JPS6418568A - Device and method for automatic soldering - Google Patents

Device and method for automatic soldering

Info

Publication number
JPS6418568A
JPS6418568A JP17420987A JP17420987A JPS6418568A JP S6418568 A JPS6418568 A JP S6418568A JP 17420987 A JP17420987 A JP 17420987A JP 17420987 A JP17420987 A JP 17420987A JP S6418568 A JPS6418568 A JP S6418568A
Authority
JP
Japan
Prior art keywords
solder
molten solder
nozzle
level
inner container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17420987A
Other languages
Japanese (ja)
Other versions
JP2578602B2 (en
Inventor
Kenji Izawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Kumagaya Seimitsu Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Kumagaya Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd, Kumagaya Seimitsu Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP17420987A priority Critical patent/JP2578602B2/en
Publication of JPS6418568A publication Critical patent/JPS6418568A/en
Application granted granted Critical
Publication of JP2578602B2 publication Critical patent/JP2578602B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To suitably and automatically solder an electronic component and a circuit board by superposing a heat resistant mask projecting a nozzle on a solder tank, pressurizing a molten solder to form a semi-spherical liquid level at the nozzle tip and executing soldering thereby. CONSTITUTION:A molten solder 13 is stored in a solder tank 11, which is heated at about 400-450 deg.C by a heating means. Inside this solder tank 11 the cylindrical inner container 15 releasing the upper side is arranged and communicated with the solder tank 11 so as to store the molten solder 13 in the inner container 15 as well. The upper end of the inner container 15 is projected more than the level of the molten solder 13 and the heat resistant mask 19 having the plural nozzles 17 projecting upwards is superposed at the tip thereof. Then when a fan 21 is rotated by a motor 23, the level of the molten solder 13 is ascended with a pressure being exerted on the molten solder 13 to cause the semi-spherical level 25 of the molten solder 13 at the tip of the nozzle 17. When the connection pattern 29 of a circuit board 27 is superposed at small interval on the nozzle 17 in this state, the lead wire 33 of a coil 35 is automatically soldered to the connection pattern 29.
JP17420987A 1987-07-13 1987-07-13 Automatic soldering device and automatic soldering method Expired - Fee Related JP2578602B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17420987A JP2578602B2 (en) 1987-07-13 1987-07-13 Automatic soldering device and automatic soldering method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17420987A JP2578602B2 (en) 1987-07-13 1987-07-13 Automatic soldering device and automatic soldering method

Publications (2)

Publication Number Publication Date
JPS6418568A true JPS6418568A (en) 1989-01-23
JP2578602B2 JP2578602B2 (en) 1997-02-05

Family

ID=15974632

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17420987A Expired - Fee Related JP2578602B2 (en) 1987-07-13 1987-07-13 Automatic soldering device and automatic soldering method

Country Status (1)

Country Link
JP (1) JP2578602B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19601055A1 (en) * 1996-01-02 1997-07-03 Volker Hoehns Soldering area elements
WO2006100899A1 (en) * 2005-03-18 2006-09-28 Senju Metal Industry Co., Ltd Jet solder vessel

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4395631B2 (en) 2002-09-12 2010-01-13 テイ・エス テック株式会社 Set jig for welding work of seat back frame
GB2483265B (en) * 2010-09-01 2018-03-28 Pillarhouse Int Ltd Soldering nozzle

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19601055A1 (en) * 1996-01-02 1997-07-03 Volker Hoehns Soldering area elements
DE19601055B4 (en) * 1996-01-02 2004-09-09 Volker Höhns Method and device for soldering surfaces
WO2006100899A1 (en) * 2005-03-18 2006-09-28 Senju Metal Industry Co., Ltd Jet solder vessel
US7988030B2 (en) 2005-03-18 2011-08-02 Senju Metal Industry Co., Ltd. Wave soldering bath

Also Published As

Publication number Publication date
JP2578602B2 (en) 1997-02-05

Similar Documents

Publication Publication Date Title
CA2125040A1 (en) A Process and an Apparatus for Wave Soldering
JPS6418568A (en) Device and method for automatic soldering
US5542596A (en) Vapor phase soldering machine having a tertiary cooling vapor
JPS5554265A (en) Reflow soldering method
WO1988007317A1 (en) Solder paste replacement method and article
JPS5884673A (en) Soldering method
JP2550144B2 (en) Mounted parts attaching / detaching device
JPS566459A (en) Removing method of component carried on printed board
JPS6021177A (en) Soldering device
JPS56158270A (en) Soldering method and soldering iron
JPS5736065A (en) Soldering method
JP2551053B2 (en) Film for supplying solder and method for manufacturing the same
JPS5516734A (en) Automatic solder feeding method and apparatus
KR200419552Y1 (en) Dipping Machine with Spray Gun
JPS5480255A (en) Soldering method
JPS57100867A (en) Method and device for soldering
JPS5884672A (en) Soldering method
JPS6343193B2 (en)
Coffman et al. Device for Desoldering/Soldering
JPS6231839B2 (en)
Iwasa et al. A Method and Apparatus for Automatic Soldering(of Printed Circuit Boards)
JPS6410696A (en) Apparatus for removing flat-lead-type component
Schouten Wave soldering of SMDs—A smart approach from science to practice
JPS6258822B2 (en)
JPS61232650A (en) Soldering method and device thereof

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees