joint 18, and is driven to reciprocate horizontally while applying a downward force. Further, a polishing plate 22 containing an abrasive is formed on the surface of the rotary plate 12, and a workpiece mounting portion 24 is formed on the surface of the rotary moving plate 16.

A workpiece 26 is attached to this workpiece attachment part 24,
When the rotating plate 12 is rotated and driven while applying a downward force to the shaft 20 to move the rotating plate 16 horizontally, the rotating plate 16 moves while rotating in accordance with the rotation of the rotating plate 12. , the surface of the workpiece 26 is polished flat.

At this time, due to the frictional force against the horizontal movement of the shaft 20, a moment acts on the rotary moving plate 16 to raise the ball joint 18 around the lower front end of the lower surface of the workpiece 26. That is, when the shaft 20 is moved to the left in FIG.
A moment is generated that rotates the rotary moving plate 16 counterclockwise around the lower left end point P of 6. The magnitude of this moment is proportional to the cosine of the angle θ between the line connecting the ball joint 18 and the point P and the perpendicular line to the polishing plate 22.

Therefore, a small workpiece 26' as shown in FIG. 2 or a thick workpiece 2 as shown in FIG.
When machining 6", the angle θ becomes smaller, the moment applied to the rotating plate 16 increases, the rotating plate 16 lifts or vibrates, and the polishing accuracy decreases, and the angle θ becomes smaller than the workpiece. When the friction angle between the polishing plate and the polishing plate becomes smaller than that, the rotationally movable plate 16 is completely lifted and polishing becomes impossible.

On the other hand, in the past, many small workpieces 26' were polished at the same time as shown in FIG. 4, and thick workpieces 26'' were polished together with the polishing plate as shown in FIG. exchange the position of
The rotating plate is provided with a workpiece attachment part, and the rotating plate is provided with a polishing plate to increase the angle θ. However, in the former case, it is inconvenient to handle the processed product, and in the latter case,
The relative speed between the polishing plate and the workpiece decreases, resulting in a significant decrease in polishing efficiency.

The object of the present invention is to improve these disadvantages and provide a polishing machine that can consistently perform high-precision polishing at high speed and with ease of handling, regardless of the shape of the workpiece.

In other words, the present invention does not attach the rotationally movable plate directly to the shaft, but instead interposes a holder, and connects the connecting member attached to the holder to the periphery of the rotationally movable plate and a position near the rotary plate. The rotationally movable plate is made tiltable.
Of course, the rotary movable plate is made of a rigid body that can tilt together with the machining surface, and the machining area is positioned at the center of this rotary movable plate.

For this reason, the processing part receives a force for movement from the side, and the moment generated in the rotationally moving plate by this reaction force increases the angle θ, so that floating and vibration are prevented.

Next, a surface polishing machine 30, which is an embodiment of the present invention, shown in FIGS. 6 and 7 will be described. The rotating plate 32 is driven to rotate about a vertical axis 34. The rotating plate 36 is provided above the rotating plate 34 and is made of a rigid body such as metal, and ball joints 38, 38, 38 are provided at a low position near the rotating plate 34 on the outer periphery, and are attached to the holder 40 here. Pin-shaped coupling members 42, 42, 42 are coupled together.
This coupling member 42 is slidably inserted into a hole 44 of the holder 40 and is pushed down by a spring 46. Therefore, the rotationally movable plate 36 receives a downward force, and at the same time can be tilted at a slight angle with respect to the holder 40 by vertical movement and slight bending deformation of each coupling member 42. The holder 40 is coupled to a shaft 50 via a bearing 48 and is driven to move horizontally. A polishing plate 52 having an abrasive is formed on the surface of the rotating plate 32, and the rotating plate 36
The lower surface of the center is recessed and serves as a workpiece attachment part 54.

When a thick workpiece 56 is attached to this workpiece attachment part 54 and the rotary plate 32 is rotated to reciprocate the shaft 50 in the horizontal direction, the rotary moving plate 36 is attached to the rotary plate 32.
The workpiece 56 moves while rotating in accordance with the rotation of the workpiece 56.
The surface is polished to a flat surface.

In this polishing machine 30, when the rotary moving plate 36 moves horizontally, the ball joint 38 is located at the periphery of the workpiece 56, so the line connecting the front lower end of the workpiece 56 and the rear ball joint 38 and the polishing plate The angle θ with respect to the vertical is sufficiently large, so that the rotationally movable plate 36, that is, the workpiece 56, does not float or vibrate, and highly accurate polishing can be performed. Although this figure shows a case where a thick workpiece 56 is polished using a rotationally movable plate with a concave central part, it is also possible to polish a small workpiece or a normal flat workpiece using a flat rotary plate. It is clear that the above effects remain the same.

In this embodiment, the rotationally movable plate 36 is connected to the spring 4.
Although the connecting member 42 is elastically pressed by the holder 40, other means such as an air cylinder may be used. Also, if the slope required for the rotationally moving plate is small, the connecting member 42 is fixed to the holder 40, and the connecting member itself is pressed. It is also possible to incline only by deformation.

Furthermore, in this polishing machine, since the holder 40 is not inclined with respect to the shaft 50, it is possible to easily rotate the holder, and in this way, the polishing work can be performed even faster than in the above example, and the polishing can be performed even faster than in the above example. Since the machining speed does not change even if the positions of the plate and workpiece mounting portion are exchanged, any position of the polishing plate can be selected depending on the handling condition.

In this embodiment, the distance of the coupling member 42 from the axis 50 is fixed, but if it is made expandable and retractable, a wider range of workpieces can be handled.

Although the above polishing machine is a flat surface polishing machine, it goes without saying that the above matters can also be applied to a spherical polishing machine as is.

As described above, the polishing machine of the present invention has a configuration in which the rotating plate is tiltably supported around the processing area and near the rotating plate, so no matter what shape the workpiece is, vibrations etc. can be avoided. It is possible to achieve smooth and highly accurate polishing without any problems.

[Brief explanation of the drawing]

Figure 1 is a front sectional view showing a conventional polishing machine, Figure 2 is a front sectional view showing a case where the same machine is used to polish a small workpiece, and Figure 3 is a front sectional view when the same machine is used to polish a thick workpiece. Figure 4 is a front cross-sectional view showing a case in which the same machine is used to polish a small workpiece without vibration, and Figure 5 is a front cross-sectional view showing the case in which the same machine is used to polish a thick workpiece without vibration. FIG. FIG. 6 is a front half-sectional view of an embodiment of the present invention, and FIG. 7 is a plan view thereof. 30... Surface polisher, 32... Rotating plate, 36...
... Rotating plate, 38 ... Ball joint, 40 ... Holder, 42 ... Connection member, 46 ... Spring, 48 ...
Bearing, 50... Shaft, 52... Polishing plate, 54
... Workpiece attachment part, 56 ... Workpiece.

Claims (1)

[Claims] 1. A rotating plate, and a rotating plate that is pressed against the rotating plate, moves along the rotating plate, and rotates, and one of these plates is provided with a polishing plate and the other is processed. In a polishing machine having an object attachment part, the rotary movable plate is formed of a rigid body that tilts together with the processing surface, and a holder that is attached to a shaft that supports the rotary movable plate and rotates is provided, and the rotary movable plate is attached to this holder. A connecting member is provided that elastically presses a position closer to the rotary plate in the periphery than the processing part so as to be tiltable around this position, and a moving force is applied from the side of the processing part, A polishing machine characterized by reducing the moment generated in a rotating moving plate due to polishing friction force against movement.