JPS6410696A - Apparatus for removing flat-lead-type component - Google Patents

Apparatus for removing flat-lead-type component

Info

Publication number
JPS6410696A
JPS6410696A JP16634687A JP16634687A JPS6410696A JP S6410696 A JPS6410696 A JP S6410696A JP 16634687 A JP16634687 A JP 16634687A JP 16634687 A JP16634687 A JP 16634687A JP S6410696 A JPS6410696 A JP S6410696A
Authority
JP
Japan
Prior art keywords
heating
medium
solder
lead
packaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16634687A
Other languages
Japanese (ja)
Inventor
Yasutsugu Nagase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16634687A priority Critical patent/JPS6410696A/en
Publication of JPS6410696A publication Critical patent/JPS6410696A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To enable a flat-lead-type component to be removed from a printed board safely and properly, by covering a solder part with a liquid heating medi um having a boiling point somewhat higher than the melting point of a packag ing solder and heating the heating medium for melting the packaging solder indirectly. CONSTITUTION:A medium applying mechanism 15 is first operated by a com mand of a control section 20 and applies a heating medium 5 so as to cover a packaging solder 6 joining a flat lead 2 to a circuit pattern 11. When the packaging solder 6 is totally covered with the heating medium 5, supply of the heating medium is stopped. The, the heating surface 16c of a medium heating section 16 is brought into contact with the heating medium 5 by a command of the control section 20. The heat generating body 16b of the medium heating section 16 is thus energized and increases a temperature of the heating body 16a to about 200 deg.C. Consequently, the temperature of the heating medium 5 is increased and the packaging solder 6 is molten, by which the medium heating section 16 is retracted. Then, a flat-lead-type component 1 is removed from a printed board 10. In this manner, thermal damages to the printed board or packaging components are prevented effectively.
JP16634687A 1987-07-02 1987-07-02 Apparatus for removing flat-lead-type component Pending JPS6410696A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16634687A JPS6410696A (en) 1987-07-02 1987-07-02 Apparatus for removing flat-lead-type component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16634687A JPS6410696A (en) 1987-07-02 1987-07-02 Apparatus for removing flat-lead-type component

Publications (1)

Publication Number Publication Date
JPS6410696A true JPS6410696A (en) 1989-01-13

Family

ID=15829675

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16634687A Pending JPS6410696A (en) 1987-07-02 1987-07-02 Apparatus for removing flat-lead-type component

Country Status (1)

Country Link
JP (1) JPS6410696A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102489817A (en) * 2011-12-02 2012-06-13 友达光电（苏州）有限公司 Heating device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102489817A (en) * 2011-12-02 2012-06-13 友达光电（苏州）有限公司 Heating device

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